Shielding case, PCB and terminal device

Patent metadata

Field	Value
Publication number	US-10117324-B2
Application number	US-201615077868-A
Country	US
Kind code	B2
Filing date	Mar 22, 2016
Priority date	Oct 14, 2015
Publication date	Oct 30, 2018
Grant date	Oct 30, 2018

Abstract

Described are a shielding case, a Printed Circuit Board (PCB) and a terminal device. The shielding case includes a first shielding case body (1) and a second shielding case body (2) which are interconnected with each other, wherein the second shielding case body (2) at least partially covers an outside of the first shielding case body (1), and a heat storage material (3) is accommodated between the first shielding case body (1) and the second shielding case body (2).

First claim

What is claimed is:

1. A shielding case, comprising: a first shielding case body and a second shielding case body which are interconnected with each other and form a double-layer structure,
wherein the first shielding case body comprises a first top wall and a first side wall, the second shielding case body comprises a second top wall and a second side wall, the second shielding case body at least partially covers an outside of the first shielding case body, and a heat storage material is accommodated between the first shielding case body and the second shielding case body, such that heat radiated by a heating component covered by the double-layer structure is stored in and then dissipated from the heat storage material;
wherein the second shielding case body covers an outside of both the first top wall and the first side wall; and
wherein the second shielding case body is connected with the first shielding case body through multiple joint pins that are arranged along a circumference direction at intervals; an inner end of the joint pin is connected with a corner between the first top wall and the first side wall, while an outer end is connected with a corner between the second top wall and the second side wall; the heat storage material comprises a first heat storage material located between the first top wall and the second top wall and a second heat storage material located between the first side wall and the second side wall.

2. The shielding case according to claim 1 , wherein the second shielding case body covers an outside of the first top wall.

3. The shielding case according to claim 2 , wherein a cross section area of the second shielding case body is less than that of the first shielding case body, and a bottom of the second side wall is welded on the first top wall.

4. The shielding case according to claim 1 , wherein multiple ventilation holes distributed at intervals are formed on the second shielding case body.

5. A Printed Circuit Board (PCB), comprising: a board body and a heating component disposed on the board body,
wherein a shielding case covers the heating component, and the shielding case is connected onto the board body;
wherein the shielding case comprises: a first shielding case body and a second shielding case body which are interconnected with each other and form a double-layer structure, wherein the first shielding case body comprises a first top wall and a first side wall, the second shielding case body comprises a second top wall and a second side wall, the second shielding case body at least partially covers an outside of the first shielding case body, and a heat storage material is accommodated between the first shielding case body and the second shielding case body, such that heat radiated by a heating component covered by the double-layer structure is stored in and then dissipated from the heat storage material;
wherein the second shielding case body covers an outside of both the first top wall and the first side wall; and
wherein the second shielding case body is connected with the first shielding case body through multiple joint pins that are arranged along a circumference direction at intervals; an inner end of the joint pin is connected with a corner between the first top wall and the first side wall, while an outer end is connected with a corner between the second top wall and the second side wall; the heat storage material comprises a first heat storage material located between the first top wall and the second top wall and a second heat storage material located between the first side wall and the second side wall.

6. The PCB according to claim 5 , wherein the second shielding case body covers an outside of the first top wall.

7. The PCB according to claim 6 , wherein a cross section area of the second shielding case body is less than that of the first shielding case body, and a bottom of the second side wall is welded on the first top wall.

8. The PCB according to claim 5 , wherein multiple ventilation holes distributed at intervals are formed on the second shielding case body.

9. The PCB according to claim 5 , wherein the first shielding case body, the second shielding case body and the board body are connected by at least one of: welding, clamping and plug-in.

10. The PCB according to claim 9 , wherein bottoms of the first side wall and the second side wall are welded onto the board body.

11. A terminal device, comprising: a Printed Circuit Board (PCB) provided in the terminal device,
wherein the PCB comprises: a board body and a heating component disposed on the board body,
wherein a shielding case covers the heating component, and the shielding case is connected onto the board body;
wherein the shielding case comprises: a first shielding case body and a second shielding case body which are interconnected with each other and form a double-layer structure, wherein the first shielding case body comprises a first top wall and a first side wall, the second shielding case body comprises a second top wall and a second side wall, the second shielding case body at least partially covers an outside of the first shielding case body, and a heat storage material is accommodated between the first shielding case body and the second shielding case body, such that heat radiated by a heating component covered by the double-layer structure is stored in and then dissipated from the heat storage material;
wherein the second shielding case body covers an outside of both the first top wall and the first side wall; and
wherein the second shielding case body is connected with the first shielding case body through multiple joint pins that are arranged alone a circumference direction at intervals; an inner end of the joint pin is connected with a corner between the first top wall and the first side wall, while an outer end is connected with a corner between the second top wall and the second side wall; the heat storage material comprises a first heat storage material located between the first top wall and the second top wall and a second heat storage material located between the first side wall and the second side wall.

12. The terminal device according to claim 11 , wherein the second shielding case body covers an outside of the first top wall.

13. The terminal device according to claim 12 , wherein a cross section area of the second shielding case body is less than that of the first shielding case body, and a bottom of the second side wall is welded on the first top wall.

14. The terminal device according to claim 11 , wherein multiple ventilation holes distributed at intervals are formed on the second shielding case body.

Assignees

• Xiaomi Inc

Inventors

• Wang Dongliang
• Wang Shaojie
• Shi Shasha

Classifications

• H05K2201/10371

  Shields or metal cases · CPC title

• H05K2201/0707

  Shielding · CPC title

• H05K9/0081

  Electromagnetic shielding materials, e.g. EMI, RFI shielding (H05K9/0003 takes precedence) · CPC title

• H05K9/0052

  Shielding other than Faraday cages · CPC title

• H05K7/20436

  Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing · CPC title