Joined body of piezoelectric material substrate and support substrate
US-2021067129-A1 · Mar 4, 2021 · US
Joined body of piezoelectric material substrate and support substrate
US11082026B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11082026-B2 |
| Application number | US-202017097129-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 13, 2020 |
| Priority date | May 16, 2018 |
| Publication date | Aug 3, 2021 |
| Grant date | Aug 3, 2021 |
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- Title
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Abstract
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A bonded body includes a supporting substrate; a piezoelectric material substrate composed of a material selected from the group consisting of lithium niobate, lithium tantalate and lithium niobate-lithium tantalate; and a bonding layer bonding the supporting substrate and the piezoelectric material substrate and contacting a main surface of the piezoelectric material substrate. The bonding layer includes a void extending from the piezoelectric material substrate toward the supporting substrate. A ratio (t 2 /t 1 ) of a width t 2 at an end of the void on a side of the supporting substrate with respect to a width t 1 at an end of the void on a side of the piezoelectric material substrate is 0.8 or lower.
First claim
Opening claim text (preview).
The invention claimed is: 1. A bonded body comprising: a supporting substrate; a piezoelectric material substrate comprising a material selected from the group consisting of lithium niobate, lithium tantalate and lithium niobate-lithium tantalate; and a bonding layer bonding said supporting substrate and said piezoelectric material substrate and contacting a main surface of said piezoelectric material substrate, wherein said bonding layer comprises a void extending from said piezoelectric material substrate toward said supporting substrate, and wherein a ratio t 2 /t 1 of a width t 2 at an end of said void on a side of said supporting substrate with respect to a width t 1 at an end of said void on a side of said piezoelectric material substrate is greater than zero and no more than 0.8. 2. The bonded body of claim 1 , wherein a recess is provided on said main surface of said piezoelectric material substrate and, wherein said end of said void on the side of said piezoelectric material substrate is communicated with said recess. 3. The bonded body of claim 1 , wherein said end of said void on the side of said supporting substrate reaches a bonding surface of said bonding layer on the side of said supporting substrate. 4. The bonded body of claim 1 , wherein said bonding layer comprises a material selected from the group consisting of silicon oxide and tantalum pentoxide. 5. The bonded body of claim 1 , wherein a bonding surface of said bonding layer on a side of said supporting substrate comprises a polished surface. 6. The bonded body of claim 1 , wherein said bonding layer contacts said supporting substrate. 7. The bonded body of claim 1 , further comprising an intermediate layer between said bonding layer and said supporting substrate. 8. The bonded body of claim 1 , wherein said piezoelectric material substrate has a thickness of 20 μm or smaller.
Assignees
Inventors
Classifications
Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement · CPC title
by reactive sputtering · CPC title
of bulk wave excitation and reflections · CPC title
of lithium niobate or lithium-tantalate substrates · CPC title
Niobates; Vanadates; Tantalates · CPC title
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Frequently asked questions
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- What does patent US11082026B2 cover?
- A bonded body includes a supporting substrate; a piezoelectric material substrate composed of a material selected from the group consisting of lithium niobate, lithium tantalate and lithium niobate-lithium tantalate; and a bonding layer bonding the supporting substrate and the piezoelectric material substrate and contacting a main surface of the piezoelectric material substrate. The bonding lay…
- Who is the assignee on this patent?
- Ngk Insulators Ltd
- What technology area does this patent fall under?
- Primary CPC classification H03H9/02574. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 03 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).