Micromechanical pressure sensor

Patent metadata

Field	Value
Publication number	US-11060937-B2
Application number	US-201816488470-A
Country	US
Kind code	B2
Filing date	Feb 21, 2018
Priority date	Mar 2, 2017
Publication date	Jul 13, 2021
Grant date	Jul 13, 2021

Abstract

A micromechanical pressure sensor, having—a pressure sensor core including a sensor diaphragm and a cavity developed above the sensor diaphragm; and—a pressure sensor frame; and—a spring element for the mechanical connection of the pressure sensor core to the pressure sensor frame being developed in such a way that a mechanical robustness is maximized and a coupling of stress from the pressure sensor frame into the sensor pressure core is minimized.

First claim

What is claimed is:

1. A micromechanical pressure sensor, comprising:
a pressure sensor core that includes a sensor diaphragm and a cavity developed above the sensor diaphragm;
a pressure sensor frame; and
a spring element that mechanically connects the pressure sensor core to the pressure sensor frame, wherein the spring element includes a ring disposed around the pressure sensor core, the spring element being connected to the pressure sensor core at only a singular connection location via a first connection element, and the spring element being connected to the pressure sensor frame at only a singular connection location via a second connection element.

2. A micromechanical pressure sensor, comprising:
a pressure sensor core that includes a sensor diaphragm and a cavity developed above the sensor diaphragm;
a pressure sensor frame; and
a spring element that mechanically connects the pressure sensor core to the pressure sensor frame, wherein the spring element is connected to the pressure sensor core at only two connection locations via two symmetrically disposed connection elements, and the spring element is connected to the pressure sensor frame at only a singular connection location via a further connection element.

3. A micromechanical pressure sensor, comprising:
a pressure sensor core that includes a sensor diaphragm and a cavity developed above the sensor diaphragm;
a pressure sensor frame; and
a spring element that mechanically connects the pressure sensor core to the pressure sensor frame, wherein the spring element is connected to the pressure sensor core at only a single connection location via a connection element, and the spring element is connected to the pressure sensor frame at only two connection locations via two symmetrically disposed connection elements.

4. A micromechanical pressure sensor, comprising:
a pressure sensor core that includes a sensor diaphragm and a cavity developed above the sensor diaphragm;
a pressure sensor frame; and
a spring element that mechanically connects the pressure sensor core to the pressure sensor frame, wherein the spring element is connected to the pressure sensor core at only four connection locations via four symmetrically disposed connection elements, and the spring element is connected to the pressure sensor frame at only two connection locations via two symmetrically disposed connection elements.

5. The micromechanical pressure sensor as recited in claim 1 , further comprising electrical lines for piezoresistive elements that are routed on the spring element in order to realize a Wheatstone bridge.

6. The micromechanical pressure sensor as recited in claim 2 , further comprising electrical lines for piezoresistive elements that are routed on the spring element in order to realize a Wheatstone bridge.

7. The micromechanical pressure sensor as recited in claim 3 , further comprising electrical lines for piezoresistive elements that are routed on the spring element in order to realize a Wheatstone bridge.

8. The micromechanical pressure sensor as recited in claim 4 , further comprising electrical lines for piezoresistive elements that are routed on the spring element in order to realize a Wheatstone bridge.

9. A method for producing a micromechanical pressure sensor, comprising:
providing a pressure sensor core including a sensor diaphragm and a cavity developed above the sensor diaphragm;
providing a pressure sensor frame;
providing a spring element for a mechanical connection of the pressure sensor core to the pressure sensor frame, wherein the spring element includes a ring disposed around the pressure sensor core, the spring element being connected to the pressure sensor core at only a singular connection location via a first connection element, and the spring element being connected to the pressure sensor frame at only a singular connection location via a second connection element.

Assignees

• Bosch Gmbh Robert

Inventors

• Lukacs Ferenc
• Dannenberg Arne
• Heuck Friedjof
• Grutzeck Helmut
• Schwarz Mike
• Maul Robert
• Dögei Tamas
• Friedrich Thomas
• Senz Volkmar

Classifications

• G01L19/146 Primary

  using flexible element between the transducer and the support · CPC title

• G01L9/0052

  of piezoresistive elements (circuits therefor G01L9/06) · CPC title

• G01L19/0069

  from the sensor to its support · CPC title

• G01L9/0045 Primary

  Diaphragm associated with a buried cavity · CPC title

• G01L19/0618

  Overload protection · CPC title