Imaging apparatus having a plurality of movable beam columns, and method of inspecting a plurality of regions of a substrate intended to be substantially identical
US-2016064185-A1 · Mar 3, 2016 · US
US11094502B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11094502-B2 |
| Application number | US-201616064193-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 9, 2016 |
| Priority date | Dec 24, 2015 |
| Publication date | Aug 17, 2021 |
| Grant date | Aug 17, 2021 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
An electron beam inspection apparatus, the apparatus including a plurality of electron beam columns, each electron beam column configured to provide an electron beam and detect scattered or secondary electrons from an object, and an actuator system configured to move one or more of the electron beam columns relative to another one or more of the electron beam columns. The actuator system may include a plurality of first movable structures at least partly overlapping a plurality of second movable structures, the first and second movable structures supporting the plurality of electron beam columns.
Opening claim text (preview).
What is claimed is: 1. An electron beam inspection apparatus, comprising: a plurality of electron beam columns, each electron beam column configured to provide an electron beam and detect scattered or secondary electrons from an object, the object having a plurality of separate fields or dies, each field or die having a boundary to enable separation of the object into pieces; an actuator system configured to move one or more of the electron beam columns relative to another one or more of the electron beam columns; and a non-transitory computer program product comprising machine-readable instructions configured to cause relative movement between the object and the electron beam columns such that, upon completion of inspection of a field or die of the plurality of fields or dies, the plurality of electron beam columns has inspected a particular area of that field or die less than the entire area of that field or die and that particular area has a size of all of its one or more cross-sectional dimensions less than the size of all of the one or more cross-sectional dimensions of that field or die. 2. The apparatus of claim 1 , wherein the actuator system is configured to change a pitch of the plurality of electron beam columns. 3. The apparatus of claim 1 , wherein the plurality of electron beam columns is arranged in a two-dimensional array and the actuator system is configured to change a position of an electron beam column in a first direction and in a second direction substantially orthogonal to the first direction. 4. The apparatus of claim 1 , wherein each electron beam column is movable independently of the other electron beam columns. 5. The apparatus of claim 1 , wherein the plurality of electron beam columns comprises at least 30 electron beam columns. 6. The apparatus of claim 1 , wherein at least one of the inspected areas comprises a hotspot of the object, the hotspot identified prior to inspection by the associated electron beam column of that area. 7. The apparatus of claim 6 , wherein the non-transitory computer program product further comprises machine-readable instructions configured to determine the existence and/or location of the hotspot. 8. The apparatus of claim 6 , wherein the non-transitory computer program product further comprises machine-readable instructions configured to identify the hotspot by simulation. 9. A method of electron beam inspection, the method comprising: having a plurality of electron beam columns, each electron beam column configured to provide an electron beam and detect scattered or secondary electrons from an object, the object having a plurality of separate fields or dies, each field or die having a boundary to enable separation of the object into pieces; moving one or more of the electron beam columns relative to another one or more of the electron beam columns using an actuator system; and causing relative movement between the object and the electron beam columns such that, upon completion of inspection of a field or die of the plurality of fields or dies, the plurality of electron beam columns has inspected a particular area of that field or die less than the entire area of that field or die and that particular area has a size of all of its one or more cross-sectional dimensions less than the size of all of the one or more cross-sectional dimensions of that field or die. 10. The method of claim 9 , wherein the moving comprises changing a pitch of the plurality of electron beam columns. 11. The method of claim 9 , wherein each electron beam column is movable independently of the other electron beam columns. 12. An electron beam inspection apparatus, the apparatus comprising: a plurality of electron beam columns, each electron beam column configured to provide an electron beam and detect scattered or secondary electrons from an object, the object having a plurality of separate fields or dies, each field or die having a boundary to enable separation of the object into pieces and the electron beam columns are arranged in an array of rows and columns; an actuator system configured to move one or more of the electron beam columns relative to another one or more of the electron beam columns; and a non-transitory computer program product comprising machine-readable instructions configured to cause relative movement between the object and the electron beam columns such that, upon completion of inspection of a respective field or die of the plurality of fields or dies of the object, each of the plurality of electron beam columns has inspected an area of the respective field or die less than the entire area of that field or die and each electron beam column has inspected only that respective field or die such that each adjacent electron beam column in a row in the array and each adjacent electron beam column in a column of the array inspects only its respective field or die. 13. The apparatus of claim 12 , wherein the actuator system comprises a plurality of movable structures, each of the movable structures supporting, and configured to move collectively, two or more electron beam columns of the plurality of electron beam columns and wherein at least one of the electron beam columns is connected to a short stroke actuator having a movement range smaller than a movement range of the movable structures. 14. The apparatus of claim 12 , further comprising a plurality of sensors, each configured to measure a distance to enable determination of a position of an associated electron beam column in respect of an adjacent electron beam column. 15. The apparatus of claim 12 , wherein at least one of the areas comprises a hotspot of the object, the hotspot identified prior to inspection by the associated electron beam column of that area. 16. The apparatus of claim 15 , wherein the non-transitory computer program product further comprises machine-readable instructions configured to determine the existence and/or location of the hotspot. 17. The apparatus of claim 15 , wherein the non-transitory computer program product further comprises machine-readable instructions configured to identify the hotspot by simulation. 18. The apparatus of claim 15 , wherein the actuator system comprises a plurality of first movable structures, each of the first movable structures supporting, and configured to move collectively, two or more electron beam columns of the plurality of electron beam columns and a plurality of second movable structures, the second movable structures at least partly overlapping, or at least partly overlapped by, the first movable structures. 19. The apparatus of claim 1 , further comprising a plurality of sensors, each configured to measure a distance to enable determination of a position of an associated electron beam column in respect of an adjacent electron beam column. 20. The apparatus of claim 1 , wherein each electron beam column is arranged to inspect an area of a respective field or die associated with the electron beam column and the machine-readable instructions are further configured to cause relative movement between the object and the electron beam columns such that, upon completion of inspection of each respective field or die of the object, each electron beam column of the plurality of electron beam columns has inspected only its respective field or die.
Moving whole optical system relatively to object · CPC title
Means for mechanically adjusting components not otherwise provided for · CPC title
Optical {, image processing} or photographic arrangements associated with the tube · CPC title
Pattern inspection · CPC title
External mechanical adjustment of electron or ion optical components (H01J37/067, H01J37/20 take precedence) · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.