Ventilated shield can

Patent metadata

Field	Value
Publication number	US-11089712-B2
Application number	US-201916358187-A
Country	US
Kind code	B2
Filing date	Mar 19, 2019
Priority date	Mar 19, 2019
Publication date	Aug 10, 2021
Grant date	Aug 10, 2021

Abstract

A device cooling system disclosed herein includes a ventilated shield can coupled to a printed circuit board assembly. The ventilated shield can includes a first side surface with input holes and a second side surface with output holes. The ventilated shield can is positioned related to a predefined airflow path such that the input holes and the output holes facilitate airflow along the predefined airflow path through the ventilated shield can in a direction substantially parallel to the PCBA while the shield can encases and shields at least one electrical component from RF radiation at a target shield frequency.

First claim

What is claimed is:

1. A system comprising:
a printed circuit board assembly (PCBA) extending within a plane substantially perpendicular to a direction of gravity;
a shield can attached to the PCBA, the shield can including a top portion and one or more sidewalls extending between the top portion and the PCBA, the one or more sidewalls including a step including a first portion substantially parallel to the PCBA and a second portion substantially perpendicular to the PCBA, the top portion and the one or more sidewalls being adapted to shield at least one internal electrical component from radiation at a target shield frequency, the one or more sidewalls including input holes and output holes positioned to facilitate airflow through the shield can in a direction substantially parallel to the PCBA, the input holes and the output holes being formed in both the first portion and the second portion of the step in the one or more sidewalls;
an enclosure attached to the PCBA and encompassing the shield can, wherein a gap between the top portion of the shield can and the enclosure has a height smaller than a corresponding height of the shield can relative to the PCBA such that an airflow within the enclosure is substantially directed through the shield can rather than through the gap; and
a fan within the enclosure and external to the shield can, the fan adapted to generate the airflow along a target path in the direction substantially parallel to the PCBA and through both the input holes and the output holes of the shield can while circulating the airflow throughout the enclosure.

2. The system of claim 1 , wherein the input holes are formed in a first side surface of the shield can and the output holes are formed in a second side surface of the shield can, the first side surface and the second side surface defining a thinnest dimension of the shield can.

3. The system of claim 1 , wherein the input holes and the output holes have a maximum diameter equal to or less than a smallest diameter sufficient to block transmission of RF waves of the target shield frequency.

4. The system of claim 1 , wherein the shield can comprises:
a fence portion mounted to the PCBA; and
a body portion including the input holes and the output holes, the fence portion configured for attachment to the body portion.

5. The system of claim 1 , wherein at least one of the input holes and the output holes are formed along the first portion of the step substantially perpendicular to the PCBA.

6. The system of claim 1 , wherein the input holes are formed on a first side surface of the shield can and the output holes are formed on a second side surface of the shield can, the first side surface and the second side surface being non-parallel to one another such that the airflow is along a substantially curved path through the shield can.

7. A method comprising:
determining an airflow path created by a fan positioned within an enclosure, the airflow path being directed across a PCBA within the enclosure, the PCBA extending within a plane substantially parallel to a direction of gravity; and
placing a shield can inside the enclosure and within the airflow path, the shield can including:
a top portion and one or more sidewalls adapted to shield and surround at least one internal electrical component, the one or more sidewalls extending between the top portion and the PCBA and having input holes and output holes in-line with the airflow path on different side surfaces of the shield can, the one or more sidewalls including a step including a first portion substantially parallel to the PCBA and a second portion substantially perpendicular to the PCBA, the input holes and the output holes being formed in both the first portion and the second portion of the step, the shield can having a height relative to the PCBA that is greater than a corresponding height of a gap between the shield can and the enclosure such that the airflow path is substantially directed through the shield can rather than through the gap.

8. The method of claim 7 , wherein the input holes are formed in a first side surface of the shield can and the output holes are formed in a second side surface of the shield can, the first side surface and the second side surface defining a thinnest dimension of the shield can.

9. The method of claim 8 , wherein a surface area of openings formed by the input holes on the first side surface exceeds a surface area formed by non-open areas of the first side surface.

10. The method of claim 7 , wherein the input holes and the output holes have a maximum diameter equal to or less than a smallest diameter sufficient to block transmission of RF waves of a target shield frequency.

11. The method of claim 7 , wherein the shield can includes a fence portion mounted to the PCBA and a body portion including the input holes and the output holes, the fence portion configured for attachment to the body portion.

12. The method of claim 7 , wherein at least one of the input holes and the output holes are formed along the first portion of the step substantially perpendicular to the PCBA.

13. An apparatus comprising:
a shield can included within a device enclosure, the shield can including:
a top portion and one or more sidewalls extending between the top portion and the PCBA, the top portion and the one or more sidewalls being adapted to shield at least one internal electrical component from RF radiation at a target shield frequency, the one or more sidewalls including input holes and output holes on different side surfaces to provide air intake and air outtake through the shield can, wherein the one or more sidewalls further include a step having a first portion substantially parallel to the PCBA, the first portion being positioned between a second portion and a third portion, the second portion and the third portion each being substantially perpendicular to the PCBA, the input holes and the output holes being formed in both the first portion and the second portion of the step.

14. The apparatus of claim 13 , wherein the input holes are formed in a first side surface of the shield can and the output holes are formed in a second side surface of the shield can, the first side surface and the second side surface defining a thinnest dimension of the shield can.

15. The apparatus of claim 14 , wherein a surface area of openings formed by the input holes on the first side surface exceeds a surface area formed by non-open areas of the first side surface.

16. The apparatus of claim 13 , wherein the shield can further includes:
a fence portion mounted to the PCBA within the device enclosure; and
a body portion including the input holes and the output holes, the fence portion configured for attachment to the body portion.

Assignees

• Microsoft Technology Licensing Llc

Inventors

• Zhao Tianyu
• Lee Eugene
• Dan Bo

Classifications

• H05K7/20145 Primary

  Means for directing air flow, e.g. ducts, deflectors, plenum or guides · CPC title

• H05K9/0032 Primary

  having multiple parts, e.g. frames mating with lids · CPC title

• G06F1/203

  for portable computers, e.g. for laptops · CPC title

• H05K1/0209

  External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings · CPC title

• H05K7/20172

  Fan mounting or fan specifications · CPC title