Heat dissipation using airflow diversion with cooling fins

Patent metadata

Field	Value
Publication number	US-11106256-B2
Application number	US-201816648595-A
Country	US
Kind code	B2
Filing date	Jan 12, 2018
Priority date	Jan 12, 2018
Publication date	Aug 31, 2021
Grant date	Aug 31, 2021

Abstract

Embodiments described herein may include apparatuses, systems and/or processes to provide cooling to a heat source. In embodiments, a first set of cooling fins are thermally coupled to a heat source in a first orientation to allow first airflow to pass through in between the first set of cooling fins to dissipate heat from the heat source. A second set of cooling fins thermally coupled to the heat source in a second orientation to allow second airflow to pass through in between the second set of cooling fins to dissipate heat from the heat source. A barrier may be coupled to the second set of cooling fins to substantially divert the second airflow away from the first airflow about to pass through in between the first set of cooling fins so that pre-heated air does not flow over the first set of cooling fins.

First claim

What is claimed is:

1. An apparatus for cooling, comprising:
a first set of cooling fins thermally coupled to a heat source to allow a first airflow to pass through in between the first set of cooling fins to dissipate heat from the heat source;
a second set of cooling fins thermally coupled to the heat source to allow a second airflow to pass through in between the second set of cooling fins to dissipate heat from the heat source, wherein the first and second set of cooling fins are substantially adjacent to each other and disposed in a common plane;
a wall coupled to the second set of cooling fins, wherein the wall is positioned between the first set of cooling fins and the second set of cooling fins to separate an airflow into the first airflow flowing over the first set of cooling fins and the second airflow flowing over the second set of cooling fins, wherein the first airflow and the second airflow are separate and distinct airflows, and wherein the second set of cooling fins extend substantially perpendicularly from the wall.

2. The apparatus of claim 1 , further comprising a barrier coupled with at least a portion of a top of the first set of cooling fins and extending beyond the top of the first set of cooling fins to facilitate the first airflow passing through the first set of cooling fins.

3. The apparatus of claim 1 , wherein the second set of cooling fins is thermally coupled to the heat source by one or more heat pipes.

4. The apparatus of claim 1 , wherein the wall coupled to the second set of cooling fins is further to divert the second airflow into an air duct.

5. The apparatus of claim 1 , further comprising:
a third set of cooling fins thermally coupled to the heat source to allow a third airflow to pass through in between the third set of cooling fins to dissipate heat from the heat source;
a second wall coupled to the third set of cooling fins, wherein the second wall is positioned between the third set of cooling fins and the first set of cooling fins to separate the third airflow from the second airflow, wherein the first airflow and the third airflow are separate and distinct airflows; and
wherein the first, second, and third sets of cooling fins are substantially disposed in a common plane.

6. The apparatus of claim 5 , wherein the first set of cooling fins is substantially orthogonal to the third set of cooling fins.

7. The apparatus of claim 1 , wherein the heat source is a PCIe card.

8. The apparatus of claim 7 , wherein the first orientation of cooling fins are perpendicular to the PCIe card and the second orientation of cooling fins are parallel to the PCIe card.

9. The apparatus of claim 7 , wherein the cooling fins include aluminum.

10. The apparatus of claim 1 , wherein an orientation of the first set of cooling fins is substantially orthogonal to the second set of cooling fins.

11. A method for cooling, comprising:
providing a first airflow path in between a first set of cooling fins thermally coupled to a heat source;
providing a second airflow path in between a second set of cooling fins thermally coupled to the heat source; and
diverting the second airflow path away from the first airflow path before the second airflow path passes in between the first set of cooling fins using a wall positioned between the first set of cooling fins and the second set of cooling fins to separate the first airflow and the second airflow, and wherein the second set of cooling fins extend substantially perpendicularly from the wall.

12. The method of claim 11 , wherein the first set of cooling fins are in a first orientation, and the second set of cooling fins are in a second orientation substantially orthogonal to the first orientation.

13. The method of claim 11 , wherein the second set of cooling fins is thermally coupled to the heat source by one or more heat pipes.

14. The method of claim 11 , wherein diverting the second airflow path further includes diverting the second airflow path into an air duct.

15. The method of claim 11 , further comprising a third airflow path in between a third set of cooling fins thermally coupled to the heat source; and
diverting the third airflow path away from the first airflow path using a second wall coupled to the third set of cooling fins, wherein the second wall is positioned between the third set of cooling fins and the first set of cooling fins to separate the third airflow from the first airflow before the third airflow path passes in between the first set of cooling fins.

16. An apparatus for cooling, comprising:
means for providing a first airflow path in between a first set of cooling fins thermally coupled to a heat source;
means for providing a second airflow path in between a second set of cooling fins thermally coupled to the heat source; and
means for diverting the second airflow path away from the first airflow path before the second airflow path passes in between the first set of cooling fins using a wall positioned between the first set of cooling fins and the second set of cooling fins to separate the first airflow and the second airflow, and wherein the second set of cooling fins extend substantially perpendicularly from the wall.

17. The apparatus of claim 16 , wherein the first set of cooling fins are in a first orientation, and the second set of cooling fins are in a second orientation substantially orthogonal to the first orientation.

18. The apparatus of claim 16 , wherein the second set of cooling fins is thermally coupled to the heat source by one or more heat pipes.

19. The apparatus of claim 16 , wherein means for diverting the second airflow path further includes means for diverting the second airflow path into an air duct.

20. The apparatus of claim 16 , further comprising a third airflow path in between a third set of cooling fins thermally coupled to the heat source; and
means for diverting the third airflow path away from the first airflow path before the third airflow path passes in between the first set of cooling fins using a second wall coupled to a third set of cooling fins, wherein the second wall is positioned between the third set of cooling fins and the first set of cooling fins to separate the third airflow from the second airflow.

21. The apparatus of claim 16 , wherein the heat source is a PCIe card.

22. The apparatus of claim 16 , wherein the cooling fins include aluminum.

23. A system for cooling, comprising:
a heat source on a printed circuit board (PCB); and
a cooling apparatus, comprising:
a first set of cooling fins thermally coupled to the heat source in a first orientation to allow first airflow to pass through in between the first set of cooling fins to dissipate heat from the heat source;
a second set of cooling fins thermally coupled to the heat source in a second orientation to allow a second airflow to pass through in between the second set of cooling fins to dissipate heat from the heat source, wherein the first and second set of cooling fins are substantially adjacent to each other and disposed in a common plane, and wherein the first and second orientations are substantially orthogonal; and
a wall coupled to the second set of cooling fins, wherein the wall is positioned between the first set of cooling fins and the second set of cooling fins to separate an airflow into the first airflow flowing over the first set of cooling fins and the second airflow flowing over the second set of cooling fins, and wherein the second set of coo

Assignees

• Intel Corp

Inventors

• Shu Tao
• Liu Chuansheng
• Chen Na
• Du Liguang

Classifications

• G06F1/20 Primary

  Cooling means · CPC title

• G06F2200/201

  Cooling arrangements using cooling fluid · CPC title

• H05K7/20336

  Heat pipes, e.g. wicks or capillary pumps · CPC title

• H05K7/20727

  within server blades for removing heat from heat source · CPC title

• F28D15/0275

  Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores · CPC title