Moth-eye transfer mold, method of manufacturing moth-eye transfer mold, and method of transferring moth-eye structure

Patent metadata

Field	Value
Publication number	US-11091830-B2
Application number	US-201916619154-A
Country	US
Kind code	B2
Filing date	Jun 12, 2019
Priority date	Jun 13, 2018
Publication date	Aug 17, 2021
Grant date	Aug 17, 2021

Abstract

To provide a moth-eye transfer mold and a method of manufacturing a moth-eye transfer mold that provide a simple and inexpensive manufacturing process. A moth-eye transfer mold 1 is characterized by including a base 10 , an underlayer 20 formed on the base 10 , and a glassy carbon layer 30 formed on the underlayer 20 , the glassy carbon layer 30 has an inverted moth-eye structure RM over a surface 30 a , and the inverted moth-eye structure RM is randomly arranged cone-shaped pores.

First claim

The invention claimed is:

1. A method of manufacturing a moth-eye transfer mold, characterized by comprising:
a base preparation step of preparing a base, wherein the base comprises one or more substances selected from the group consisting of resin, glass, metal, alloy, ceramics, a silicon wafer, a compound semiconductor, silicon carbide, and a solar cell material;
an underlayer forming step of forming an underlayer on the base, wherein the underlayer comprises one or more substances selected from the group consisting of metal, alloy, ceramics, and silicon;
a glass-like carbon layer deposition step of depositing a glass-like carbon layer on the underlayer by a sputtering method; and
an etching step of etching the glass-like carbon layer with an oxygen ion beam or oxygen plasma to form a microstructure which has an average diameter of 10 nm to 400 nm, an average height of 30 nm to 1,000 nm, and an average pitch of 10 nm to 500 nm on a surface of the glass-like carbon layer,
wherein
in the glass-like carbon layer deposition step,
the sputtering method is performed with DC power supply to a glass-like carbon target to deposit the glass-like carbon layer on the underlayer to a thickness not less than 300 nm and not more than 5 μm, and
the DC power supply is not less than 0.5 kW and not more than 3 kW, temperature is about 25° C., and deposition pressure is 1.0 Pa or less; and

in the etching step,
high frequency power output and bias power output of an ion beam processor for the oxygen ion beam or a plasma processor for the oxygen plasma are adjusted to apply acceleration voltage to oxygen ions,
an oxygen flow rate of not less than 30 SCCM and not more than 60 SCCM,
the high frequency power output is not less than 300 W and not more than 700 W, the bias power output is not less than 30 W and not more than 70 W, and
processing time is not less than 80 seconds and not more than 170 seconds.

2. A method of transferring a moth-eye structure, characterized by comprising:
a moth-eye transfer mold manufacturing step of manufacturing the moth-eye transfer mold according to claim 1 ;
a step of preparing a work;
a step of irradiating a photocurable resin with light, with the photocurable resin interposed between the moth-eye transfer mold and a surface of the work, thereby curing the photocurable resin; and
a step of peeling off the moth-eye transfer mold from a surface microstructure which is formed by the cured photocurable resin.

3. The method of transferring a moth-eye structure according to claim 2 , wherein
the moth-eye transfer mold has a shape comprising one or more shapes selected from the group consisting of a roll shape, a flat plate shape, and an irregular shape.

Assignees

• Univ Tokyo Science Found
• Geomatec Co Ltd

Inventors

• Taniguchi Jun
• Sugawara Hiroyuki

Classifications

• C23C14/5873

  Removal of material · CPC title

• C23C14/34

  Sputtering · CPC title

• B29C59/16

  by wave energy or particle radiation {, e.g. infrared heating (B29C59/007 takes precedence)} · CPC title

• G02B1/118

  having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures · CPC title

• B29C2033/385

  by laminating a plurality of layers · CPC title