Photoresist cleaning composition used in photolithography and a method for treating substrate therewith
US-10072237-B2 · Sep 11, 2018 · US
US11053462B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11053462-B2 |
| Application number | US-201716084622-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 3, 2017 |
| Priority date | Mar 14, 2016 |
| Publication date | Jul 6, 2021 |
| Grant date | Jul 6, 2021 |
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Provided herein is a cleaning composition including: from 20 to 90% by weight of dimethyl sulfoxide, from 5 to 30% by weight of at least one mineral oil (M), and from 5 to 50% by weight of at least one bipolar organic solvent (L). The ranges of proportions indicated are in each case based on the total weight of the cleaning composition. Also provided herein is a method of cleaning components by employing the cleaning composition, and also the cleaned components themselves.
Opening claim text (preview).
The invention claimed is: 1. A cleaning composition comprising: from 45 to 70% by weight of dimethyl sulfoxide; from 10 to 25% by weight of at least one mineral oil (M); and from 20 to 30% by weight of 2-ethylhexanol, wherein the ranges of proportions indicated are in each case based on the total weight of the cleaning composition. 2. The cleaning composition as claimed in claim 1 comprising at least one paraffinic and/or naphthenic mineral oil (M). 3. The cleaning composition as claimed in claim 2 comprising at least one isoparaffin-based mineral oil (M). 4. The cleaning composition as claimed in claim 1 comprising, based on the total amount of the cleaning composition, not more than 5% by weight of aromatic mineral oils. 5. The cleaning composition as claimed in claim 1 comprising at least 80% by weight of dimethyl sulfoxide, at least one mineral oil, and 2-ethylhexanol. 6. A method of cleaning components comprising articles, components, and/or industrial plants and parts of such industrial plants, wherein a cleaning composition as claimed in claim 1 is contacted with said components. 7. The cleaning composition as claimed in claim 4 , wherein the cleaning composition comprises, based on the total amount of the cleaning composition, no aromatic mineral oils. 8. The cleaning composition as claimed in claim 5 comprising at least 90% by weight of dimethyl sulfoxide, at least one mineral oil, and 2-ethylhexanol. 9. A cleaning composition consisting of: from 45 to 70% by weight of dimethyl sulfoxide; from 10 to 25% by weight of at least one miner oil (M); and from 20 to 30% by weight of at least one bipolar organic solvent (L) selected from the group consisting of aliphatic monoalcohols, wherein the ranges of proportions indicated are in each case based on the total weight of the cleaning composition. 10. A method of cleaning components comprising articles, components, and/or industrial plants and parts of such industrial plants, wherein a cleaning composition as claimed in claim 9 is contacted with said components.
aromatic · CPC title
containing organic solvents · CPC title
containing phosphorus, sulfur or silicon, e.g. dimethylsulfoxide · CPC title
branched · CPC title
Alcohols; Phenols · CPC title
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