Apparatus for preventing solder paste dripping

Patent metadata

Field	Value
Publication number	US-11084114-B2
Application number	US-201816604467-A
Country	US
Kind code	B2
Filing date	Apr 13, 2018
Priority date	Apr 14, 2017
Publication date	Aug 10, 2021
Grant date	Aug 10, 2021

Abstract

The present application provides an apparatus for preventing solder paste dripping, comprising: a working platform support apparatus; a working platform connected in a fixed manner to one end of the working platform support apparatus, the working platform being used to bear a solder paste tub comprising a housing, with a solder paste nozzle being accommodated in the housing, the solder paste nozzle being mounted on the working platform, so that the solder paste tub is borne in an inverted manner on the working platform by means of the solder paste nozzle, with the housing being capable of moving relative to the solder paste nozzle so as to extrude solder paste accommodated in the solder paste tub from the solder paste nozzle; and a holder, the holder being connected to the housing of the solder paste tub and located above the working platform, and the holder being slidably connected to the working platform support apparatus, so that the holder can move downward as the amount of solder paste in the solder paste tub decreases, to adjust the relative position of the solder paste nozzle and the housing.

First claim

The invention claimed is:

1. An apparatus for preventing solder paste dripping, comprising:
a working platform support apparatus;
a working platform connected in a fixed manner to one end of the working platform support apparatus, the working platform being used to bear a solder paste tub comprising a housing, with a solder paste nozzle being accommodated in the housing, the solder paste nozzle being mounted on the working platform, so that the solder paste tub is borne in an inverted manner on the working platform by the solder paste nozzle, with the housing being capable of moving relative to the solder paste nozzle so as to extrude solder paste accommodated in the solder paste tub from the solder paste nozzle;
a holder, the holder being connected to the housing of the solder paste tub and located above the working platform, and the holder being slidably connected to the working platform support apparatus, so that the holder can move downward as the amount of solder paste in the solder paste tub decreases, to adjust the relative position of the solder paste nozzle and the housing; and
a height adjustment apparatus, with one end of the height adjustment apparatus being connected to the holder, and another end of the height adjustment apparatus being connected to the working platform support apparatus, for the purpose of adjusting the height of the holder relative to the working platform support apparatus,
wherein the height adjustment apparatus is a flat spiral spring, with a free end of the flat spiral spring being connected to the holder, and a spiral roll part of the flat spiral spring being mounted on the working platform support apparatus.

2. The apparatus for preventing solder paste dripping as claimed in claim 1 , characterized in that: the working platform support apparatus is provided with an accommodating space for accommodating the spiral roll part of the flat spiral spring.

3. The apparatus for preventing solder paste dripping as claimed in claim 1 , characterized in that: the elasticity of the flat spiral spring is configured to be matched to the weight of solder paste accommodated in the solder paste tub.

4. The apparatus for preventing solder paste dripping as claimed in claim 1 , characterized in that: the height adjustment apparatus comprises two flat spiral springs, connected to two ends of the holder respectively.

5. The apparatus for preventing solder paste dripping as claimed in claim 1 , characterized in that: the holder comprises a slider located on one side thereof, the working platform support apparatus comprises a slide groove located on one side thereof, and the slider fits the slide groove, so as to slidably connect the holder to the working platform support apparatus.

6. The apparatus for preventing solder paste dripping as claimed in claim 5 , characterized in that: the slider and the slide groove both have trapezoidal cross sections.

7. An apparatus for preventing solder paste dripping, comprising:
a working platform support apparatus;
a working platform connected in a fixed manner to one end of the working platform support apparatus, the working platform being used to bear a solder paste tub comprising a housing, with a solder paste nozzle being accommodated in the housing, the solder paste nozzle being mounted on the working platform, so that the solder paste tub is borne in an inverted manner on the working platform by the solder paste nozzle, with the housing being capable of moving relative to the solder paste nozzle so as to extrude solder paste accommodated in the solder paste tub from the solder paste nozzle; and
a holder, the holder being connected to the housing of the solder paste tub and located above the working platform, and the holder being slidably connected to the working platform support apparatus, so that the holder can move downward as the amount of solder paste in the solder paste tub decreases, to adjust the relative position of the solder paste nozzle and the housing, characterized in that:
the holder comprises a through-hole, with the size of the through hole matching an outer diameter of the housing of the solder paste tub; and
a flange is provided on an outer wall of the housing of the solder paste tub, an edge of the through-hole of the holder being engaged below the flange.

8. The apparatus for preventing solder paste dripping as claimed in claim 7 , characterized in that: the flange is a limiting flange extending along a circumference of the outer wall of the housing.

9. The apparatus for preventing solder paste dripping as claimed in claim 7 , characterized in that: the solder paste tub is pressed by a pressure plate moving up and down above the solder paste tub, thereby enabling solder paste to be extruded from the solder paste nozzle.

Assignees

• Illinois Tool Works

Inventors

• Yang Ning

Classifications

• H05K2203/0126

  Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes · CPC title

• H05K3/3478

  Application of solder preforms; Transferring prefabricated solder patterns · CPC title

• B23K3/087

  Soldering or brazing jigs, fixtures or clamping means · CPC title

• B23K3/0638 Primary

  for viscous material feeding, e.g. solder paste feeding (B23K3/0623 takes precedence) · CPC title

• B05C11/101

  responsive to weight of a container for liquid or other fluent material; responsive to level of liquid or other fluent material in a container · CPC title