Film thickness measuring device and polishing device

Patent metadata

Field	Value
Publication number	US-11065734-B2
Application number	US-201514644501-A
Country	US
Kind code	B2
Filing date	Mar 11, 2015
Priority date	Mar 12, 2014
Publication date	Jul 20, 2021
Grant date	Jul 20, 2021

Abstract

The present invention improves versatility of a film thickness measuring device. The trigger sensor 220 includes a proximity sensor 222 and a dog 224, and outputs a trigger signal indicating that a polishing table 110 makes one revolution. The eddy current sensor 210 measures a film thickness of a subject to be polished 102 at a timing based on the trigger signal output from the trigger sensor 220. The dog 224 is disposed in an opposite region 250 located at the opposite side of a rotation axis CW of the top ring 116 with respect to a rotation axis CT of the polishing table 110. Further, the eddy current sensor 210 and the proximity sensor 222 are disposed at the polishing table 110 so as to be located in the opposite region 250 when the trigger signal is output from the trigger sensor 220.

First claim

What is claimed is:

1. A polishing device comprising:
a polishing table configured to rotate in a clockwise direction and in a counterclockwise direction;
a holding unit configured to rotate while holding a subject to be polished;
a trigger sensor comprising a first member disposed at the polishing table and a second member disposed outside the polishing table, the trigger sensor being configured to output a trigger signal indicating that the polishing table makes one revolution based on a positional relationship between the first member and the second member; and
a first film thickness measuring sensor disposed at the polishing table, the first film thickness measuring sensor configured to measure the film thickness of the subject to be polished at a timing based on the trigger signal output from the trigger sensor,
wherein the second member of the trigger sensor is disposed outside the polishing table in an opposite region that is 180 degrees ±30% (54 degrees) about a rotation axis of the polishing table from a rotation axis of the holding unit, and
wherein the first film thickness measuring sensor and the first member of the trigger sensor are disposed at the polishing table so that when the trigger signal is output from the trigger sensor, the first film thickness measuring sensor and first member are located in the opposite region and the first film thickness measuring sensor is not located under the holding unit.

2. The polishing device according to claim 1 , wherein:
the second member of the trigger sensor is disposed on a plane extending parallel to and passing through the rotation axis of the holding unit and the rotation axis of the polishing table, and
the first film thickness measuring sensor and the first member are disposed at the polishing table so as to be located on the plane when the trigger signal is output from the trigger sensor.

3. The polishing device according to claim 2 , wherein:
the second member is a dog disposed outside the polishing table, and
the first member is a proximity sensor detecting the dog every time the polishing table makes one revolution.

4. The polishing device according to claim 2 , wherein the polishing device comprises:
a second film thickness measuring sensor disposed at the polishing table, the second film thickness measuring sensor configured to measure the film thickness of the subject to be polished at a timing based on the trigger signal output from the trigger sensor; and
a timing signal generator configured to output a timing for starting measurement and a timing for finishing measurement for each of the first and second film thickness measuring sensors based on the trigger signal output from the trigger sensor.

5. The polishing device according to claim 1 , wherein:
the second member is a dog disposed outside the polishing table, and
the first member is a proximity sensor detecting the dog every time the polishing table makes one revolution.

6. The polishing device according to claim 5 , wherein the polishing device comprises:
a second film thickness measuring sensor disposed at the polishing table, the second film thickness measuring sensor configured to measure the film thickness of the subject to be polished at a timing based on the trigger signal output from the trigger sensor; and
a timing signal generator configured to output a timing for starting measurement and a timing for finishing measurement for each of the first and second film thickness measuring sensors based on the trigger signal output from the trigger sensor.

7. The polishing device according to claim 1 , wherein the polishing device comprises:
a second film thickness measuring sensor disposed at the polishing table, the second film thickness measuring sensor configured to measure the film thickness of the subject to be polished at a timing based on the trigger signal output from the trigger sensor; and
a timing signal generator configured to output a timing for starting measurement and a timing for finishing measurement for each of the first and second film thickness measuring sensors based on the trigger signal output from the trigger sensor.

8. The polishing device according to claim 7 , wherein when the trigger signal is output from the trigger sensor:
the first film thickness measuring sensor is disposed in the opposite region, and
the second film thickness measuring sensor is disposed in a region different from the opposite region.

9. The polishing device according to claim 8 , wherein the timing signal generator outputs the timing for starting measurement and the timing for finishing measurement for each of the first and second film thickness measuring sensors based on the trigger signal, the rotation direction of the polishing table, the positional relationship of the first and second film thickness measuring sensors with respect to the proximity sensor, and the rotation speed of the polishing table.

10. The polishing device according to claim 7 , wherein the timing signal generator outputs the timing for starting measurement and the timing for finishing measurement for each of the first and second film thickness measuring sensors based on the trigger signal, the rotation direction of the polishing table, the positional relationship of the first and second film thickness measuring sensors with respect to the proximity sensor, and the rotation speed of the polishing table.

11. The polishing device according to claim 1 , further comprising:
a first driving unit configured to rotate the polishing table in the clockwise direction and in the counterclockwise direction; and
a second driving unit configured to rotate the holding unit.

12. The polishing device according to claim 1 , wherein the opposite region is 180 degrees ±20% (36 degrees) about the rotation axis of the polishing table from the rotation axis of the holding unit.

13. The polishing device according to claim 1 , wherein the opposite region is 180 degrees ±10% (18 degrees) about the rotation axis of the polishing table from the rotation axis of the holding unit.

14. The polishing device according to claim 1 , wherein the second member of the trigger sensor is disposed on a plane extending parallel to and passing through the rotation axis of the holding unit and the rotation axis of the polishing table.

15. The polishing device according to claim 1 , further comprising a timing signal generator storing a predetermined time that is fixed and does not depend on the rotation direction of the polishing table, wherein the first film thickness measuring sensor starts measuring when the predetermined time has elapsed since the trigger sensor outputs the trigger signal.

16. The polishing device according to claim 15 , wherein the first film thickness measuring sensor starts measuring before the subject to be polished becomes located above the first film thickness measuring sensor.

17. A polishing device comprising:
a polishing table configured to rotate in a clockwise direction and in a counterclockwise direction;
a holding unit configured to rotate while holding a subject to be polished;
a trigger sensor comprising a first member disposed at the polishing table and a second member disposed outside the polishing table, the trigger sensor being configured to output a trigger signal indicating that the polishing table makes one revolution based on a positional relationship between the first member and the second member; and
a film thickness measuring sensor disposed at the polishing table, the film thickness measuring sensor configured to measure the film thickness of t

Assignees

• Ebara Corp

Inventors

• Shinozaki Hiroyuki

Classifications

• H10P74/00

  Testing or measuring during manufacture or treatment of wafers, substrates or devices · CPC title

• H10P52/402

  of semiconductor materials · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• B24B37/005

  Control means for lapping machines or devices · CPC title