Reactive polyurethane hot melt adhesives containing fillers

US11091677B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11091677-B2
Application numberUS-201816032543-A
CountryUS
Kind codeB2
Filing dateJul 11, 2018
Priority dateJan 13, 2016
Publication dateAug 17, 2021
Grant dateAug 17, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention relates to a reactive polyurethane (PUR) hot-melt adhesive, in particular a moisture cross-linking 1K-PUR hot-melt adhesive, wherein the PUR adhesive contains neutralized hollow glass spheres as fillers. The invention also relates to the use of said adhesive for adhesively bonding substrates.

First claim

Opening claim text (preview).

The invention claimed is: 1. A reactive polyurethane-based hot-melt adhesive composition containing, based on the total weight of the adhesive composition, from 1 to <30 wt. % of at least one solid particulate filler, wherein the at least one filler comprises neutralized hollow glass spheres, the hollow glass spheres, as a 5 wt. % dispersion in water at 20° C., having a pH of 6 to 9. 2. The hot-melt adhesive composition according to claim 1 , containing, based on the total weight of the adhesive composition, from 1 to <10 wt. % of neutralized hollow glass spheres. 3. The hot-melt adhesive composition according to claim 1 , containing, based on the total weight of the adhesive composition, from 2 to 6 wt. % of neutralized hollow glass spheres. 4. The hot-melt adhesive composition according to claim 1 , wherein the hollow glass spheres, as a 5 wt. % dispersion in water at 20° C., have a pH of from 6 to 8. 5. The hot-melt adhesive composition according to claim 1 , wherein the hollow glass spheres, as a 5 wt. % dispersion in water at 20° C., have a pH of from 6.5 to 7.5. 6. The hot-melt adhesive composition according to claim 1 , wherein the at least one filler has an average particle size d 50 of from 5 to 50 μm. 7. The hot-melt adhesive composition according to claim 1 , wherein the hot-melt adhesive composition contains at least one NCO-terminated polyurethane prepolymer. 8. The hot-melt adhesive composition according to claim 1 , wherein the hot-melt adhesive composition contains at least one NCO-terminated polyurethane prepolymer in an amount of from 20 to 95 wt. % based on the total weight of the hot-melt adhesive composition. 9. The hot-melt adhesive composition according to claim 1 , comprising an MDI-terminated polyurethane prepolymer reaction product of a polyester polyol mixture and MDI. 10. The hot-melt adhesive composition according to claim 1 , wherein the hot-melt adhesive is a moisture-curing 1K polyurethane hot-melt adhesive. 11. The hot-melt adhesive composition according to claim 1 , wherein the composition further contains at least one thermoplastic polyester in an amount of from 3 to 35 wt. %, based on the total weight of the hot-melt adhesive composition. 12. The hot-melt adhesive composition according to claim 1 , wherein the composition further contains at least one thermoplastic polyester, in an amount of from 5 to 25 wt. %, based on the total weight of the hot-melt adhesive composition. 13. The hot-melt adhesive composition according to claim 1 , wherein the hot-melt adhesive composition: (a) has a viscosity of from 2,000 to 60,000 mPas determined according to DIN EN ISO 2555:2000-01 (Brookfield viscometer RV DV-II, spindle no. 27, 130° C.; 5 rpm); and/or (b) has an NCO-content of from 0.25 to 4 wt. %; and/or (c) has a density of ≤1.5 g/cm 3 . 14. The hot-melt adhesive composition according to claim 1 , wherein the hot-melt adhesive composition has a density of 0.9 to 1.1 g/cm 3 . 15. The hot-melt adhesive composition according to claim 1 , wherein the hot-melt adhesive composition has an increase in viscosity after 16 h at 130° C. of no more than 400%. 16. The hot-melt adhesive composition according to claim 1 , wherein the hot-melt adhesive composition has an increase in viscosity after 16 h at 130° C. of no more than 250%. 17. The hot-melt adhesive composition according to claim 1 , wherein: (a) the composition further contains one or more additives selected from tackifying resin, tackifier, adhesion promoter, crosslinking agent, viscosity regulator, pigment, plasticizer, stabilizer, catalyst, wax or antioxidant; and/or (b) the composition is substantially free of organic solvent. 18. Cured reaction products of the hot-melt adhesive composition according to claim 1 for adhesively bonding two or more substrates. 19. A substrate bonded to cured reaction products of the hot-melt adhesive composition according to claim 1 . 20. A reactive polyurethane-based hot-melt adhesive composition comprising, based on the total weight of the adhesive composition, from 1 to <30 wt. % of neutralized hollow glass spheres, wherein the hollow glass spheres, as a 5 wt. % dispersion in water at 20° C., have a pH of less than 9.0.

Assignees

Inventors

Classifications

  • from polyesters · CPC title

  • Compositions for hot melt adhesives · CPC title

  • derived from dicarboxylic acids and dialcohols · CPC title

  • derived from aromatic dicarboxylic acids and dialcohols · CPC title

  • Two or more polyesters of different physical or chemical nature (C08G18/44 takes precedence) · CPC title

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Frequently asked questions

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What does patent US11091677B2 cover?
The present invention relates to a reactive polyurethane (PUR) hot-melt adhesive, in particular a moisture cross-linking 1K-PUR hot-melt adhesive, wherein the PUR adhesive contains neutralized hollow glass spheres as fillers. The invention also relates to the use of said adhesive for adhesively bonding substrates.
Who is the assignee on this patent?
Henkel Ag & Co Kgaa
What technology area does this patent fall under?
Primary CPC classification C08G18/4202. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Aug 17 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).