Method for manufacturing a display motherboard

Patent metadata

Field	Value
Publication number	US-11094894-B2
Application number	US-201816212754-A
Country	US
Kind code	B2
Filing date	Dec 7, 2018
Priority date	Apr 24, 2018
Publication date	Aug 17, 2021
Grant date	Aug 17, 2021

Abstract

The present disclosure provides a display motherboard and a method for manufacturing the same, a display substrate and a method for manufacturing the same, and a display device, and belongs to the field of display technology. In the method for manufacturing the display motherboard of the present disclosure, the display motherboard includes a plurality of display substrate areas each including a sub display area and a sub bending area; and the method for manufacturing the display motherboard includes: forming an adhesive force variable back film material having a first adhesive force on a flexible underlying substrate; removing the back film material in positions above the sub bending areas; and treating the remaining back film material to form a back film having a second adhesive force, wherein the second adhesive force is greater than the first adhesive force.

First claim

The invention claimed is:

1. A method for manufacturing a display motherboard comprising the following steps, wherein the display motherboard comprises a plurality of display substrate areas each comprising a sub display area and a sub bending area:
forming a back film material having a first adhesive force on a flexible underlying substrate;
removing the back film material in positions above the sub bending areas of the plurality of display substrates; and
treating the remaining back film material to form a back film having a second adhesive force, wherein the second adhesive force is greater than the first adhesive force,
wherein the back film material comprises an adhesive force variable adhesive material;
the adhesive force variable adhesive material comprises an adhesive and an initiator; and
the adhesive comprises any one or more of epoxy resin and polyurethane resin and the initiator comprises any one or more of azobisisobutyronitrile, fluorescein, and eosin,
wherein the method further comprises:
between the step of removing the back film material in positions above the sub bending areas of the plurality of display substrates and the step of treating the remaining back film material to form a back film having a second adhesive force,
forming a protective film on one side of the back film material away from the flexible underlying substrate, the protective film covering openings of the back film material corresponding to the sub bending areas of the plurality of display substrates.

2. The method for manufacturing the display motherboard according to claim 1 , wherein the plurality of the display substrate areas are arranged in an array; the display motherboard comprises a bending area running through the sub bending areas located on the same column; and the step of removing the back film material in positions above the sub bending areas of the plurality of display substrates specifically comprises:
removing the back film material in position above the bending area so as to remove the back film material in positions above the sub bending areas.

3. The method for manufacturing the display motherboard according to claim 1 , wherein the step of treating the remaining back film material to form a back film having a second adhesive force comprises:
irradiating the remaining back film material with UV light to form the back film having the second adhesive force.

4. The method for manufacturing the display motherboard according to claim 3 , wherein UV illumination is performed on one side of the flexible underlying substrate having the back film material.

5. The method for manufacturing the display motherboard according to claim 3 , wherein the energy of the UV illumination is about 1000-5000 mJ/cm 2 and the illumination time is about 30-120 s.

6. The method for manufacturing the display motherboard according to claim 1 , wherein the step of treating the remaining back film material to form a back film having a second adhesive force comprises:
heating the remaining back film material to form the back film having the second adhesive force.

7. The method for manufacturing the display motherboard according to claim 6 , wherein heating is performed on one side of the flexible underlying substrate having the back film material.

8. The method for manufacturing the display motherboard according to claim 6 , wherein the heating temperature is about 60-80° C. and the heating time is about 2-20 min.

9. The method for manufacturing the display motherboard according to claim 1 , wherein the first adhesive force is about 20-400 g/inch.

10. The method for manufacturing the display motherboard according to claim 1 , wherein the second adhesive force is greater than 1 kg/inch.

11. The method for manufacturing the display motherboard according to claim 1 , wherein the sub bending area is located between the sub display area and a bonding area.

12. A method for manufacturing a display substrate, comprising the method for manufacturing the display motherboard according to claim 1 .

Assignees

• Boe Technology Group Co Ltd

Inventors

• Xie Chunyan
• Tsai Paoming
• Zhang Song

Classifications

• H10P72/0442 Primary

  Apparatus for placing on an insulating substrate, e.g. tape · CPC title

• H10P72/0436

  mainly by radiation · CPC title

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• B29C53/063

  combined with folding · CPC title

• G09F9/301

  flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED · CPC title