Process and device for cooling a metal substrate

US11072839B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11072839-B2
Application numberUS-201615779961-A
CountryUS
Kind codeB2
Filing dateDec 29, 2016
Priority dateDec 30, 2015
Publication dateJul 27, 2021
Grant dateJul 27, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A process for cooling a metal substrate running in a longitudinal direction, said process including ejecting at least one first cooling fluid jet on a first surface of said substrate and at least one second cooling fluid jet on a second surface of said substrate, said first and second cooling fluid jets being ejected at a cooling fluid velocity higher than or equal to 5 m/s, so as to form on said first surface and on said second surface a first laminar cooling fluid flow and a second laminar flow respectively, said first and second laminar cooling fluid flows being tangential to the substrate, said first and second laminar cooling fluid flows extending over a first predetermined length and a second predetermined length of the substrate respectively, said first and second lengths being determined so that the substrate is cooled from a first temperature to a second temperature by nucleate boiling.

First claim

Opening claim text (preview).

What is claimed is: 1. A process of cooling a metal substrate running in a longitudinal direction, said process comprising ejecting at least one first cooling fluid jet on a first surface of the substrate and at least one second cooling fluid jet on a second surface of the substrate, the first and second cooling fluid jets being ejected at a cooling fluid velocity higher than or equal to 5 m/s, so as to form on the first surface of the substrate and on the second surface of the substrate a first laminar cooling fluid flow and a second laminar cooling fluid flow respectively, the first and second laminar cooling fluid flows being tangential to the substrate, the first and second laminar cooling fluid flows extending over a first predetermined length and a second predetermined length of the substrate respectively, the first and the second cooling fluid jets each forming during their ejection a predetermined angle with the longitudinal direction, said predetermined angle being comprised between 5° and 25° and said first and second predetermined lengths being determined so that the substrate is cooled from a first temperature to a second temperature by nucleate boiling. 2. The process according to claim 1 , wherein a difference between the first predetermined length and the second predetermined length is lower than 10% of a mean of the first and the second predetermined lengths. 3. The process according to claim 1 , wherein the first cooling fluid jet and the second cooling fluid jet are symmetrical with respect to a median plane of the substrate. 4. The process according to claim 1 , wherein said first and said second cooling fluid jets are ejected from a predetermined distance on said first and second surfaces respectively, said predetermined distance being comprised between 50 and 200 mm. 5. The process according to claim 1 , wherein each of said first and second predetermined lengths is comprised between 0.2 m and 1.5 m. 6. The process according to claim 1 , wherein the first temperature is higher than or equal to 600° C. 7. The process according to claim 6 , wherein the first temperature is higher than or equal to 800° C. 8. The process according to claim 1 , wherein the substrate is running at a speed comprised between 0.2 m/s and 4 m/s. 9. The process according to claim 1 , wherein a mean heat flux extracted from each of the first and second surfaces during the cooling from the first temperature to the second temperature is comprised between 3 and 7 MW/m 2 . 10. The process according to claim 1 , wherein, the substrate has a thickness comprised between 2 and 9 mm, and the substrate is cooled from 800° C. to 550° C. at a cooling rate higher than or equal to 200° C./s. 11. The process according to claim 1 , wherein each of said first and second cooling fluid jets is ejected with a specific cooling fluid flow rate comprised between 360 and 2700 L/min/m 2 . 12. The process according to claim 1 , wherein the substrate is a steel plate. 13. The process according to claim 1 , wherein, the substrate has a width, and said first and second laminar cooling fluid flows extend over the width of the substrate. 14. A method for hot-rolling a metal substrate, said method comprising hot-rolling the metal substrate and cooling the hot-rolled metal substrate with a process according to claim 1 . 15. A method for heat-treating a metal substrate, said method comprising heat-treating the metal substrate and cooling the heat-treated metal substrate with a process according to claim 1 .

Assignees

Inventors

Classifications

  • for spray quenching · CPC title

  • with cooling · CPC title

  • for strips, sheets, or plates (B21B45/023, B21B45/0233 take precedence) · CPC title

  • C21D11/005Primary

    for cooling · CPC title

  • for lubricating, cooling, or cleaning {(in particular in combination with forging or pressing devices B21B15/005, control of flatness or profile using lubricating or cooling B21B37/44)} · CPC title

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What does patent US11072839B2 cover?
A process for cooling a metal substrate running in a longitudinal direction, said process including ejecting at least one first cooling fluid jet on a first surface of said substrate and at least one second cooling fluid jet on a second surface of said substrate, said first and second cooling fluid jets being ejected at a cooling fluid velocity higher than or equal to 5 m/s, so as to form on sa…
Who is the assignee on this patent?
Arcelormittal
What technology area does this patent fall under?
Primary CPC classification C21D11/005. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jul 27 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).