Micro LED display device and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-11094677-B2
Application number	US-201916677672-A
Country	US
Kind code	B2
Filing date	Nov 8, 2019
Priority date	Dec 5, 2018
Publication date	Aug 17, 2021
Grant date	Aug 17, 2021

Abstract

A micro LED display device including a display substrate, a plurality of conductive pad pairs and a plurality of micro light emitting elements is provided. The display substrate has a first arranging area, a splicing area connected to the first arranging area, and a second arranging area connected to the splicing area, wherein the splicing area is located between the first arranging area and the second arranging area. The conductive pad pairs are disposed on the display substrate in an array with the same pitch. The micro light emitting elements are disposed on the display substrate and are electrically bonded to the conductive pad pairs. A manufacturing method of the micro LED display device is also provided.

First claim

What is claimed is:

1. A micro LED display device, comprising:
a display substrate, having a first arranging area, a splicing area connected to the first arranging area, and a second arranging area connected to the splicing area, wherein the splicing area is located between the first arranging area and the second arranging area, and the splicing area has a plurality of first filling positions and a plurality of second filling positions, and the first filling positions and the second filling positions are arranged alternatively in an arranging direction;
a plurality of conductive pad pairs, disposed on the display substrate and distributed in the first arranging area, the splicing area and the second arranging area in an array in groups, wherein each of the first filling positions and each of the second filling positions in the splicing area are respectively configured with three conductive pad pairs; and
a plurality of micro light-emitting elements, disposed on the display substrate and respectively electrically bonded to the conductive pad pairs, wherein the micro light-emitting elements comprise a plurality of first color LEDs, a plurality of second color LEDs and a plurality of third color LEDs, each of the first filling positions and each of the second filling positions are respectively configured with one of the first color LEDs, one of the second color LEDs and one of the third color LEDs at the three conductive pad pairs, and the first color LEDs disposed in the first filling position and the second filling position have different offsets with respect to the conductive pad pairs bonded thereto.

2. The micro LED display device as claimed in claim 1 , wherein the first color LEDs disposed in the first filling positions and the first arranging area have the same offset with respect to the conductive pad pairs bonded thereto, and the first color LEDs disposed in the second filling positions and the second arranging area have the same offset with respect to the conductive pad pairs bonded thereto.

3. The micro LED display device as claimed in claim 1 , wherein an interval between the first color LED in one of the two adjacent first filling positions and the first color LED in the other one of the two adjacent first filling positions adjacent along the arranging direction in the splicing area is different to an interval between the first color LED in one of the first filling positions and the first color LED in the second filling position adjacent to the first filling position.

4. The micro LED display device as claimed in claim 1 , wherein an interval between two adjacent first color LEDs respectively in the first arranging area and the first filling position of the splicing area is different to an interval between two adjacent first color LEDs respectively in the first arranging area and the second filling position of the splicing area.

Assignees

• Playnitride Display Co Ltd

Inventors

• Sun sheng-yuan
• Liu Ying-Tsang
• Chen Yi-Ching
• Chen Pei-Hsin
• Shih Yi-Chun
• Lin Tzu-Yang
• Lai Yu-Hung

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10H29/142

  Two-dimensional arrangements, e.g. asymmetric LED layout · CPC title

• H10H29/14

  comprising multiple light-emitting semiconductor components · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H01L27/153

  Electricity · mapped topic