Plasma erosion resistant rare-earth oxide based thin film coatings

Patent metadata

Field	Value
Publication number	US-11053581-B2
Application number	US-201916685341-A
Country	US
Kind code	B2
Filing date	Nov 15, 2019
Priority date	Jun 20, 2013
Publication date	Jul 6, 2021
Grant date	Jul 6, 2021

Abstract

An article comprises a body and at least one protective layer on at least one surface of the body. The at least one protective layer is a thin film having a thickness of less than approximately 20 microns that comprises a ceramic selected from a group consisting of Y3Al5O12, Er2O3, Er3Al5O12, and a ceramic compound comprising Y4Al2O9 and a solid-solution of Y2O3—ZrO2.

First claim

What is claimed is:

1. An article comprising:
a ceramic body; and
a first protective layer on at least one surface of the ceramic body, wherein the first protective layer is a thin film having a thickness of approximately 0.5-20 microns that comprises a first ceramic selected from a group consisting of:
Y 3 Al 5 O 12 having at least two of a volume resistivity of 11.3E16 Ω·cm+/−up to 30%, a dielectric constant of 9.76+/−up to 30%, a thermal conductivity of 20.1 W/m·K+/−up to 30%, a hardness of 8.5 GPa+/−up to 30%, or a hermiticity of 4.4E-10 cm 3 /s+/−up to 30%,
Er 2 O 3 having a hardness of 5 GPa+/−up to 30%,
Er 3 Al 5 O 12 having a hardness of 9 GPa+/−up to 30%, and
a ceramic compound comprising Y 4 Al 2 O 9 and a solid-solution of Y 2 O 3 —ZrO 2 , the ceramic compound having at least one of a dielectric constant of 9.83+/−up to 30%, a thermal conductivity of 19.9 W/m·K+/−up to 30%, or a hermiticity of 1.2E-9 cm 3 /s+/−up to 30%.

2. The article of claim 1 , wherein the first protective layer comprises Er 2 O 3 , the first protective layer further having at least one of a dielectric constant of 9.67+/−up to 30%, a thermal conductivity of 19.4 W/m·K+/−up to 30%, or a hermiticity of 5.5E-9 cm 3 /s+/−up to 30%.

3. The article of claim 1 , wherein the first protective layer comprises Er 3 Al 5 O 12 , the first protective layer further having at least one of a dielectric constant of 9.54+/−up to 30%, a thermal conductivity of 19.2 W/m·K+/−up to 30%, or a hermiticity of 9.5E-10 cm 3 /s+/−up to 30%.

4. The article of claim 1 , wherein:
the ceramic body comprises a chamber component selected from a group consisting of a chamber lid, a nozzle, a showerhead base, a showerhead gas distribution plate (GDP), a chamber viewport, a process kit ring, a shield, a plasma screen, a flow equalizer, a chamber wall, and a liner kit; and
the ceramic body comprises at least one of Al 2 O 3 , aluminum nitride, aluminum, anodized aluminum, titanium, stainless steel, quartz, sapphire, silicon, or silicon carbide.

5. The article of claim 1 , further comprising:
a second protective layer on at least a portion of the first protective layer, wherein the second protective layer is a thin film that comprises a second ceramic different from the first ceramic, the second ceramic selected from a group consisting of: Y 3 Al 5 O 12 , Y 4 Al 2 O 9 , Er 2 O 3 , Gd 2 O 3 , Er 3 Al 5 O 12 , Gd 3 Al 5 O 12 , and the ceramic compound comprising Y 4 Al 2 O 9 and a solid-solution of Y 2 O 3 —ZrO 2 .

6. The article of claim 5 , wherein:
the first protective layer has an amorphous structure and comprises Y 3 Al 5 O 12 or Er 3 Al 5 O 12 ; and
the second protective layer has a crystalline or nano-crystalline structure and comprises Er 2 O 3 , Gd 2 O 3 , or the ceramic compound comprising Y 4 Al 2 O 9 and a solid-solution of Y 2 O 3 —ZrO 2 .

7. The article of claim 5 , wherein the ceramic body has a first coefficient of thermal expansion value, the first protective layer has a second coefficient of thermal expansion value, and the second protective layer has a third coefficient of thermal expansion value, wherein the second coefficient of thermal expansion value is between the first coefficient of thermal expansion value and the third coefficient of thermal expansion value.

8. The article of claim 5 , further comprising:
an additional protective layer on the at least one surface of the ceramic body, wherein the additional protective layer is a thick film that comprises a second ceramic selected from a group consisting of Y 3 Al 5 O 12 , Y 4 Al 2 O 9 , Y 2 O 3 , and the ceramic compound comprising Y 4 Al 2 O 9 and a solid-solution of Y 2 O 3 —ZrO 2 , wherein the first protective layer covers at least a portion of the additional protective layer.

9. The article of claim 1 , wherein the first protective layer comprises features formed in the first protective layer by masking the ceramic body and performing at least one of thin-film deposition or etching of specific areas that are not masked after forming the first protective layer.

10. The article of claim 1 , wherein a first roughness of the first protective layer is approximately the same as a second roughness of the ceramic body.

11. The article of claim 1 , wherein the first ceramic is the Y 3 Al 5 O 12 , and wherein the Y 3 Al 5 O 12 has an amorphous structure and an erosion rate of about 1 nm/hr+/−up to 30% when exposed to a CH 4 /Cl 2 plasma chemistry.

12. The article of claim 1 , wherein the first ceramic is the Er 3 Al 5 O 12 , and wherein the Er 3 Al 5 O 12 has an amorphous structure and an erosion rate of about 70 nm/hr+/−up to 30% when exposed to a H 2 /NF 3 plasma chemistry.

13. The article of claim 1 , wherein the first ceramic is the ceramic compound comprising the Y 4 Al 2 O 9 and the solid-solution of Y 2 O 3 —ZrO 2 , and wherein the ceramic compound comprising the Y 4 Al 2 O 9 and the solid-solution of Y 2 O 3 —ZrO 2 further has an amorphous structure and an erosion rate of about 3 nm/hr+/−up to 30% when exposed to a CH 4 /Cl 2 plasma chemistry.

14. The article of claim 1 , wherein the first ceramic is Y 3 Al 5 O 12 , and wherein the first ceramic has a hardness of 8.5 GPa+/−up to 30%, a dielectric constant of 9.76+/−up to 30%, a volume resistivity of 11.3E16 Ω·cm+/−up to 30%, and a thermal conductivity of 20.1 W/m·K+/−up to 30%.

15. The article of claim 1 , wherein the first ceramic is the Er 2 O 3 , and wherein the first ceramic has a hardness of 5 GPa+/−up to 30%, a dielectric constant of 9.67+/−up to 30%, and a thermal conductivity of 19.4 W/m·K+/−up to 30%.

16. The article of claim 1 , wherein the first ceramic is the Er 3 Al 5 O 12 , and wherein the first ceramic has a hardness of 9 GPa+/−up to 30%, a dielectric constant of 9.54+/−up to 30%, and a thermal conductivity of 19.2 W/m·K+/−up to 30%.

17. The article of claim 1 , wherein the first ceramic is the ceramic compound comprising Y 4 Al 2 O 9 and a solid-solution of Y 2 O 3 —ZrO 2 , and wherein the first ceramic has a hardness of 7.8 GPa+/−up to 30%, a dielectric constant of 9.83+/−up to 30%, a volume resistivity of 4.1E16 Ω·cm+/−up to 30%, and a thermal conductivity of 19.9 W/m·K+/−up to 30%.

18. An article comprising:
a ceramic body; and
a first protective layer on at least one surface of the ceramic body, wherein the first protective layer is a thin film that comprises a first ceramic selected from a group consisting of:
Y 3 Al 5 O 12 having at least two of a volume resistivity of 11.3E16 Ω·cm+/−up to 30%, a dielectric constant of 9.76+/−up to 30%, a thermal conductivity of 20.1 W/m·K+/−up to 30%, a hardness of 8.5 GPa+/−up to 30%, or a hermiticity of 4.4E-10 cm 3 /s+/−up to 30%,
Er 2 O 3 having a hardness of 5 GPa+/−up to 30%,
Er 3 Al 5 O 12 having a hardness of 9 GPa+/−up to 30%, and
a ceramic compound comprising Y 4 Al 2 O 9 and a solid-solution of Y 2 O 3 —ZrO 2 , the ceramic compound having at least two of a volume resistivity of 4.1E16 Ω·cm+/−up to 30%, a dielectric constant of 9.83+/−up to 30%, a thermal conductivity of 19.9 W/m·K+/−up to 30%, a hardness of 7.8 GPa+/−up to 30%, or a hermiticity of 1.2E-9 cm 3 /s+/−up to 30%;

wherein the first protective layer comprises a plurality of surface features on a surface of the first protective layer, wherein the plurality of surface features are not in the at least one surface of the ceramic body, and wherein a thickness of the first protective layer at first locations that include the plurality of surface features is greater than a thickness of the first protective layer at second locations tha

Assignees

• Applied Materials Inc

Inventors

• Sun Jennifer Y
• Kanungo Biraja P
• Firouzdor Vahid
• Cho Tom

Classifications

• C23C14/228

  Gas flow assisted PVD deposition · CPC title

• C23C14/083

  of refractory metals or yttrium · CPC title

• H01J37/32495

  Means for protecting the vessel against plasma · CPC title

• Y10T428/265

  1 mil or less · CPC title

• Y10T428/24967

  Absolute thicknesses specified · CPC title