Polishing pad, manufacturing method therefor, and method for manufacturing a semiconductor device
US-9181386-B2 · Nov 10, 2015 · US
Polyurethane for polishing layer, polishing layer including polyurethane and modification method of the polishing layer, polishing pad, and polishing method
US11053339B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11053339-B2 |
| Application number | US-201816608050-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 27, 2018 |
| Priority date | May 12, 2017 |
| Publication date | Jul 6, 2021 |
| Grant date | Jul 6, 2021 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
Disclosed herein are polyurethanes useful for polishing layers, where the polyurethane is a polyurethane having a Schiff base. Also disclosed herein are polishing layers containing the polyurethanes, polishing methods that use the polishing layers, and a modification method including a step of converting the Schiff base into at least one functional group selected from an aldehyde group, a carboxylic acid group, a hydroxyl group, and an amino group.
First claim
Opening claim text (preview).
The invention claimed is: 1. A modification method of a polishing layer including a polyurethane, the method comprising: preparing a polishing layer including a polyurethane having a Schiff base; and converting the Schiff base into at least one functional group selected from the group consisting of an aldehyde group, a carboxylic acid group, a hydroxyl group, and an amino group.
Assignees
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Classifications
involving a dielectric removal step · CPC title
of conductive or resistive materials · CPC title
Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title
compounds of group C08G18/3203 · CPC title
Manufacture of polymers by continuous processes (C08G18/0838 takes precedence) · CPC title
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- What does patent US11053339B2 cover?
- Disclosed herein are polyurethanes useful for polishing layers, where the polyurethane is a polyurethane having a Schiff base. Also disclosed herein are polishing layers containing the polyurethanes, polishing methods that use the polishing layers, and a modification method including a step of converting the Schiff base into at least one functional group selected from an aldehyde group, a carbo…
- Who is the assignee on this patent?
- Kuraray Co
- What technology area does this patent fall under?
- Primary CPC classification C08G18/3819. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jul 06 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).