Patterned stamp manufacturing method, patterned stamp and imprinting method

US11086217B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11086217-B2
Application numberUS-201515538354-A
CountryUS
Kind codeB2
Filing dateDec 9, 2015
Priority dateDec 22, 2014
Publication dateAug 10, 2021
Grant dateAug 10, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of manufacturing a patterned stamp (100) for patterning a contoured surface (10) is disclosed. The method comprises applying a layer (115) of a pliable material precursor over a master (50) carrying an inverse pattern (52) to form a desired pattern (112) in said layer; curing the pliable material precursor to form a pliable stamp layer (120) comprising said desired pattern; providing an intermediate stamp structure by adhering a porous pliable support layer (130) to the pliable stamp layer; releasing the intermediate stamp structure from the master; forcing the intermediate stamp structure onto the contoured surface with said pattern of features facing the contoured surface; forming the patterned stamp by filling the porous pliable support layer with a filler material to reduce the pliability of the support layer; and removing the patterned stamp from the contoured surface. A corresponding patterned stamp, imprinting method and imprinted article are also disclosed.

First claim

Opening claim text (preview).

The invention claimed is: 1. A printing stamp for imprint lithography, comprising: a pliable stamp layer, wherein the pliable stamp layer has a contoured surface carrying a relief pattern; and a support layer, wherein the support layer is connected to the pliable stamp layer, wherein the support layer comprises a plurality of pores, wherein the plurality of pores are filled with a filler material. 2. The imprint stamp of claim 1 , wherein the filler material is a different material than the material of the pliable stamp layer. 3. The imprint stamp of claim 1 , wherein the filler material is the same material as the material of the pliable stamp layer. 4. The imprint stamp of claim 1 , wherein at least one of the pliable stamp layer and the support layer comprises a siloxane based polymer. 5. The imprint stamp of claim 1 , wherein the pliable stamp layer has a first Young's modulus, wherein the support layer has a second Young's modulus, wherein the first Young's modulus is larger than the second Young's modulus. 6. The imprint stamp of claim 1 , wherein the material of the support layer and the filler material have a refractive index, wherein the refractive index is arranged such that the support layer is at least partially transparent for optical radiation.

Assignees

Inventors

Classifications

  • Photolithographic processes · CPC title

  • G03F7/00Primary

    Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor (using photoresist structures for special production processes, see the relevant places, e.g. B44C, H10P76/00, H05K) · CPC title

  • G03F7/0002Primary

    Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

  • Optical aspects of refractive lens systems, i.e. comprising only refractive elements · CPC title

  • using liquid photohardening compositions, e.g. for the production of reliefs such as flexographic plates or stamps · CPC title

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What does patent US11086217B2 cover?
A method of manufacturing a patterned stamp (100) for patterning a contoured surface (10) is disclosed. The method comprises applying a layer (115) of a pliable material precursor over a master (50) carrying an inverse pattern (52) to form a desired pattern (112) in said layer; curing the pliable material precursor to form a pliable stamp layer (120) comprising said desired pattern; providing a…
Who is the assignee on this patent?
Koninklijke Philips Nv
What technology area does this patent fall under?
Primary CPC classification G03F7/00. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Aug 10 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).