Substrate fixing carrier, evaporation device and evaporation method

Patent metadata

Field	Value
Publication number	US-11072854-B2
Application number	US-201816213403-A
Country	US
Kind code	B2
Filing date	Dec 7, 2018
Priority date	Jan 25, 2018
Publication date	Jul 27, 2021
Grant date	Jul 27, 2021

Abstract

A substrate fixing carrier includes a supporting frame and a cooling plate. The supporting frame defines a hollow region and a supporting portion at an inner wall of the supporting frame. The cooling plate and the supporting frame are movable towards each other until the cooling plate is in the hollow region with edges of the cooling plate aligning with the supporting portion. When a rectangular to-be-evaporated substrate is placed in the hollow region with edges of the rectangular to-be-evaporated substrate between the supporting portion and the cooling plate, a distance between each edge of the cooling plate corresponding to each long side of the to-be-evaporated substrate and the supporting portion is greater than or equal to a thickness of the to-be-evaporated substrate, and a distance between each edge of the cooling plate corresponding to each short side of the to-be-evaporated substrate and the supporting portion is less than the thickness of the to-be-evaporated substrate.

First claim

What is claimed is:

1. A substrate fixing carrier comprising:
a supporting frame; and
a cooling plate;
wherein the supporting frame defines a hollow region, and includes an inner wall surrounding the hollow region and a supporting portion at the inner wall;
the cooling plate and the supporting frame are configured to be movable towards each other until the cooling plate is in the hollow region with edges of the cooling plate aligning with the supporting portion; and
the cooling plate and the supporting portion are configured to, when a rectangular to-be-evaporated substrate is placed in the hollow region with edges of the rectangular to-be-evaporated substrate between the supporting portion and the cooling plate, enable a distance between each edge of the cooling plate corresponding to each long side of the to-be-evaporated substrate and the supporting portion to be greater than or equal to a thickness of the to-be-evaporated substrate, and enable a distance between each edge of the cooling plate corresponding to each short side of the to-be-evaporated substrate and the supporting portion to be less than the thickness of the to-be-evaporated substrate;
wherein the distance between each edge of the cooling plate corresponding to each long side of the to-be-evaporated substrate and the supporting portion is G 1 which is set to be D Glass ≤G 1 ≤D Glass +⅔D Glass , wherein D Glass represents the thickness of the to-be-evaporated substrate;
the distance between each edge of the cooling plate corresponding to each short side of the to-be-evaporated substrate and the supporting portion is G 2 , which is set to be D Glass −⅔D Glass ≤G 2 ≤D Glass −⅕D Glass .

2. The substrate fixing carrier of claim 1 , wherein the distance G 1 between each edge of the cooling plate corresponding to each long side of the to-be-evaporated substrate and the supporting portion is set to be D Glass ≤G 1 ≤D Glass +½D Glass ;
the distance G 2 between each edge of the cooling plate corresponding to each short side of the to-be-evaporated substrate and the supporting portion is set to be ½D Glass −0.05≤G 2 ≤½D Glass +0.05.

3. The substrate fixing carrier of claim 2 , wherein the thickness of the to-be-evaporated substrate is 0.5 mm; the distance G 1 between each edge of the cooling plate corresponding to each long side of the to-be-evaporated substrate and the supporting portion is 0.6 mm˜0.7 mm; and the distance G 2 between each edge of the cooling plate corresponding to each short side of the to-be-evaporated substrate and the supporting portion is 0.25 mm˜0.3 mm.

4. The substrate fixing carrier of claim 3 , wherein the distance G 1 between each edge of the cooling plate corresponding to each long side of the to-be-evaporated substrate and the supporting portion is 0.7 mm; and the distance G 2 between each edge of the cooling plate corresponding to each short side of the to-be-evaporated substrate and the supporting portion is 0.3 mm.

5. An evaporation device comprising the substrate fixing carrier of claim 1 .

6. The evaporation device of claim 5 , further comprising a mask plate carrier configured to carry a mask plate; wherein the mask plate carrier is below the substrate fixing carrier.

Assignees

• Boe Technology Group Co Ltd
• Ordos Yuansheng Optoelectronics Co Ltd

Inventors

• Liu Jindong
• Fan Chaolong
• Liu Le
• Yang Xiaocui

Classifications

• C23C14/50 Primary

  Substrate holders · CPC title

• C23C14/541

  Heating or cooling of the substrates · CPC title

• C23C14/24

  Vacuum evaporation · CPC title

• C23C14/042

  using masks · CPC title

• H01L51/0011

  Electricity · mapped topic