Adhesion promoter compositions and primer compositions for metal-plastic hybrid components

US11078390B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11078390-B2
Application numberUS-201916282739-A
CountryUS
Kind codeB2
Filing dateFeb 22, 2019
Priority dateJan 29, 2013
Publication dateAug 3, 2021
Grant dateAug 3, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.

First claim

Opening claim text (preview).

The invention claimed is: 1. A primer composition comprising: (a) 8%-23% by weight of at least one polymer B selected from the group consisting of saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof; (b) 1.5%-15% by weight of at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof; (c) 10%-40% by weight of at least one copolyamide-based hotmelt adhesive comprising a copolyamide, at least one block isocyanate, and at least one epoxy component; and (d) 30%-80% by weight of at least one organic solvent, based in each case on the total weight of the primer, where the percentages of all the constituents add up to 100% by weight, wherein the epoxy component of the hotmelt adhesive c) is different from the epoxy resins of the polymer B. 2. A coating comprising at least one layer of the primer composition according to claim 1 . 3. A process for producing a hybrid component comprising metal and plastic, the process comprising: applying at least one layer of the primer composition according to claim 1 to the metal; then thermally crosslinking the primer composition; and then applying the plastic to the coated metal and bonding the metal to the plastic. 4. The process according to claim 3 , wherein at least one layer of an adhesion promoter composition is applied to the thermally crosslinked primer composition and the adhesion promoter composition is thermally crosslinked before the plastic is applied to the coated metal and the metal is bonded to the plastic. 5. The process according to claim 4 , wherein the adhesion promoter composition comprises: at least one polymer A selected from the group consisting of at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyimide resins and mixtures thereof; and at least one copolyamide-based hotmelt adhesive. 6. A metal substrate coated with at least one primer composition according to claim 1 .

Assignees

Inventors

Classifications

  • in the primer coating · CPC title

  • C09J163/00Primary

    Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

  • Phenols · CPC title

  • involving heating of the applied adhesive · CPC title

  • masked with compounds having only one group containing active hydrogen · CPC title

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Frequently asked questions

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What does patent US11078390B2 cover?
The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally describ…
Who is the assignee on this patent?
Evonik Operations Gmbh, Si Coatings Gmbh
What technology area does this patent fall under?
Primary CPC classification C09J163/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Aug 03 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).