Tinned copper terminal material, terminal, and electrical wire end part structure
US-2019161866-A1 · May 30, 2019 · US
Tin-plated copper terminal material, terminal, and wire terminal part structure
US11088472B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11088472-B2 |
| Application number | US-201615774402-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 24, 2016 |
| Priority date | Nov 27, 2015 |
| Publication date | Aug 10, 2021 |
| Grant date | Aug 10, 2021 |
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Abstract
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On a base member made of copper or a copper alloy, a zinc-nickel alloy layer including zinc and nickel, and a tin layer made of tin alloy are laminated in this order: the zinc-nickel alloy layer has a thickness of 0.1-5 μm inclusive and has a nickel content of 5-50 mass % inclusive, the tin layer has a zinc concentration of 0.6-15 mass % inclusive, and, under an oxide layer which is the outermost layer, a metal zinc layer, having a zinc concentration of 5-40 at % inclusive and a thickness of 1-10 nm inclusive in SiO2 conversion, is formed on the tin layer.
First claim
Opening claim text (preview).
The invention claimed is: 1. Tin-plated copper terminal material comprising a base member made of copper or copper alloy, a zinc-nickel alloy layer consisting of zinc and nickel and a tin layer made of tin alloy stacked on the base member in this order, wherein the zinc-nickel alloy layer has a thickness of 0.1 μm to 5 μm inclusive and a nickel content of 5 mass % to 35 mass % inclusive, the tin layer has a zinc concentration of 0.6 mass % to 15 mass % inclusive, and wherein a metal zinc layer is further provided on the tin layer and under an outermost oxide layer. 2. The tin-plated copper terminal material according to claim 1 , the metal zinc layer has zinc concentration of 5 at % to 40 at % inclusive. 3. The tin-plated copper terminal material according to claim 1 , further comprising a ground layer made of nickel or nickel alloy between the base member and the zinc-nickel alloy layer that has a thickness of 0.1 μm to 5 μm inclusive and a nickel content of 80 mass % or greater. 4. The tin-plated copper terminal material according to claim 1 , wherein the tin-plated copper terminal material is a strip material comprising a plurality of terminal parts connected to a carrier part with spacing along a longitudinal direction of the carrier part. 5. A terminal made of the tin-plated copper terminal material of claim 1 . 6. Wire terminal part structure wherein the terminal of claim 5 is crimped to a wire made of aluminum or aluminum alloy.
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- What does patent US11088472B2 cover?
- On a base member made of copper or a copper alloy, a zinc-nickel alloy layer including zinc and nickel, and a tin layer made of tin alloy are laminated in this order: the zinc-nickel alloy layer has a thickness of 0.1-5 μm inclusive and has a nickel content of 5-50 mass % inclusive, the tin layer has a zinc concentration of 0.6-15 mass % inclusive, and, under an oxide layer which is the outermo…
- Who is the assignee on this patent?
- Mitsubishi Materials Corp
- What technology area does this patent fall under?
- Primary CPC classification C25D7/00. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Aug 10 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).