Clad material for electric contacts and method for producing the clad material

US11094478B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11094478-B2
Application numberUS-201716095217-A
CountryUS
Kind codeB2
Filing dateMay 19, 2017
Priority dateMay 23, 2016
Publication dateAug 17, 2021
Grant dateAug 17, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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Abstract

Official abstract text for this publication.

The present invention is a clad material for an electric contact, including a base material composed of a Cu-based, precipitation-type age-hardening material, and a contact material composed of an Ag alloy bonded to the base material. On a bonded interface between the contact material and the base material, a width of a diffusion region including Ag and Cu is 2.0 μm or shorter. The clad material is produced by bonding each other the contact material and the base material having undergone solutionizing and age-hardening beforehand, suppressing the diffusion region from expanding after bonding. The present invention is capable of providing an electric contact, which achieves higher conductivity, without sacrificing property of the Cu-based, precipitation-type age-hardening material.

First claim

Opening claim text (preview).

The invention claimed is: 1. A clad material for an electric contact, comprising: a base material composed of a Cu-based, precipitation-based age-hardening material; and a contact material composed of an Ag alloy bonded to the base material, whereinafter, on a bonded interface between the contact material and the base material, a width of a diffusion region including Ag and Cu is from 0.1 μm to 2.0 μm. 2. The clad material for an electric contact according to claim 1 , whereinafter the Ag alloy constituting the contact material has an Ag concentration ranging from 10 mass % to 95 mass % inclusive, and contains at least one element selected from a group composed of Ni, Pd, Cu, Au, and Pt. 3. The clad material for an electric contact according to claim 2 , whereinafter the Cu-based, precipitation-based age-hardening material is one of a Cu—Ni—Si based alloy, a Cu—Ni—Si—Mg based alloy, a Cu—Be based alloy, a Cu—Fe based alloy, a Cu—Fe—Ni based alloy, a Cu—Sn—Cr—Zn based alloy, and a Cu—Cr—Mg based alloy. 4. The clad material for an electric contact according to claim 2 , whereinafter the Ag alloy constituting the contact material is one of an Ag—Cu—Ni based alloy, an Ag—Ni based alloy, an Ag—Pd based alloy, an Ag—Pd—Cu based alloy, an Ag—Pd—Cu—Pt—Au based alloy, and an Ag—Au—Cu—Pt based alloy. 5. The clad material for an electric contact according to claim 4 , whereinafter the Cu-based, precipitation-based age-hardening material is one of a Cu—Ni—Si based alloy, a Cu—Ni—Si—Mg based alloy, a Cu—Be based alloy, a Cu—Fe based alloy, a Cu—Fe—Ni based alloy, a Cu—Sn—Cr—Zn based alloy, and a Cu—Cr—Mg based alloy. 6. The clad material for an electric contact according to claim 1 , whereinafter the Cu-based, precipitation-based age-hardening material is one of a Cu—Ni—Si based alloy, a Cu—Ni—Si—Mg based alloy, a Cu—Be based alloy, a Cu—Fe based alloy, a Cu—Fe—Ni based alloy, a Cu—Sn—Cr—Zn based alloy, and a Cu—Cr—Mg based alloy. 7. The clad material for an electric contact according to claim 1 , wherein the width of the diffusion region including Ag and Cu is from 0.9 μm to 2.0 μm. 8. A method for producing the clad material for an electric contact according to claim 1 , the method comprising the steps of: bonding the base material and the contact material to produce a rough clad material; subjecting the rough clad material to an anneal-heat treatment at a temperature falling within a range from −200° C. to −100° C. inclusive from a recrystallization temperature of the base material; and processing the heat-treated rough clad material. 9. A method for producing the clad material for an electric contact according to claim 2 , the method comprising the steps of: bonding the base material and the contact material to produce a rough clad material; subjecting the rough clad material to an anneal-heat treatment at a temperature falling within a range from −200° C. to −100° C. inclusive from a recrystallization temperature of the base material; and processing the heat-treated rough clad material. 10. A method for producing the clad material for an electric contact according to claim 4 , the method comprising the steps of: bonding the base material and the contact material to produce a rough clad material; subjecting the rough clad material to an anneal-heat treatment at a temperature falling within a range from −200° C. to −100° C. inclusive from a recrystallization temperature of the base material; and processing the heat-treated rough clad material. 11. A method for producing the clad material for an electric contact according to claim 6 , the method comprising the steps of: bonding the base material and the contact material to produce a rough clad material; subjecting the rough clad material to an anneal-heat treatment at a temperature falling within a range from −200° C. to −100° C. inclusive from a recrystallization temperature of the base material; and processing the heat-treated rough clad material.

Assignees

Inventors

Classifications

  • H01H1/04Primary

    Co-operating contacts of different material · CPC title

  • of switch contacts · CPC title

  • with copper as the next major constituent · CPC title

  • containing copper · CPC title

  • Alloys based on aluminium · CPC title

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Frequently asked questions

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What does patent US11094478B2 cover?
The present invention is a clad material for an electric contact, including a base material composed of a Cu-based, precipitation-type age-hardening material, and a contact material composed of an Ag alloy bonded to the base material. On a bonded interface between the contact material and the base material, a width of a diffusion region including Ag and Cu is 2.0 μm or shorter. The clad materia…
Who is the assignee on this patent?
Tanaka Precious Metal Ind
What technology area does this patent fall under?
Primary CPC classification H01H1/04. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 17 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).