OLED encapsulation structure, display device and method for manufacturing OLED encapsulation structure

Patent metadata

Field	Value
Publication number	US-11081671-B2
Application number	US-201816345272-A
Country	US
Kind code	B2
Filing date	Jul 27, 2018
Priority date	Aug 2, 2017
Publication date	Aug 3, 2021
Grant date	Aug 3, 2021

Abstract

The present disclosure discloses an OLED encapsulation structure, a display device and a method for manufacturing an OLED encapsulation structure. The OLED encapsulation structure includes an OLED device and a plurality of film layers covering the OLED device. The plurality of film layers includes an inorganic layer and an organic layer stacked alternately, and contacting surfaces of any two film layers in contact with each other among the plurality of film layers include complementary topographies such that the any two film layers in contact with each other are stuck with each other.

First claim

We claim:

1. An OLED encapsulation structure, comprising:
an OLED device, and
a plurality of film layers and a buffer layer covering the OLED device from different sides of the OLED device,
wherein the plurality of film layers comprises inorganic layers and organic layers stacked alternately and contacting surfaces of any two film layers in contact with each other among the plurality of film layers comprise complementary topographies such that the any two film layers in contact with each other are stuck with each other,
wherein the complementary topographies comprise first semicircular engaging slots on one of the any two film layers in contact with each other and first semicircular engaging protrusions on other one of the any two film layers in contact with each other, wherein the first semicircular engaging slots are separated by flat parts of the one of the any two film layers in contact with each other, the first semicircular engaging protrusions are separated by flat parts of the other one of the any two film layers in contact with each other, the first semicircular engaging protrusions are stuck in the first semicircular engaging slots,
wherein a shape of a longitudinal section of each of the first semicircular engaging slots and a shape of a longitudinal section of each of the first semicircular engaging protrusions are semicircular shapes, the shape of the longitudinal section of each of the first semicircular engaging slots corresponds to the shape of the longitudinal section of each of first semicircular engaging protrusions, and
wherein the plurality of film layers comprises first film layers, second film layers and third film layers, the first film layers comprise a film layer closest to the OLED device and a film layer farthest from the OLED device, the second film layers are inorganic layers not belonging to the first film layers, and the third film layers are organic layers not belonging to the first film layers,
wherein two film surfaces of each of the second film layers are provided with the first semicircular engaging slots, and two film surfaces of each of the third film layers are provided with the first semicircular engaging protrusions,
wherein the film layer closest to the OLED device is directly stuck with the buffer layer through a first mating mechanism that is located at a terminal of the film layer closest to the OLED device, and each one of the second film layers is directly stuck with the buffer layer through a respective second mating mechanism that is located at a terminal of the each one of the second film layers.

2. The OLED encapsulation structure according to claim 1 , wherein
orthographic projections of the first semicircular engaging slots on the two film surfaces of each of the second film layers, which are projected on a plane of the second film layers, do not have an overlapping area, and
orthographic projections of the first semicircular engaging protrusions on the two film surfaces of each of the third film layer, which are projected on a plane of the third film layers, do not have an overlapping area.

3. The OLED encapsulation structure according to claim 1 , wherein
orthographic projections of the first semicircular engaging slots on the two film surfaces of each of the second film layers, which are projected on a plane of the second film layers, have an overlapping area, and
orthographic projections of the first semicircular engaging protrusions on the two film surfaces of each of the third film layers, which are projected on a plane of the third film layers, have an overlapping area.

4. The OLED encapsulation structure according to claim wherein each of the first film layers comprises a first film surface in contact with a film layer of the plurality of film layers not belonging to the first film layers, wherein the first film surface comprises the first semicircular engaging slots.

5. The OLED encapsulation structure according to claim 1 , wherein:
each of the first mating mechanism and the respective second mating mechanism comprises a second engaging slot and a second engaging protrusion,
the second engaging protrusion is stuck in the second engaging slot,
the second engaging slot of the first mating mechanism is located on the buffer layer and the second engaging protrusion of the first mating mechanism is located on the film layer closest to the OLED device, and
the second engaging slot of the respective second mating mechanism is located on the buffer layer and the second engaging protrusion of the respective second mating mechanism is located on the each one of the second film layers.

6. The OLED encapsulation structure according to claim 5 , wherein:
a shape of a longitudinal section of the second engaging slot and a shape of a longitudinal section of the second engaging protrusion comprise any one of a semicircular shape, a trapezoidal shape, a U shape, a V shape and a rectangular shape; and
the shape of the longitudinal section of the second engaging slot corresponds to the shape of the longitudinal section of the second engaging protrusion.

7. A display device, comprising the OLED encapsulation structure according to claim 1 .

8. The OLED encapsulation structure according to claim 1 , wherein:
each of the first mating mechanism and the respective second mating mechanism comprises a second engaging slot and a second engaging protrusion, the second engaging protrusion is stuck in the second engaging slot,
the second engaging protrusion of the first mating mechanism is located on the buffer layer and the second engaging slot of the first mating mechanism is located on the film layer closest to the OLED device, and
the second engaging protrusion of the respective second mating mechanism is located on the buffer layer and the second engaging slot of the respective second mating mechanism is located on the each one of the second film layers.

9. The OLED encapsulation structure according to claim 8 , wherein:
a shape of a longitudinal structure of the second engaging slot and a shape of a longitudinal section of the second engaging protrusion comprise any one of a semicircular shape, a trapezoidal shape, a U shape, a V shape and a rectangular shape;
the shape of the longitudinal section of the second engaging slot corresponds to the shape of the longitudinal section of the second engaging protrusion.

10. A method for manufacturing an OLED encapsulation structure, comprising the steps of:
forming a buffer layer and forming an OLED device on the buffer layer;
forming a first inorganic layer covering the OLED device and having first semicircular engaging slots, wherein a shape of a longitudinal section of each of the first semicircular engaging slots is a semicircular shape, the first semicircular engaging slots are separated by flat parts of the first inorganic layer, the first inorganic layer is stuck with the buffer layer through a first a mating mechanism that is located at a terminal of the first inorganic layer;
forming an organic layer covering the first inorganic layer and having first semicircular engaging protrusions on its both sides, wherein the first semicircular engaging protrusions are separated by flat parts of the organic layer, a part of the first semicircular engaging protrusions that are on a side of the organic layer facing the first inorganic layer are stuck in the first semicircular engaging slots, wherein a shape of a longitudinal section of each of the first semicircular engaging protrusions is a semicircular shape, the shape of the longitudinal section of each of the first semicircular engaging slots corresponds to the shape of the longitudinal section of each of the first semicircular engaging protrusions;
forming a se

Assignees

• Chengdu Boe Optoelect Tech Co
• Boe Technology Group Co Ltd

Inventors

• Zhang Guolin
• Cheng Jiuyang
• Zou Jiahong
• Xiao Wenhao
• Mou liangfeng
• Li Junliang

Classifications

• H10K50/8445

  multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers · CPC title

• H10K59/8731 Primary

  multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers · CPC title

• H01L51/5256 Primary

  Electricity · mapped topic

• H01L51/524

  Electricity · mapped topic

• H10K50/841

  Self-supporting sealing arrangements · CPC title