Method for manufacturing multilayer wiring board

Patent metadata

Field	Value
Publication number	US-11071214-B2
Application number	US-201616471706-A
Country	US
Kind code	B2
Filing date	Dec 22, 2016
Priority date	Dec 22, 2016
Publication date	Jul 20, 2021
Grant date	Jul 20, 2021

Abstract

Provided is a method of manufacturing a multilayer wiring board, in which electrical inspection can be performed with accurate probing while warpage of a multilayer laminate is reduced. This method includes providing a laminated sheet including a first support, a first release layer and a metal layer; alternately stacking wiring layers and insulating layers on a surface of the metal layer, wherein an n-th wiring layer being the uppermost layer includes an n-th connection pad; bonding a second support having an opening on a surface, remote from the laminated sheet, of the multilayer laminate with a second release layer therebetween such that at least a part of the n-th connection pad is disposed within the opening; releasing the first support from the reinforced multilayer laminate at the first release layer; and putting conductors into contact with the n-th connection pads of the reinforced multilayer laminate to perform electrical inspection.

First claim

The invention claimed is:

1. A method of manufacturing a multilayer wiring board comprising:
providing a laminated sheet comprising, in sequence, a first support, a first release layer, and a metal layer;
alternately stacking wiring layers and insulating layers on a surface of the metal layer to give a multilayer laminate, wherein an n-th wiring layer being the uppermost layer includes an n-th connection pad;
bonding a second support having an opening on a surface, remote from the laminated sheet, of the multilayer laminate with a second release layer therebetween, such that at least a part of the n-th connection pad is disposed within the opening to give a reinforced multilayer laminate, wherein the second release layer is applied to the entire area or the partial area of the surface to be bonded of the second support;
releasing the first support from the reinforced multilayer laminate at the position of the first release layer; and
putting conductors into contact with the n-th connection pads of the reinforced multilayer laminate to perform electrical inspection;
wherein a release strength of the second release layer is higher than the release strength of the first release layer.

2. The method according to claim 1 , wherein the second support has a spring deflection limit Kb 0.1 of 100 to 1500 N/mm 2 as measured in accordance with JIS H 3130-2012.

3. The method according to claim 1 , wherein the wiring layer initially formed on the surface, remote from the first release layer, of the metal layer is a first wiring layer including a first connection pad.

4. The method according to claim 1 , further comprising forming a first wiring layer including a first connection pad by etching the metal layer after releasing the first support and before the electrical inspection.

5. The method according to claim 1 , further comprising forming a first wiring layer including a first connection pad on a surface, remote from the insulating layer, of the metal layer after releasing the first support and before the electrical inspection.

6. The method according to claim 3 , further comprising:
attaching a plate having an opening onto the surface, adjacent to the first wiring layer, of the reinforced multilayer laminate after releasing the first support and before the electrical inspection such that at least a part of the first connection pad is disposed within the opening, and
detaching the plate after the electrical inspection.

7. The method according to claim 3 , wherein the step of electrical inspection includes putting conductors into contact with the first connection pads in addition to the n-th connection pads.

8. The method according to claim 1 , further comprising:
bonding a third support having no opening to the second support of the reinforced multilayer laminate with a third release layer therebetween before releasing the first support, wherein the third release layer is applied to the entire area or the partial area of the surface to be bonded of the third support; and
releasing the third support from the reinforced multilayer laminate at the position of the third release layer after releasing the first support and before the electrical inspection.

9. The method according to claim 1 , further comprising releasing the second support from the reinforced multilayer laminate at the position of the second release layer after the electrical inspection to give the multilayer wiring board.

Assignees

• Mitsui Mining & Smelting Co

Inventors

• Matsuura Yoshinori
• Seto Yasuhiro
• Nakamura Toshimi

Classifications

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H05K3/4697

  having cavities, e.g. for mounting components (H05K3/4691 takes precedence) · CPC title

• H05K1/0271 Primary

  Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion · CPC title

• G01R31/2801

  Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] (G01R31/318508 takes precedence; contactless testing G01R31/302; testing contacts or connections G01R31/66) · CPC title

• H05K3/4644

  by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602) · CPC title