Thermal management solutions for stacked integrated circuit devices using unidirectional heat transfer devices
US-2019343017-A1 · Nov 7, 2019 · US
Heat conduction structure or semiconductor apparatus
US11075140B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11075140-B2 |
| Application number | US-201916449999-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 24, 2019 |
| Priority date | Jun 28, 2018 |
| Publication date | Jul 27, 2021 |
| Grant date | Jul 27, 2021 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
The disclosure provides a heat conduction structure with higher heat conductivity. This embodiment is a heat conduction structure where heat is conducted from a first member to a second member. The heat conduction structure includes at least one self-assembled monolayer and a heat dissipation grease. The self-assembled monolayer is formed on at least one surface of the first member and the second member. The heat dissipation grease is disposed between the first member and the second member. The heat dissipation grease is in contact with the self-assembled monolayer.
First claim
Opening claim text (preview).
What is claimed is: 1. A heat conduction structure where heat is conducted from a first member to a second member, comprising: at least one self-assembled SAM formed on at least one surface of the first member and the second member; and a heat dissipation grease disposed between the first member and the second member, the heat dissipation grease being in contact with the at least one SAM, wherein the at least one SAM is formed of a SAM-forming material that has a head group, and the head group forms a covalent bond with a functional group that exists on the surface of the first member or the second member. 2. The heat conduction structure according to claim 1 , wherein the SAM-forming material has a tail group in addition to the head group, and the tail group has hydrophobicity. 3. The heat conduction structure according to claim 2 , wherein the at least one SAM has a water contact angle of 70° or more. 4. The heat conduction structure according to claim 1 , wherein the SAM-forming material is an organic silane compound. 5. The heat conduction structure according to claim 1 , wherein the heat dissipation grease contains a mineral oil, an ester-based synthetic oil, a synthetic hydrocarbon oil, a silicone oil, or a fluorinated oil as a base oil. 6. The heat conduction structure according to claim 1 , wherein the first member is a heat generating member, and the second member is a heat dissipation member. 7. A semiconductor apparatus that includes the heat conduction structure according to claim 1 , wherein the first member is a semiconductor module. 8. The heat conduction structure according to claim 1 , wherein the at least one SAM is formed on a surface of the first member and a surface of the second member. 9. The heat conduction structure according to claim 1 , wherein the at least one SAM is formed on a surface of the first member and on a surface of the second member, and the surface of the first member faces the surface of the second member.
Assignees
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Classifications
Encapsulations, e.g. protective coatings · CPC title
Auxiliary members · CPC title
Dispositions of multiple die-attach connectors · CPC title
changes in dispositions · CPC title
Multiple chips on leadframes · CPC title
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Frequently asked questions
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- What does patent US11075140B2 cover?
- The disclosure provides a heat conduction structure with higher heat conductivity. This embodiment is a heat conduction structure where heat is conducted from a first member to a second member. The heat conduction structure includes at least one self-assembled monolayer and a heat dissipation grease. The self-assembled monolayer is formed on at least one surface of the first member and the seco…
- Who is the assignee on this patent?
- Bessho Takeshi, Deguchi Masataka, Saito Nagahiro, and 3 more
- What technology area does this patent fall under?
- Primary CPC classification H10W40/70. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jul 27 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).