Plating apparatus and plating method

Patent metadata

Field	Value
Publication number	US-11098413-B2
Application number	US-201816154226-A
Country	US
Kind code	B2
Filing date	Oct 8, 2018
Priority date	Oct 12, 2017
Publication date	Aug 24, 2021
Grant date	Aug 24, 2021

Abstract

To reduce fluctuation of the liquid level of plating solution caused by the operation of a paddle. A plating apparatus for plating a substrate is provided. The plating apparatus includes: a plating bath configured to store plating solution; a paddle that is arranged in the plating bath and configured to stir the plating solution; and a liquid level fluctuation reducing member that is arranged in the plating bath, has a flow path through which the plating solution passes, and is configured to increase a flow velocity of the plating solution passing through the flow path to attenuate energy of waves formed by the plating solution.

First claim

What is claimed is:

1. A plating apparatus for plating a substrate comprising:
a plating bath configured to store plating solution, the plating bath having a first side wall positioned on the substrate side, a second side wall facing the first side wall and positioned on an anode side when the substrate and the anode are accommodated to face each other, and a third side wall connecting the first sidewall and the second sidewall and a fourth side wall connecting the first side wall and the second side wall;
a paddle that is arranged in the plating bath and configured to stir the plating solution; and
a liquid level fluctuation reducing member that is arranged in the plating bath, has plural openings through which the plating solution passes to increase flow velocity of the plating solution to attenuate energy of waves formed by the plating solution, wherein
the liquid level fluctuation reducing member is arranged at a position facing a reciprocating direction of the paddle, and comprise a first portion having the plural openings, the first portion being apart from the third side wall and the fourth side wall of the plating bath, and forming a water retarding portion between the first portion and the plating bath, and
the liquid level fluctuation reducing member is located between the location of the substrate and the third side wall or the fourth side wall.

2. The plating apparatus according to claim 1 , wherein
the liquid level fluctuation reducing member is arranged between the paddle and the first side wall.

3. The plating apparatus according to claim 2 , wherein
the liquid level fluctuation reducing member is arranged on at least one of a third side wall side and a fourth side wall side of the substrate placed in the plating bath.

4. The plating apparatus according to claim 1 , wherein
the paddle is configured to linearly reciprocate substantially horizontally along a plating target surface of the substrate placed in the plating bath, and
a length in a vertical direction of the liquid level fluctuation reducing member is longer than a length in the vertical direction of a portion of the paddle which is immersed in the plating solution.

5. The plating apparatus according to claim 1 , wherein
the liquid level fluctuation reducing member is made of a net.

6. The plating apparatus according to claim 5 , wherein
the liquid level fluctuation reducing member has plurality of nets,
the liquid level fluctuation reducing member has a portion where the nets overlap so that the openings of the net are shifted from one another.

Assignees

• Ebara Corp

Inventors

• Chang Shao Hua
• Hirao Tomonori

Classifications

• C25D7/123

  Semiconductors first coated with a seed layer or a conductive layer · CPC title

• C25D21/10 Primary

  Agitating of electrolytes; Moving of racks · CPC title

• C25D17/008

  Current shielding devices · CPC title

• C25D21/12

  Process control or regulation (controlling or regulating in general G05) · CPC title

• C25D17/001 Primary

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title