Adhesion promoter compositions and primer compositions for metal-plastic hybrid components

US10273390B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10273390-B2
Application numberUS-201414764408-A
CountryUS
Kind codeB2
Filing dateJan 29, 2014
Priority dateJan 29, 2013
Publication dateApr 30, 2019
Grant dateApr 30, 2019

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  1. Title

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  2. Abstract

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  5. First independent claim

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  6. CPC / IPC classifications

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Abstract

Official abstract text for this publication.

The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.

First claim

Opening claim text (preview).

The invention claimed is: 1. An adhesion promoter composition, comprising: a) at least one polymer A selected from the group consisting of at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins, and mixtures thereof; and b) at least one hotmelt adhesive comprising a copolyamide, at least one blocked polyisocyanate and at least one epoxy component, wherein: the copolyamide of the hotmelt adhesive b) is different from the polyamide resins of the polymer A; and the epoxy component of the hotmelt adhesive b) is different from epoxy resins of the polymer A. 2. The adhesion promoter composition according to claim 1 , comprising: a) 5% to 25% by weight of the at least one polymer A; b) 5% to 50% by weight of the at least one hotmelt adhesive; and c) 30% to 80% by weight of at least one organic solvent, based in each case on a total weight of the composition, where the percentages of all the constituents add up to 100% by weight. 3. The adhesion promoter composition according to claim 1 , further comprising at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof. 4. A coating, comprising at least one layer of the adhesion promoter composition according to claim 1 . 5. A hybrid component, comprising metal and plastic, wherein the metal has been bonded to the plastic at least by a coating according to claim 4 . 6. A process for producing a hybrid component comprising metal and plastic, the process comprising applying the coating according to claim 4 as adhesion promoter between the metal and the plastic. 7. A process for producing a hybrid component comprising metal and plastic, the process comprising: a) applying at least one layer of the adhesion promoter composition according to claim 1 to the metal; b) thermally crosslinking the composition; and c) then applying the plastic to the coated metal and bonding the metal to the plastic. 8. The process according to claim 7 , wherein the plastic is applied to the coated metal by injection moulding, pressing, laminating, in-mould coating or (co-)extrusion.

Assignees

Inventors

Classifications

  • on metal layer · CPC title

  • Polyamides derived from polyamines and polycarboxylic acids (C09J177/10 takes precedence) · CPC title

  • Presence of polyamide · CPC title

  • in the primer coating · CPC title

  • masked with compounds having only one group containing active hydrogen · CPC title

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What does patent US10273390B2 cover?
The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally describ…
Who is the assignee on this patent?
Henkenjohann Willi, Kuhmann Karl, Gruhn Maximilian, and 6 more
What technology area does this patent fall under?
Primary CPC classification C09J163/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 30 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).