Passive thermal diode

Patent metadata

Field	Value
Publication number	US-10365049-B2
Application number	US-201615744101-A
Country	US
Kind code	B2
Filing date	Jul 14, 2016
Priority date	Jul 14, 2015
Publication date	Jul 30, 2019
Grant date	Jul 30, 2019

Abstract

A passive thermal diode (10), comprising: a heat source (12); a heat sink (14); a thermal coupling element (16) removably coupled to the heat source (12) and the heat sink (14); a lever (18), the lever (18) connected to the thermal coupling element (16) via a pivot point (19); and at least one spring (20) connected to the lever (18), the spring (20) comprised of a shape memory alloy, wherein the lever (18) transmits a force to displace the thermal coupling element (16) when the force is produced by the spring (20) on the lever (18).

First claim

What is claimed is:

1. A passive thermal diode, comprising:
a heat source;
a heat sink;
a thermal coupling element removably coupled to the heat source and heat sink;
a lever, the lever connected to the thermal coupling element via a pivot point; and
at least one spring connected to the lever, the spring comprised of a shape memory alloy, wherein
the lever transmits a force to displace the thermal coupling element when the force is produced by the spring on the lever.

2. The passive thermal diode of claim 1 , further comprising a cover system, comprising:
at least two cover elements;
at least two driving pins;
a connecting rod; and
a plate, wherein the force transmitted through the lever is applied to the plate via the connecting rod, and displaces the at least two cover elements through the at least two driving pins.

3. The passive thermal diode of claim 2 , wherein the at least two cover elements comprise a material having a thermal conductivity of less than 0.5 W/(mK).

4. The passive thermal diode of claim 2 , further comprising a pistol assembly, comprising:
a base plate; and
a pistol rod, wherein the pistol rod links the lever to the base plate, and the base plate is linked to the at least one spring.

5. The passive thermal diode of claim 4 , wherein the pistol assembly moves in a direction running along the center axis of the pistol rod that is parallel and opposite to a second direction, the second direction being the direction of the thermal coupling element when the force is produced by the at least one spring.

6. The passive thermal diode of claim 4 , further comprising a bias spring placed surrounding the pistol rod and placed between the lever and the base plate.

7. The passive thermal diode of claim 6 , wherein the bias spring produces a force that is less than 50% of a force produced by the at least one spring.

8. The passive thermal diode of claim 6 , further comprising:
a thermally conductive paste provided on at least three portions of the passive thermal diode, the first portion located on a surface of the heat source; the second portion located on a surface of the heat sink; the third portion located on a surface of the thermal coupling element, wherein the first surface and second surface are located parallel and opposite to the third surface.

9. The passive thermal diode of claim 1 , wherein the diode has a diodicity of 93.24±23.01.

10. A passive thermal diode for controlling heat transfer, comprising:
a heat source including a first surface;
a heat sink including a second surface;
a thermal coupling element that removably contacts the first and second surface, the thermal coupling element having a third surface;
a lever having a first and second end,
the first end connected to the thermal coupling element, and
the second end connected to a pistol assembly; and
at least one spring comprised of a shape memory alloy connected to the pistol assembly, wherein
the at least one spring is configured to displace the pistol assembly in a first direction running along the center axis of the pistol assembly at a predetermined temperature.

11. The passive thermal diode of claim 10 , further comprising a cover system, comprising:
at least two cover element;
at least two driving pin;
a connecting rod; and
a plate, wherein when the pistol rod is displaced in a first direction the plate is displaced in an opposite direction.

12. The passive thermal diode of claim 11 , wherein the at least two cover elements comprise a material having a thermal conductivity of less than 0.5 W/(mK).

13. The passive thermal diode of claim 11 , further comprising a bias spring placed surrounding the pistol rod and placed between the lever and the base plate.

14. The passive thermal diode of claim 13 , wherein the bias spring produces a force that is less than 50% of a force produced by the at least one spring.

15. The passive thermal diode of claim 13 , further comprising a thermally conductive paste provided on at least three portions, the first portion located on the first surface; the second portion located on the second surface; the third portion located on the third surface; wherein the first surface and second surface are located parallel and opposite to the third surface.

16. The passive thermal diode of claim 10 , wherein the diode has a diodicity of 93.24±23.01.

17. A method for operating a passive thermal diode, comprising:
providing a heat source;
providing a heat sink;
providing a thermal coupling element removably coupled to the heat source and heat sink;
placing a lever, the lever connected to the thermal coupling element via a pivot point; and
placing at least one spring connected to the lever via a pistol assembly, the spring comprised of a shape memory alloy operating to displace the pistol assembly in a first direction running along the center axis of the pistol assembly at a predetermined temperature.

18. The method of claim 17 , further comprising providing a cover system, comprising:
providing at least two cover elements;
providing at least two driving pins;
providing a connecting rod; and
providing a plate, wherein when the pistol rod is displaced in a first direction the plate is displaced in an opposite direction.
the force transmitted through the lever is applied to the plate via the connecting rod, and displaces the at least two cover elements through the at least two driving pins.

19. The method of claim 18 , wherein the at least two cover elements comprise a material having a thermal conductivity less than 0.5 W/(mK).

20. The method of claim 18 , further comprising providing a bias spring placed surrounding the pistol rod and placed between the lever and the base plate.

21. The method of claim 20 , wherein the bias spring produces a force that is less than 50% of a force produced by the at least one spring.

22. The method of claim 20 , further comprising providing a thermally conductive paste on at least three portions, the first portion located on a surface of the heat source; the second portion located on a surface of the heat sink; the third portion located on a surface of the thermal coupling element; wherein the first surface and second surface are located parallel and opposite to the third surface.

Assignees

• Univ Hong Kong Sci & Tech

Inventors

• Tso Chi Yan
• Chao Christopher Yu Hang

Classifications

• F28F2013/008

  Variable conductance materials; Thermal switches · CPC title

• F28F27/00

  Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus (control arrangements in general G05) · CPC title

• F28F2255/04

  comprising shape memory alloys or bimetallic elements · CPC title

• F28F13/00 Primary

  Arrangements for modifying heat-transfer, e.g. increasing, decreasing (F28F1/00 - F28F11/00 take precedence) · CPC title