Server and heat dissipating assembly thereof

Patent metadata

Field	Value
Publication number	US-9258929-B2
Application number	US-201314030701-A
Country	US
Kind code	B2
Filing date	Sep 18, 2013
Priority date	Aug 12, 2013
Publication date	Feb 9, 2016
Grant date	Feb 9, 2016

Abstract

A server and a heat dissipating assembly thereof includes an airflow generating device, a central processing unit, several memory slots, a first cooling fin set, a second cooling fin set and a heat conductive member. The airflow generating device generates an airflow flowing along an airflow direction and is located at a front side of the central processing unit. The several memory slots are used to plug of memories, and they are located at a lateral side of a central processing unit. The first cooling fin set is correspondingly located over the central processing unit and at a lateral side of the memory slots. The second cooling fin set is located at a front side of the memory slots and between the airflow generating device and the memory slots. The first cooling fin set is thermally connected with the second cooling fin set via the heat conductive member.

First claim

What is claimed is:

1. A server, comprising:
an airflow generating device for generating airflow to flow along an airflow direction;
a central processing unit;
several memory slots each used for plugging of a memory, wherein the airflow generating device is located at a front side of the central processing unit and the memory slots are located at a lateral side of the central processing unit; and
a heat dissipating assembly, comprising:
a first cooling fin set correspondingly located over the central processing unit and at a lateral side of the memory slots;
a second cooling fin set located at a front side of the memory slots and between the airflow generating device and the memory slots;
a heat conductive member, wherein the first cooling fin set is thermally connected with the second cooling fin set via the heat conductive member; and
a flow guiding member located between the first cooling fin set and the second cooling fin set for preventing the airflow passing between the second cooling fin set and the first cooling fin set,

wherein a part of heat generated by the central processing unit is transferred to the second cooling fin set via the heat conductive member and a part of the airflow passes through the second cooling fin set for taking the part of the heat away and further flows to the memory slots.

2. The server according to claim 1 , wherein the heat dissipating assembly further comprises a metal base which is integrally formed, the first cooling fin set and the second cooling fin set are securely located on the metal base.

3. The server according to claim 2 , wherein the metal base includes an extending groove, a main portion and an extension section, wherein the first cooling fin set is located on the main portion, and the second cooling fin set is located on the extension section, wherein the main portion is located between the first cooling fin set and the central processing unit, the extending groove extends from the main portion to the extension section, and the heat conductive member is securely located in the extending groove.

4. The server according to claim 3 , wherein the metal base further comprises a connecting section, wherein the main portion is connected with the extension section via the connecting section, the extending groove is formed in the main portion, the extension section and the connecting section and passes through the connecting section.

5. The server according to claim 4 , wherein the connecting section extends from the main portion to the extension section along a direction reverse to the airflow direction, and the extension section extends from the connecting section along a direction perpendicular to the airflow direction.

6. The server according to claim 4 , further comprising a motherboard, wherein the central processing unit is located on the motherboard, the metal base is securely located on the motherboard, the heat dissipating assembly further comprises a copper plate located in the main portion, wherein the copper plate is thermally connected to and located between the central processing unit and the heat conductive member.

7. The server according to claim 3 , wherein the metal base includes a first surface and a second surface which are opposite to each other, the first cooling fin set and the second cooling fin set are located on the first surface of the metal base, the second surface of the metal base faces toward the central processing unit, the first surface and the second surface form the extending groove therebetween.

8. The server according to claim 1 , wherein the heat conductive member is a heat pipe.

9. The server according to claim 1 , wherein both the first cooling fin set and the second fin set comprise a plurality of fins, the distance between the fins of the first cooling fin set is greater than the distance between the fins of the second cooling fin set.

10. A heat dissipating assembly, comprising:
a first cooling fin set;
a second cooling fin set;
a heat conductive member, wherein the first cooling fin set is thermally connected with the second cooling fin set via the heat conductive member; and
a flow guiding member, wherein the flow guiding member is located between the first cooling fin set and the second cooling fin set for preventing the airflow passing between the second cooling fin set and the first cooling fin set.

11. The heat dissipating assembly according to claim 10 , wherein the heat dissipating assembly further comprises a metal base which is integrally formed, the first cooling fin set and the second cooling fin set are securely located on the metal base.

12. The heat dissipating assembly according to claim 11 , wherein the metal base includes an extending groove, a main portion and an extension section, wherein the first cooling fin set is located on the main portion, and the second cooling fin set is located on the extension section, wherein the extending groove extends from the main portion to the extension section, and the heat conductive member is securely located in the extending groove.

13. The heat dissipating assembly according to claim 12 , wherein the metal base further comprises a connecting section, the main portion is connected with the extension section via the connecting section, the extending groove is formed in the main portion, the extension section and the connecting section and passes through the connecting section.

14. The heat dissipating assembly according to claim 13 , wherein the extensive direction is perpendicular to the connecting section.

15. The heat dissipating assembly according to claim 12 , further comprising a copper plate, wherein the copper plate is located in the main portion and the copper plate is thermally connected to the heat conductive member.

16. The heat dissipating assembly according to claim 12 , wherein the metal base includes a first surface and a second surface which are opposite to each other, the first cooling fin set and the second cooling fin set are located on the first surface of the metal base, and the first surface and the second surface form the extending groove therebetween.

17. The heat dissipating assembly according to claim 10 , wherein the heat conductive member is a heat pipe.

18. The heat dissipating assembly according to claim 10 , wherein both the first cooling fin set and the second fin set comprise a plurality of fins, the distance between the fins of the first cooling fin set is greater than the distance between the fins of the second cooling fin set.

Assignees

• Inventec Pudong Tech Corp
• Inventec Corp

Inventors

• Zhang Jin
• Zhao Liming

Classifications

• H05K7/20727 Primary

  within server blades for removing heat from heat source · CPC title