Coil substrate, method for manufacturing coil substrate, and inductor

Patent metadata

Field	Value
Publication number	US-9595384-B2
Application number	US-201414338483-A
Country	US
Kind code	B2
Filing date	Jul 23, 2014
Priority date	Jul 31, 2013
Publication date	Mar 14, 2017
Grant date	Mar 14, 2017

Abstract

A coil substrate includes a substrate, a coil-shaped wiring provided on one surface of the substrate, the coil-shaped wiring including adjacent parts provided adjacent to each other, and an insulating layer formed between the adjacent parts of the coil-shaped wiring. The coil-shaped wiring includes a first wiring, and a second wiring that is layered on the first wiring and has a thickness greater than a thickness of the first wiring. A space is provided between a side surface of the first wiring and the insulating layer. The second wiring fills the space and covers the first wiring. Both side surfaces of the second wiring contact the insulating layer.

First claim

What is claimed is:

1. A coil substrate comprising:
a substrate including a first surface and a second surface on an opposite side of the first surface;
a coil-shaped wiring including a first wiring and a second wiring layered on the first wiring, the coil-shaped wiring provided on the first surface of the substrate, the coil-shaped wiring including adjacent parts provided adjacent to each other with respect to a width direction of the substrate;
another coil-shaped wiring provided on the second surface of the substrate, the another coil-shaped wiring including another adjacent parts provided adjacent to each other with respect to the width direction of the substrate;
an insulating layer formed between the adjacent parts of the coil-shaped wiring;
another insulating layer formed between the another adjacent parts of the another coil-shaped wiring; and
a through-electrode that penetrates the substrate and the first wiring;
wherein the coil-shaped wiring and the another coil-shaped wiring are connected by way of the through-electrode,
wherein the through-electrode includes an end surface exposed on one end of the through-electrode,
wherein the second wiring covers the exposed end surface of the through-electrode and an upper surface of the first wiring,
wherein a space is provided between a side surface of the first wiring and the insulating layer,
wherein the second wiring fills the space and covers the first wiring, and
wherein both side surfaces of the second wiring contact the insulating layer.

2. The coil substrate as claimed in claim 1 , wherein a cross section of the coil-shaped wiring with respect to the width direction of the substrate has a substantially rectangular shape.

3. The coil substrate as claimed in claim 1 , further comprising:
a protection layer formed on the coil-shaped wiring and the insulating layer,
wherein the protection layer has an insulating property.

4. The coil substrate as claimed in claim 1 ,
wherein the another coil-shaped wiring includes
a third wiring, and
a fourth wiring that is layered on the third wiring and has a thickness greater than a thickness of the third wiring,

wherein another space is provided between a side surface of the third wiring and the another insulating layer,
wherein the fourth wiring fills the another space and covers the third wiring,
wherein both side surfaces of the fourth wiring contact the another insulating layer,
wherein the first wiring and the third wiring are connected by way of the through-electrode.

5. The coil substrate as claimed in claim 1 , further comprising:
a connection part that is provided on an end of the coil-shaped wiring and integrally formed with the coil-shaped wiring.

6. A coil substrate comprising:
a substrate including a plurality of areas; and
the coil substrate of claim 1 formed on each of the plurality of areas.

7. The coil substrate as claimed in claim 1 , wherein the second wiring has a thickness greater than a thickness of the first wiring.

8. The coil substrate as claimed in claim 4 ,
wherein the first wiring and the third wiring are formed of metal foil, and
wherein the second wiring and the fourth wiring are formed of plating.

9. The coil substrate as claimed in claim 4 ,
further comprising a through-hole in which the through-electrode penetrating the substrate and the first wiring is formed,
wherein the through-hole includes a first opening on one end of the through-hole and a second opening on the other end of the through-hole,
wherein the first opening is open in the upper surface of the first wiring and the second opening is closed by the third wiring,
wherein the through-electrode includes plating formed on the third wiring, and
wherein the plating fills the through-hole from the first opening to the second opening.

Assignees

• Shinko Electric Ind Co

Inventors

• Nakamura Atsushi
• Nakanishi Tsukasa
• Sasada Yoichi

Classifications

• Y10T29/49071

  by winding or coiling · CPC title

• H01F2017/0066

  with a magnetic layer · CPC title

• H01F41/046 Primary

  structurally combined with ferromagnetic material · CPC title

• H01F5/00

  Coils (superconducting coils H01F6/06; fixed inductances of the signal type H01F17/00) · CPC title

• H01F17/0013

  with stacked layers · CPC title