Sensor with circuit protection module

US11070008B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11070008-B2
Application numberUS-202016784484-A
CountryUS
Kind codeB2
Filing dateFeb 7, 2020
Priority dateFeb 12, 2019
Publication dateJul 20, 2021
Grant dateJul 20, 2021

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present application provides a sensor, relates to sensing technology field, the sensor includes a sensor body, a main circuit module disposed in the sensor body and an sensing assembly electrically connect to the main circuit module, and further includes a circuit protection module disposed at outside of the sensor body and electrically connected to the main circuit module. In the present application, the main circuit module and the sensing assembly are used as the core components to achieve the functions of sensing and information conversion of the sensor; the circuit protection module is disposed outside the sensor body to realize the circuit protection function of the sensor. Specifically, the sensor can pass the test of the lightning surge test standard IEC61000-4-5 surge, and can also protect from static electricity of a high level and the impact of the electric fast transient pulse group; in addition, since the circuit protection module is disposed outside of the sensor body and the inner volume of the sensor is not occupied, such that the circuit protection performance of the sensor is further optimized and improved without any change on the inherent structure of the sensor body.

First claim

Opening claim text (preview).

What is claimed is: 1. A sensor, comprising a sensor body, wherein the sensor body comprises: a main circuit module, disposed in the sensor body; and a sensing assembly, disposed in the sensor body and configured to be electrically connected to the main circuit module; wherein the sensor further comprises a circuit protection module, the circuit protection module being disposed outside of the sensor body and configured to be electrically connected to the main circuit module; wherein the main circuit module is provided with a positive pole of an output terminal, a positive pole of a power supply terminal and a negative pole of a power supply terminal, and the circuit protection module comprises: a circuit board electrically connected to the main circuit module, and a first transient suppression diode disposed at the circuit board, wherein the first transient suppression diode is electrically connected between the positive pole of the power supply terminal and the negative pole of the power supply terminal. 2. The sensor of claim 1 , wherein the circuit protection module is provided with an anti-static circuit, and/or a lightning surge protection circuit, and/or an over-pulse protection circuit. 3. The sensor of claim 1 , wherein the circuit protection module comprises a transient suppression diode electrically connected to the main circuit module. 4. The sensor of claim 1 , wherein the circuit protection module comprises a piezoresistor electrically connected to the main circuit module. 5. The sensor of claim 1 , wherein the circuit protection module further comprises a second transient suppression diode disposed at the circuit board, and the second transient suppression diode is electrically connected between the positive pole of the output terminal and the negative pole of the power supply terminal. 6. The sensor of claim 1 , wherein the circuit protection module further comprises a third transient suppression diode disposed at the circuit board, and the third transient suppression diode is electrically connected between the positive pole of the power supply terminal and the positive pole of the output terminal. 7. A sensor, comprising a sensor body, wherein the sensor body comprises: a main circuit module, disposed in the sensor body; and a sensing assembly, disposed in the sensor body and configured to be electrically connected to the main circuit module; wherein the sensor further comprises a circuit protection module, the circuit protection module being disposed outside of the sensor body and configured to be electrically connected to the main circuit module; the sensor body comprises a bottom case and a connector disposed at the bottom case, the bottom case and the connector are connected to each other to form a first receiving cavity, the main circuit module is disposed in the first receiving cavity and electrically connected to the connector. 8. The sensor of claim 7 , wherein the connector is provided with output terminals, the circuit protection module comprises a circuit board electrically connected to the main circuit module, the circuit board is provided with pads, the output terminals are respectively welded and fixed at the pads. 9. The sensor of claim 8 , wherein the respective output terminal is welded adjacent to a side of the respective pad, or the respective output terminal is welded at a central portion of the respective pad. 10. The sensor of claim 8 , wherein the output terminals and the first transient suppression diode are respectively located at opposite surfaces of the circuit board. 11. A sensor, comprising a sensor body, wherein the sensor body comprises: a main circuit module, disposed in the sensor body; and a sensing assembly, disposed in the sensor body and configured to be electrically connected to the main circuit module; wherein the sensor further comprises a circuit protection module, the circuit protection module being disposed outside of the sensor body and configured to be electrically connected to the main circuit module; the sensing assembly comprises a diaphragm support and a a sensing element disposed at the diaphragm support, wherein the sensing element is electrically connected to the main circuit module. 12. The sensor of claim 7 , wherein the sensor further comprises a housing, and the housing covers the connector, wherein the housing is provided with a second receiving cavity therein, and the circuit protection module is disposed in the second receiving cavity. 13. The sensor of claim 12 , wherein the connector is provided with output terminals, the sensor further comprises a cable electrically connected to the output terminals and extending outside of the housing, the housing is provided with an opening for the cable to pass through. 14. The sensor of claim 12 , wherein the sensor further comprises a sealant, and the sealant is disposed at the position of the opening for sealing the opening and surrounding a periphery of the cable.

Assignees

Inventors

Classifications

  • Measuring or testing not otherwise provided for · CPC title

  • Housings for sensors · CPC title

  • responsive to excess current (responsive to abnormal temperature caused by excess current H02H5/04) · CPC title

  • using a short-circuiting device · CPC title

  • Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values · CPC title

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What does patent US11070008B2 cover?
The present application provides a sensor, relates to sensing technology field, the sensor includes a sensor body, a main circuit module disposed in the sensor body and an sensing assembly electrically connect to the main circuit module, and further includes a circuit protection module disposed at outside of the sensor body and electrically connected to the main circuit module. In the present a…
Who is the assignee on this patent?
Measurement Specialties China Ltd, Measurement Spec Inc, Measurement Specialities Inc
What technology area does this patent fall under?
Primary CPC classification H01R13/6683. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jul 20 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 9 related publications on this page (citations in our corpus or others sharing the same primary CPC).