Sub pixel light emitting diodes for direct view display and methods of making the same

US11069837B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11069837-B2
Application numberUS-201916389510-A
CountryUS
Kind codeB2
Filing dateApr 19, 2019
Priority dateApr 20, 2018
Publication dateJul 20, 2021
Grant dateJul 20, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A light emitting diode (LED) includes a n-doped semiconductor material layer located over a substrate, an active region including an optically active compound semiconductor layer stack configured to emit light located over the n-doped semiconductor material layer, a p-doped semiconductor material layer located over the active region and containing a nickel doped surface region, a conductive layer contacting the nickel doped surface region of the p-doped semiconductor material, and a device-side bonding pad layer electrically connected to the conductive layer.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of forming a light emitting diode (LED), comprising: forming a n-doped semiconductor material layer over a substrate; forming an active region including an optically active compound semiconductor layer stack configured to emit light on the n-doped semiconductor material layer; forming a p-doped semiconductor material layer on the active region; depositing a nickel layer directly on the p-doped semiconductor material layer; etching back the nickel layer to expose a nickel-doped surface region of the p-doped semiconductor layer; and forming a conductive layer on the exposed nickel-doped surface region. 2. The method of claim 1 , wherein the nickel layer is completely removed from the p-doped semiconductor material layer surface after the step of etching back the nickel layer. 3. The method of claim 1 , wherein: the conductive layer comprises a platinum layer which contacts the nickel-doped surface region of the p-doped semiconductor material layer; and the p-doped semiconductor material layer comprises p-doped gallium nitride or p-doped aluminum gallium nitride. 4. The method of claim 3 , further comprising: forming a silver layer over the platinum layer; and forming a device-side bonding pad layer over the silver layer. 5. The method of claim 1 , wherein: the conductive layer comprises a silver layer which contacts the nickel-doped surface region of the p-doped semiconductor material layer; and the p-doped semiconductor material layer comprises p-doped gallium nitride or p-doped aluminum gallium nitride. 6. A method of forming a light emitting diode (LED), comprising: forming a n-doped semiconductor material layer over a substrate; forming an active region including an optically active compound semiconductor layer stack configured to emit light on the n-doped semiconductor material layer; forming a p-doped semiconductor material layer on the active region; depositing a nickel layer directly on the p-doped semiconductor material layer; etching back the nickel layer to form residual nickel layer having an effective thickness of one to three monolayers of nickel atoms, or to expose a nickel-doped surface region of the p-doped semiconductor layer; and forming a conductive layer on the residual nickel layer or the exposed nickel-doped surface region; wherein: the step of etching back the nickel layer forms the residual nickel layer; and the step of forming a conductive layer comprises depositing a transparent conductive oxide on the p-doped semiconductor layer and forming a nickel-doped conductive oxide layer between the p-doped semiconductor material layer and the conductive layer. 7. The method of claim 6 , further comprising forming a reflector on the conductive layer and forming a device-side bonding pad layer on the reflector.

Assignees

Inventors

Classifications

  • Package configurations · CPC title

  • of interconnections · CPC title

  • of electrodes · CPC title

  • characterised by the dopants · CPC title

  • characterised by crystalline imperfections, e.g. dislocations; characterised by the distribution of dopants, e.g. delta-doping · CPC title

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What does patent US11069837B2 cover?
A light emitting diode (LED) includes a n-doped semiconductor material layer located over a substrate, an active region including an optically active compound semiconductor layer stack configured to emit light located over the n-doped semiconductor material layer, a p-doped semiconductor material layer located over the active region and containing a nickel doped surface region, a conductive lay…
Who is the assignee on this patent?
Glo Ab
What technology area does this patent fall under?
Primary CPC classification H10H20/835. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jul 20 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).