Doped metal-chalcogenide thin film and method of manufacturing the same

US11094558B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11094558-B2
Application numberUS-201916681057-A
CountryUS
Kind codeB2
Filing dateNov 12, 2019
Priority dateNov 14, 2018
Publication dateAug 17, 2021
Grant dateAug 17, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of manufacturing a doped metal chalcogenide thin film includes depositing a dopant atom on a base material; and forming a doped metal chalcogenide thin film on the dopant atom-deposited base material by supplying heat and a reaction gas comprising a metal precursor and a chalcogen precursor to the dopant atom-deposited base material.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of manufacturing a doped metal chalcogenide thin film, the method comprising: depositing a dopant atom on a base material to form a dopant atom-deposited base material; and forming a doped metal chalcogenide thin film on the dopant atom-deposited base material by supplying heat, a metal precursor and a reaction gas comprising a chalcogen precursor to the dopant atom-deposited base material, wherein the forming the doped metal chalcogenide thin film comprises continuously performing a first heat treatment process and a second heat treatment process, wherein the first heat treatment process comprises synthesis of the metal chalcogenide thin film for a predetermined period, and the second heat treatment process comprises increasing crystallinity of the metal chalcogenide thin film, and wherein the doped metal chalcogenide thin film is synthesized by reacting the metal precursor and the chalcogen precursor on the dopant atom-deposited base material. 2. The method of claim 1 , wherein the predetermined period is 20 to 40 minutes. 3. The method of claim 1 , wherein the reaction gas is Hydrogen Sulfide. 4. The method of claim 1 , wherein the first heat treatment process is performed in a temperature range of 100 to 600° C., and the second heat treatment process is performed in a temperature range of 600 to 900° C. 5. The method of claim 1 , wherein the doped metal chalcogenide thin film has a particle size of 100 to 900 nm. 6. The method of claim 1 , wherein the doped metal chalcogenide thin film exhibits N-type semiconductor properties or P-type semiconductor properties. 7. The method of claim 1 , wherein the dopant atom comprises a material selected from the group consisting of Nb, Mn, Ti, W, Zr, Mg, P, Ni, Al, Sn, V, Re, Ge, Si, B, Ga, In, Sb, Cr, Au, Na, Li, and combinations thereof. 8. The method of claim 1 , wherein the depositing the dopant atom on the base material is performed by a method selected from the group consisting of an electron beam evaporation method, a sputtering method, a vacuum deposition method, an ion plating method, a thermal evaporation method, an ion cluster beam method, a pulsed laser deposition method, an atomic layer deposition method, an atomic beam epitaxy method, and combinations thereof. 9. The method of claim 1 , wherein the metal precursor comprises a material selected from the group consisting of Mo, W, Bi, Mg, Al, Si, Ca, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Sr, Y, Zr, Nb, Tc, Ru, Rh, Pd, Ag, Cd, In, Sn, Sb, Ba, La, Hf, Ta, Re, Os, Ir, Pt, Au, Hg, Tl, Pb, Po, oxides thereof, and combinations thereof. 10. The method of claim 1 , wherein the chalcogen precursor comprises a material selected from the group consisting of S, Se, Te, and combinations thereof. 11. The method of claim 1 , wherein the base material comprises a material selected from the group consisting of Si, SiO 2 , Ge, GaN, AlN, GaP, InP, GaAs, SiC, Al 2 O 3 , LiAlO 3 , MgO, glass, quartz, sapphire, graphite, graphene, plastics, polymer, boron nitride (h-BN), and combinations thereof. 12. A doped metal chalcogenide thin film manufactured by the method of claim 1 . 13. The doped metal chalcogenide thin film of claim 12 , wherein the doped metal chalcogenide thin film has a particle size of 100 to 900 nm. 14. A thin film comprising the doped metal chalcogenide thin film of claim 12 .

Assignees

Inventors

Classifications

  • Thermal treatments, e.g. annealing or sintering · CPC title

  • being chalcogenide semiconductor materials not being oxides, e.g. ternary compounds · CPC title

  • characterised by the semiconductor material · CPC title

  • H10P32/14Primary

    within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase · CPC title

  • the materials being characterised by the deposition precursor materials · CPC title

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What does patent US11094558B2 cover?
A method of manufacturing a doped metal chalcogenide thin film includes depositing a dopant atom on a base material; and forming a doped metal chalcogenide thin film on the dopant atom-deposited base material by supplying heat and a reaction gas comprising a metal precursor and a chalcogen precursor to the dopant atom-deposited base material.
Who is the assignee on this patent?
Research & Business Found Sungkyunkwan Univ, Research And Business Foundation Sungkyunkwan Univ
What technology area does this patent fall under?
Primary CPC classification H10P14/3436. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 17 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).