Circuit assembly

Patent metadata

Field	Value
Publication number	US-11104282-B2
Application number	US-201716081686-A
Country	US
Kind code	B2
Filing date	Mar 1, 2017
Priority date	Mar 10, 2016
Publication date	Aug 31, 2021
Grant date	Aug 31, 2021

Abstract

A circuit assembly where the circuit board includes a first surface and a second surface that is opposite to the first surface and on which a plurality of bus bars are routed, the inductor includes a main body and a terminal that is led out from the main body and has a shape that is bent toward the circuit board, and a leading end of the terminal is connected through a screwing member to a bus bar of the plurality of bus bars exposed from an opening provided on the circuit board, the screwing member is held in an insulating holder housed in a housing recess provided in the heat dissipation plate, and the heat dissipation plate is overlaid so as to transfer heat on the circuit board on the second surface of the circuit board.

First claim

The invention claimed is:

1. A circuit assembly comprising:
a circuit board;
a heat dissipation plate overlaid on the circuit board; and
an inductor, wherein:
the circuit board includes a first surface and a second surface that is opposite to the first surface and on which a plurality of bus bars are routed,
the inductor includes a main body and a terminal that is led out from the main body and has a shape that is bent toward the circuit board, and a leading end of the terminal is connected through a screwing member to a bus bar of the plurality of bus bars exposed from an opening provided on the circuit board,
the screwing member is held in an insulating holder housed in a housing recess provided in the heat dissipation plate, and
the heat dissipation plate is overlaid on the second surface of the circuit board so as to dissipate heat that is transferred to the second surface of the circuit board from the first surface of the circuit board.

2. The circuit assembly according to claim 1 , wherein
another opening is provided in a region of the circuit board corresponding to the main body, the another opening exposing the heat dissipation plate.

3. The circuit assembly according to claim 1 , wherein
the inductor is disposed on the first surface.

4. The circuit assembly according to claim 1 , wherein
a positioning protrusion that protrudes toward the circuit board is provided on the insulating holder, and a positioning hole is provided at a position on the circuit board that corresponds to the positioning protrusion.

5. The circuit assembly according to claim 1 , wherein
between the second surface of the circuit board and the heat dissipation plate, an insulating layer that covers a boundary between the insulating holder and the heat dissipation plate is provided at a region including the boundary.

Assignees

• Autonetworks Technologies Ltd
• Sumitomo Wiring Systems
• Sumitomo Electric Industries

Inventors

• Ota Takuya
• Yamane Shigeki
• Maeda Hirotoshi
• Tsuchida Toshiyuki
• Aichi Junya

Classifications

• H01F27/06 Primary

  Mounting, supporting or suspending transformers, reactors or choke coils {not being of the signal type} · CPC title

• H02G3/16

  structurally associated with support for line-connecting terminals within the box · CPC title

• H01F2027/065

  Mounting on printed circuit boards · CPC title

• H05K1/11

  Printed elements for providing electric connections to or between printed circuits · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title