Method of forming an array of a multi-device unit cell
US-2017301660-A1 · Oct 19, 2017 · US
US11069837B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11069837-B2 |
| Application number | US-201916389510-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 19, 2019 |
| Priority date | Apr 20, 2018 |
| Publication date | Jul 20, 2021 |
| Grant date | Jul 20, 2021 |
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A light emitting diode (LED) includes a n-doped semiconductor material layer located over a substrate, an active region including an optically active compound semiconductor layer stack configured to emit light located over the n-doped semiconductor material layer, a p-doped semiconductor material layer located over the active region and containing a nickel doped surface region, a conductive layer contacting the nickel doped surface region of the p-doped semiconductor material, and a device-side bonding pad layer electrically connected to the conductive layer.
Opening claim text (preview).
The invention claimed is: 1. A method of forming a light emitting diode (LED), comprising: forming a n-doped semiconductor material layer over a substrate; forming an active region including an optically active compound semiconductor layer stack configured to emit light on the n-doped semiconductor material layer; forming a p-doped semiconductor material layer on the active region; depositing a nickel layer directly on the p-doped semiconductor material layer; etching back the nickel layer to expose a nickel-doped surface region of the p-doped semiconductor layer; and forming a conductive layer on the exposed nickel-doped surface region. 2. The method of claim 1 , wherein the nickel layer is completely removed from the p-doped semiconductor material layer surface after the step of etching back the nickel layer. 3. The method of claim 1 , wherein: the conductive layer comprises a platinum layer which contacts the nickel-doped surface region of the p-doped semiconductor material layer; and the p-doped semiconductor material layer comprises p-doped gallium nitride or p-doped aluminum gallium nitride. 4. The method of claim 3 , further comprising: forming a silver layer over the platinum layer; and forming a device-side bonding pad layer over the silver layer. 5. The method of claim 1 , wherein: the conductive layer comprises a silver layer which contacts the nickel-doped surface region of the p-doped semiconductor material layer; and the p-doped semiconductor material layer comprises p-doped gallium nitride or p-doped aluminum gallium nitride. 6. A method of forming a light emitting diode (LED), comprising: forming a n-doped semiconductor material layer over a substrate; forming an active region including an optically active compound semiconductor layer stack configured to emit light on the n-doped semiconductor material layer; forming a p-doped semiconductor material layer on the active region; depositing a nickel layer directly on the p-doped semiconductor material layer; etching back the nickel layer to form residual nickel layer having an effective thickness of one to three monolayers of nickel atoms, or to expose a nickel-doped surface region of the p-doped semiconductor layer; and forming a conductive layer on the residual nickel layer or the exposed nickel-doped surface region; wherein: the step of etching back the nickel layer forms the residual nickel layer; and the step of forming a conductive layer comprises depositing a transparent conductive oxide on the p-doped semiconductor layer and forming a nickel-doped conductive oxide layer between the p-doped semiconductor material layer and the conductive layer. 7. The method of claim 6 , further comprising forming a reflector on the conductive layer and forming a device-side bonding pad layer on the reflector.
Package configurations · CPC title
of interconnections · CPC title
of electrodes · CPC title
characterised by the dopants · CPC title
characterised by crystalline imperfections, e.g. dislocations; characterised by the distribution of dopants, e.g. delta-doping · CPC title
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