Direct additive synthesis of diamond semiconductor

US11052647B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11052647-B2
Application numberUS-201815976753-A
CountryUS
Kind codeB2
Filing dateMay 10, 2018
Priority dateMay 10, 2018
Publication dateJul 6, 2021
Grant dateJul 6, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In an embodiment, a system includes a three-dimensional (3D) printer, a neutral feedstock, a p-doped feedstock, an n-doped feedstock, and a laser. The 3D printer includes a platen and an enclosure. The platen includes an inert metal. The enclosure includes an inert atmosphere. The neutral feedstock is configured to be deposited onto the platen. The neutral feedstock includes a halogenated solution and a nanoparticle having a negative electron affinity. The p-doped feedstock is configured to be deposited onto the platen. The p-doped feedstock includes a boronated compound introduced to the neutral feedstock. The n-doped feedstock is configured to be deposited onto the platen. The n-doped feedstock includes a phosphorous compound introduced to the neutral feedstock. The laser is configured to induce the nanoparticle to emit solvated electrons into the halogenated solution to form, by reduction, layers of a ceramic comprising a neutral layer, a p-doped layer, and an n-doped layer.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for additive manufacture, comprising: introducing a boronated compound to a second neutral feedstock to form a p-doped feedstock, wherein the neutral feedstock comprises a halogenated solution and a nanoparticle having a negative electron affinity; introducing a phosphorous compound to a third neutral feedstock to form an n-doped feedstock; depositing a first layer of a first neutral feedstock onto a platen of a three-dimensional (3D) printer; inducing the nanoparticle of the first neutral feedstock to emit solvated electrons into the halogenated solution using a laser to form, by reduction, a first layer of a neutral ceramic; depositing a second layer of the p-doped feedstock onto the platen of the three-dimensional (3D) printer; inducing the nanoparticle of the p-doped feedstock to emit solvated electrons into the halogenated solution using a laser to form, by reduction, a second layer of a p-doped ceramic; depositing a third layer of the n-doped feedstock onto the platen of the three-dimensional (3D) printer; inducing the nanoparticle of the n-doped feedstock to emit solvated electrons into the halogenated solution using a laser to form, by reduction, a third layer of n-doped ceramic. 2. The method of claim 1 , wherein: the halogenated solution comprises carbon tetrachloride; the nanoparticle comprises nanodiamond. 3. The method of claim 2 , wherein the first layer of the neutral ceramic, the second layer of the p-doped ceramic, and the third layer of the n-doped ceramic form a polycrystalline diamond semiconductor. 4. The method of claim 1 , wherein: the halogenated solution comprises trichloromethyltrichlorosilane; the nanoparticle comprises hydrogen-terminated silicon carbide nanoparticle. 5. The method of claim 4 , wherein the first layer of the neutral ceramic, the second layer of the p-doped ceramic, and the third layer of the n-doped ceramic form a silicon carbide semiconductor. 6. The method of claim 2 , wherein: the boronated compound comprises boron trichloride; and the phosphorous compound comprises phosphorous trichloride. 7. The method of claim 1 , wherein the first layer of the neutral ceramic, the second layer of the p-doped ceramic, and the third layer of the n-doped ceramic form a ceramic semiconductor without a kiln.

Assignees

Inventors

Classifications

  • Formation of materials, e.g. in the shape of layers or pillars · CPC title

  • Ceramics or glasses · CPC title

  • H10P14/265Primary

    using solutions · CPC title

  • Process efficiency · CPC title

  • B33Y10/00Primary

    Processes of additive manufacturing · CPC title

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What does patent US11052647B2 cover?
In an embodiment, a system includes a three-dimensional (3D) printer, a neutral feedstock, a p-doped feedstock, an n-doped feedstock, and a laser. The 3D printer includes a platen and an enclosure. The platen includes an inert metal. The enclosure includes an inert atmosphere. The neutral feedstock is configured to be deposited onto the platen. The neutral feedstock includes a halogenated solut…
Who is the assignee on this patent?
Lockheed Corp
What technology area does this patent fall under?
Primary CPC classification H10P14/265. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jul 06 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 9 related publications on this page (citations in our corpus or others sharing the same primary CPC).