Universal sub slot architecture for networking modules

Patent metadata

Field	Value
Publication number	US-11079559-B2
Application number	US-201916391642-A
Country	US
Kind code	B2
Filing date	Apr 23, 2019
Priority date	Apr 23, 2019
Publication date	Aug 3, 2021
Grant date	Aug 3, 2021

Abstract

A universal sub slot module is configured to be inserted in a slot in a hardware module that is configured to be inserted in one of a chassis and rack mounted unit. The universal sub slot module includes a printed circuit board; an optics component on the printed circuit board; a data plane and a control plane on the printed circuit board and communicatively coupled to the optics components; and connectors on the printed circuit board and communicatively coupled to the data plane and the control plane, wherein the connectors are configured to connect to corresponding connectors in the one or more hardware modules.

First claim

What is claimed is:

1. A network element comprising:
one or more hardware modules each having one or more slots, each of the one or more hardware modules being one of a chassis-based module and a rack mounted unit;
one or more universal sub slot modules each configured to be inserted in the one or more slots of the one or more hardware modules, wherein each of the one or more universal sub slot modules includes
an optics component;
a data plane and a control plane communicatively coupled to the optics component;
connectors communicatively coupled to the data plane and the control plane and the connectors are configured to connect to corresponding connectors in the one or more hardware modules; and
a filler module for each unequipped slot of the one or more slots, wherein the filler module is a passive module without a connector, wherein the one or more hardware modules each include one of i) a Hall effect Sensor to detect a presence of the filler module based on a magnet thereon and ii) a metal detector to detect a presence of the filler module based on producing an alternating current and detecting a magnetic field produced by the filler module.

2. The network element of claim 1 , wherein the each of the one or more universal sub slot modules includes a first printed circuit board supporting the optics component, the data plane, the control plane, and the connectors, and wherein the one or more hardware modules each include rails in the one or more slots that provide guidance for inserting a corresponding universal sub slot module and stabilization for the corresponding universal sub slot module once inserted.

3. The network element of claim 2 , wherein the universal sub slot module further includes a second printed circuit board adapted to connect to connectors of the hardware module, and wherein the first printed circuit board includes a reduced thickness at an interconnect between the first printed circuit board and the second printed circuit board relative to a thickness of the first printed circuit board carrying cages for small form factor pluggable interfaces.

4. The network element of claim 1 , wherein the data plane includes a plurality of lanes each supporting one of 28 Gbps and 56 Gbps such that the one or more universal sub slot modules each support between 800 Gbps and 1.6 Tbps.

5. The network element of claim 1 , wherein the one or more universal sub slot modules are each latched in a corresponding slot of the one or more slots via a latch on a faceplate of a corresponding hardware module.

6. The network element of claim 1 , wherein a universal sub slot module of the one or more universal sub slot modules has the optics component as a coherent modem.

7. The network element of claim 1 , wherein a universal sub slot module of the one or more universal sub slot modules has the optics component as 5 Quad Small Form-factor Pluggable (QSFP) interfaces.

8. The network element of claim 1 , wherein a universal sub slot module of the one or more universal sub slot modules has the optics component 12 Small Form-factor Pluggable (SFP) interfaces.

9. The network element of claim 1 , wherein at least one of the universal sub slot modules has a plurality of Small Form-factor Pluggable (SFP) interfaces, and wherein the at least one of the universal sub slot modules includes
a first printed circuit board having a cage for each of the plurality of SFP interfaces and a second printed circuit board having the connectors, wherein a portion of the first printed circuit board is recessed for a fixed height connector between the first printed circuit board and the second printed circuit board.

10. A universal sub slot module configured to be inserted in a slot in a hardware module that is configured to be inserted in one of a chassis and rack mounted sem, the universal sub slot module comprising:
a printed circuit board;
an optics component on the printed circuit board;
a data plane and a control plane on the printed circuit board and communicatively coupled to the optics component;
connectors on the printed circuit board and communicatively coupled to the data plane and the control plane, wherein the connectors are configured to connect to corresponding connectors in the one or more hardware modules; and
an Electrically Erasable Programmable Read-Only Memory (EEPROM) having Vital Product Date (VPD) and Runtime Product Date (RPD), wherein the EEPROM is configured to be accesible from the hardware module without powering the universal sub slot module, wherein
the universal sub slot module is adapted to mate with the hardware module that is one of a chassis-based module and a rack mounted unit.

11. The universal sub slot module of claim 10 , wherein the hardware module includes rails in the slot that provides guidance for inserting the universal sub slot module and stabilization for the universal sub slot module once inserted.

12. The universal sub slot module of claim 10 , wherein the data plane includes a plurality of lanes each supporting one of 28 Gbps and 56 Gbps such that the universal sub slot module supports between 800 Gbps and 1.6 Tbps.

13. The universal sub slot module of claim 10 , wherein the universal sub slot module is latched in the slot via a latch on a faceplate of the hardware module.

14. The universal sub slot module of claim 10 , wherein the optics component is a coherent modem.

15. The universal sub slot module of claim 10 , wherein the optics component is 5 Quad Small Form-factor Pluggable (QSFP) interfaces.

16. The universal sub slot module of claim 10 , wherein the optics component is 12 Small Form-factor Pluggable (SFP) interfaces.

17. The universal sub slot module of claim 10 , wherein the universal sub slot module has a plurality of Small Form-factor Pluggable (SFP) interfaces, and wherein the printed circuit board comprises a first printed circuit board having a cage for each of the plurality of SFP interfaces and a second printed circuit board having the connectors, wherein a portion of the first printed circuit board is recessed for a fixed height connector between the first printed circuit board and the second printed circuit board.

18. A universal sub slot module configured to be inserted in a slot in a hardware module that is configured to be inserted in one of a chassis and rack mounted system, the universal sub slot module comprising:
a first printed circuit board;
an optics component on the first printed circuit board;
a data plane and a control place on the first printed circuit board and communicatively coupled to the optics component;
connectors communicatively coupled to the date pane and the control plane, wherein the connectors are configured to connect to corresponding connectors in the one or more hardware modules; and
a second printed circuit board including the connectors thereon adapted to connect to the connectors of the hardware module, and wherein the first printed circuit board includes a reduced thickness at an interconnect between the first printed circuit board and the second printed circuit board relative to a thickness of the first printed circuit board carrying cages for small form factor pluggable interfaces, wherein
the universal sub slot module is adapted to mate with the hardware module that is one of a chassis-based module and a rack mounted unit.

Assignees

• Ciena Corp

Inventors

• Leclair Marc
• O'Leary Mitchell
• Benvenuti Nicola
• Mcgale James
• Rivaud Daniel
• Button Sheldon

Classifications

• G06F1/185

  Mounting of expansion boards · CPC title

• G06F13/4022 Primary

  using switching circuits, e.g. switching matrix, connection or expansion network (G06F13/4009 takes precedence) · CPC title

• G02B6/4292

  the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements · CPC title

• G02B6/4246 Primary

  Bidirectionally operating package structures · CPC title

• G06F1/189

  Power distribution · CPC title