Chip electronic component and manufacturing method thereof
US-9945042-B2 · Apr 17, 2018 · US
Coil electronic component and method of manufacturing the same
US11069469B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11069469-B2 |
| Application number | US-201916540708-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 14, 2019 |
| Priority date | Dec 30, 2015 |
| Publication date | Jul 20, 2021 |
| Grant date | Jul 20, 2021 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A coil electronic component includes a magnetic body, wherein the magnetic body includes a substrate, and a coil part including patterned insulating films disposed on the substrate, a first plating layer formed between the patterned insulating films by plating, and a second plating layer disposed on the first plating layer.
First claim
Opening claim text (preview).
What is claimed is: 1. A coil electronic component comprising: a magnetic body, wherein the magnetic body includes a substrate, and a coil part including patterned insulating films disposed on a surface of the substrate, a first coil shaped plating layer disposed between the patterned insulating films, a second coil shaped plating layer disposed directly on the first coil shaped plating layer, and a cover insulating layer disposed on the patterned insulating films and the second coil shaped plating layer, and wherein the first coil shaped plating layer is formed not to exceed an upper surface of the patterned insulating films while the second coil shaped plating layer is formed to exceed an upper surface of the patterned insulating films. 2. The coil electronic component of claim 1 , wherein the cover insulating layer is formed to follow the shape of the second coil shaped plating layer. 3. The coil electronic component of claim 1 , wherein the cover insulating layer is formed of a material different from that of the patterned insulating films. 4. The coil electronic component of claim 1 , wherein the first coil shaped plating layer is integrally formed as a single plating layer. 5. The coil electronic component of claim 1 , wherein the first coil shaped plating layer has a rectangular shape. 6. The coil electronic component of claim 1 , wherein the first coil shaped plating layer has a thickness of 200 μm or more, and an aspect ratio of 1.0 or more. 7. The coil electronic component of claim 1 , wherein the patterned insulating films has a width of 1 μm to 20 μm. 8. The coil electronic component of claim 1 , wherein the second coil shaped plating layer is an anisotropic plating layer. 9. The coil electronic component of claim 1 , wherein a lower surface of the second coil shaped plating layer is arranged at or above the upper surface of the patterned insulating films.
Assignees
Inventors
Classifications
- H01F27/022Primary
Encapsulation · CPC title
made from sheets, e.g. grain-oriented (H01F27/26 takes precedence) · CPC title
on stacked layers · CPC title
Insulation between winding turns, between winding layers · CPC title
the magnetic material being applied in the form of particles, e.g. by serigraphy {, to form thick magnetic films or precursors therefor} (H01F41/18 {-H01F41/24} take precedence) · CPC title
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Frequently asked questions
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- What does patent US11069469B2 cover?
- A coil electronic component includes a magnetic body, wherein the magnetic body includes a substrate, and a coil part including patterned insulating films disposed on the substrate, a first plating layer formed between the patterned insulating films by plating, and a second plating layer disposed on the first plating layer.
- Who is the assignee on this patent?
- Samsung Electro Mech
- What technology area does this patent fall under?
- Primary CPC classification H01F27/022. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jul 20 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 9 related publications on this page (citations in our corpus or others sharing the same primary CPC).