Micromechanical redundant piezoresistive array pressure sensor

Patent metadata

Field	Value
Publication number	US-11092504-B2
Application number	US-201916418719-A
Country	US
Kind code	B2
Filing date	May 21, 2019
Priority date	May 21, 2019
Publication date	Aug 17, 2021
Grant date	Aug 17, 2021

Abstract

A micromechanical piezoresistive pressure sensor includes a diaphragm configured to mechanically deform in response to an applied load, a sensor substrate located on the diaphragm, and a number of piezoresistive resistance devices located on the sensor substrate. The piezoresistive resistance devices are arranged in a first planar array defining a grid pattern having two or more rows, each row being aligned in a first direction. The piezoresistive resistance devices are configured to be electrically connected in a number of bridge circuits, whereby the piezoresistive resistance devices in each row is electrically connected in an associated bridge circuit. A method of using the micromechanical piezoresistive pressure sensor is also disclosed.

First claim

The invention claimed is:

1. A micromechanical redundant piezoresistive array pressure sensor, comprising:
a substantially rectangular diaphragm, configured to mechanically deform in response to a differential pressure applied thereacross, the substantially rectangular diaphragm defining a width and a length in x-axis and y-axis directions, respectively;
and
a plurality of piezoresistive elements disposed on the diaphragm,
the plurality of piezoresistive elements arranged in a first planar array of rows and columns parallel to the x-axis and y-axis directions, respectively, each row including four piezoresistive elements electrically connected in a bridge circuit configuration thereby forming a plurality of bridge circuits, each of the four piezoresistive elements of each row aligned in columnar fashion with corresponding ones of the four piezoresistive elements of other rows.

2. The micromechanical redundant piezoresistive array pressure sensor of claim 1 , wherein the first planar array is comprised of four rows.

3. The micromechanical redundant piezoresistive array pressure sensor of claim 1 , wherein each of the plurality of piezoresistive elements has a serpentine pattern.

4. The micromechanical redundant piezoresistive array pressure sensor of claim 3 , wherein two or more of the piezoresistive elements are mechanically intertwined to form an intertwined serpentine array, each of the two or more of the piezoresistive elements being electrically isolated from each other.

5. The micromechanical redundant piezoresistive array pressure sensor of claim 1 , wherein the plurality of piezoresistive elements arranged in the first planar array is a first plurality of piezoresistive elements, the micromechanical redundant piezoresistive array pressure sensor further comprising:
a first dielectric layer, disposed on the first planar array; and
a second plurality of piezoresistive elements arranged in a second planar array substantially identical to the first planar array, the second planar array disposed on the dielectric layer;
wherein:
the first planar array comprises at least two rows; and
the second planar array comprises at least two rows.

6. The micromechanical redundant piezoresistive array pressure sensor of claim 5 , further comprising a second dielectric layer, disposed on the second planar array.

7. The micromechanical redundant piezoresistive array pressure sensor of claim 1 , wherein the micromechanical redundant piezoresistive array pressure sensor is configured to:
fluidly communicate a system pressure to the substantially rectangular diaphragm.

8. The micromechanical redundant piezoresistive array pressure sensor of claim 7 , wherein the system pressure is a differential pressure.

9. The micromechanical redundant piezoresistive array pressure sensor of claim 7 , wherein the system pressure ranges from 0-1,000 psi (0-6,895 KPa).

10. The micromechanical redundant piezoresistive array pressure sensor of claim 1 , wherein:
the differential pressure applied across the diaphragm produces a stress profile that is representative of the differential pressure applied;
the stress profile defines an x-axis stress component in the x-axis direction and a y-axis stress component in the y-axis direction; and
the stress component is substantially uniform within each of the columns.

11. The micromechanical redundant piezoresistive array pressure sensor of claim 1 , wherein:
each of the plurality of piezoresistive elements defines a static resistance; and
the static resistance ranges from 1,000-10,000 ohms.

12. The micromechanical redundant piezoresistive array pressure sensor of claim 1 , wherein:
a ratio of the length to the width of the substantially rectangular diaphragm defines a diaphragm aspect ratio; and
the diaphragm aspect ratio is at least 1.2.

13. The micromechanical redundant piezoresistive array pressure sensor of claim 12 , wherein the diaphragm aspect ratio ranges from 1.5-8.

14. A health monitoring system, comprising:
a prognostic processor; and
the micromechanical redundant piezoresistive array pressure sensor of claim 1 ;
wherein:
the prognostic processor is configured to identify an erroneous indication from one or more of redundant measurements of differential pressure provided by the plurality of bridge circuits.

15. A method for measuring a system pressure using a micromechanical redundant piezoresistive array pressure sensor comprising a diaphragm configured to mechanically deform in response to a load applied thereto, and a plurality of piezoresistive resistance devices disposed on the diaphragm, the plurality of piezoresistive resistance devices arranged in a first planar array defining a grid pattern comprised of two or more rows, each of the two or more rows aligned in a first direction, and each of the two or more rows comprising four piezoresistive resistance devices electrically connected in an associated bridge circuit, the method comprising:
applying a supply voltage to one or more bridge circuits, the one or more bridge circuits configured to produce an electrical output voltage;
fluidly communicating the system pressure to the diaphragm, thereby applying the load to the diaphragm;
measuring the electrical output voltage; and
producing a signal representative of the system pressure based on the measured electrical output voltage.

16. The method of claim 15 , wherein:
the differential pressure applied across the diaphragm produces a stress profile that is representative of the differential pressure applied;
the stress profile defines an x-axis stress component in the x-axis direction and a y-axis stress component in the y-axis direction; and
the stress component is substantially uniform within each of the columns.

17. The method of claim 15 , wherein the micromechanical redundant piezoresistive array pressure sensor further comprises:
a first dielectric layer, disposed on the first planar array; and
a second planar array disposed on the dielectric layer;
wherein:
the first planar array comprises at least two rows; and
the second planar array comprises at least two rows.

18. The method of claim 15 , wherein:
the diaphragm comprises a substantially rectangular diaphragm region defining a length and a width;
a ratio of the length to the width defines a diaphragm aspect ratio; and
the diaphragm aspect ratio is at least 1.2.

19. The method of claim 15 , wherein each of the plurality of piezoresistive resistance devices has a serpentine pattern.

20. The method of claim 19 , wherein two or more piezoresistive resistance devices are mechanically intertwined to form an intertwined serpentine array, each of the two or more piezoresistive resistance devices being electrically isolated from each other.

Assignees

• Rosemount Aerospace Inc

Inventors

• Daup Michael Robert
• Potasek David P

Classifications

• G01L27/007

  Malfunction diagnosis, i.e. diagnosing a sensor defect · CPC title

• G01L9/04

  of resistance-strain gauges · CPC title

• G01L9/0052 Primary

  of piezoresistive elements (circuits therefor G01L9/06) · CPC title

• G01L15/00

  Devices or apparatus for measuring two or more fluid pressure values simultaneously · CPC title

• G01L9/0055

  bonded on a diaphragm · CPC title