Method and apparatus for three-dimensional additive manufacturing with a high energy high power ultrafast laser

US9643361B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9643361-B2
Application numberUS-201414324066-A
CountryUS
Kind codeB2
Filing dateJul 3, 2014
Priority dateMay 27, 2014
Publication dateMay 9, 2017
Grant dateMay 9, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Methods and systems for three-dimensional additive manufacturing of samples are disclosed, including generating electromagnetic radiation from an ultrashort pulse laser, wherein the electromagnetic radiation comprises a wavelength, a pulse repetition rate, a pulse width, a pulse energy, and an average power; focusing the electromagnetic radiation into a focal region; using a powder delivery system comprising a powder vessel, a roller, and a receptacle to deposit one or more powders from the powder vessel into a receptacle at the focal region of the electromagnetic radiation and to spread the one or more powders in the receptacle into a fabrication powder bed; and using a computer to adjust the micro and macro pulses, macro pulse repetition rate, and the average power of the ultrashort pulse laser. The samples may be made with micron and/or submicron level precision and/or feature size and may be made using high temperature materials. Other embodiments are described and claimed.

First claim

Opening claim text (preview).

The invention claimed is: 1. An apparatus for three-dimensional additive manufacturing comprising: an ultrashort pulse laser, wherein the ultrashort pulse laser generates an electromagnetic radiation, wherein the electromagnetic radiation comprises a wavelength, a pulse repetition rate, a pulse width, a pulse energy, and an average power; a focusing mechanism comprising a focus range, and wherein the focusing mechanism is configured to focus the electromagnetic radiation into a focal region; a powder delivery system, wherein the powder delivery system comprises: a powder vessel; a roller; and a receptacle; wherein the powder delivery system is configured to deposit one or more powders into the receptacle at the focal region of the electromagnetic radiation; wherein the powder vessel is configured to hold the one or more powders; and wherein the roller is configured to spread the one or more powders in the receptacle into a fabrication powder bed; and a computer coupled to the ultrashort pulse laser, wherein the computer is configured to adjust the pulse repetition rate and the average power of the ultrashort pulse laser and configured to program the electromagnetic radiation into temporally arbitrarily grouped micro and macro pulses and to spatially shape the micro and macro pulses. 2. The apparatus of claim 1 , wherein the powder vessel comprises a powder delivery piston configured to raise the one or more powders above the lip of the powder vessel. 3. The apparatus of claim 1 , wherein the powder vessel comprises a hopper configured to drop the one or more powders into the receptacle. 4. The apparatus of claim 1 , wherein the receptacle comprises a fabrication piston configured to lower the fabrication powder bed. 5. The apparatus of claim 1 , wherein the one or more powders comprises at least one of aluminum, steel, stainless steel, titanium, niobium, molybdenum, tantalum, tungsten, rhenium, hafnium diboride, zirconium diboride, titanium carbide, titanium nitride, thorium dioxide, silicon carbide, tantalum carbide, fused silicon, BK7, quartz, diamond, graphene, sapphire, silicon, germanium, and gallium arsenide. 6. The apparatus of claim 1 , wherein the one or more powders comprises a powder with melting temperatures greater than 2000° C. 7. The apparatus of claim 1 , wherein the one or more powders comprises a powder with melting temperatures less than 2000° C. 8. The apparatus of claim 1 , wherein the apparatus is configured for high resolution additive manufacturing with micron and/or sub micron level precision and/or feature size. 9. The apparatus of claim 1 , wherein the one or more powders comprises a powder size ranging from about 0.01 μm to about 50 μm. 10. The apparatus of claim 1 , further comprising a chamber configured to substantially enclose the powder delivery system, wherein the chamber is filled with one or more shield gases. 11. The apparatus of claim 10 , wherein the one or more shield gases comprises at least one of argon, helium, nitrogen, and hydrogen. 12. The apparatus of claim 1 , wherein the focusing mechanism further comprises: a scanner comprising a scanning range, and wherein the scanner is configured to receive the electromagnetic radiation from the ultrashort pulse laser and to scan the electromagnetic radiation onto the one or more powders to produce a sample. 13. The apparatus of claim 1 , wherein the focusing mechanism further comprises a microscopic lens, wherein the microscopic lens is configured to receive the electromagnetic radiation from the ultrashort pulse laser and to focus the electromagnetic radiation onto the one or more powders to produce a sample, wherein the size of the sample ranges from about 0.1 μm to 20 mm. 14. The apparatus of claim 1 , further comprising one or more stages to support the powder delivery system, wherein the one or more stages are configured to position the powder delivery system in one or more axis within the focus range of the electromagnetic radiation. 15. The apparatus of claim 1 , further comprising: a dichroic filter positioned between the focusing mechanism and the focal region; and an imager and processor focused through the dichroic filter and onto a sample, wherein the imager and processor are configured to monitor the sample within the focus range of the electromagnetic radiation. 16. The apparatus of claim 1 , wherein the ultrashort pulse laser comprises at least one of a Yb doped fiber laser, an Er doped fiber laser, a Tm doped fiber laser, a Ho doped fiber laser, an Er:ZBLAN fiber laser, a KGW thin disk laser, and a KYW thin disk laser. 17. The apparatus of claim 1 , wherein the wavelength of the electromagnetic radiation generated from the ultrashort pulse laser ranges from about 0.2 μm to 3 μm. 18. The apparatus of claim 1 , wherein the pulse repetition rate of the electromagnetic radiation generated from the ultrashort pulse laser ranges from about 0.1 MHz to 1 GHz. 19. The apparatus of claim 1 , wherein the pulse width of the electromagnetic radiation generated from the ultrashort pulse laser ranges from about 0.1 ps to 1 ns. 20. The apparatus of claim 1 , wherein the pulse energy of the electromagnetic radiation generated from the ultrashort pulse laser ranges from about 0.1 μJ to 30 mJ. 21. The apparatus of claim 1 , wherein the average power of the electromagnetic radiation generated from the ultrashort pulse laser ranges from about 1 W to 2000 W. 22. The apparatus of claim 1 , wherein the electromagnetic radiation is polarized. 23. The apparatus of claim 22 , wherein the electromagnetic radiation is circularly polarized. 24. The apparatus of claim 12 , wherein the scanner is further configured to rotationally scan on a micron scale the electromagnetic radiation onto the one or more powders. 25. The apparatus of claim 1 , further comprising beam shaping optics positioned between the ultrashort pulse laser and the focusing mechanism, wherein the beam shaping optics is configured to modify the electromagnetic radiation from a Gaussian to a flat top and wherein the flat top is square or circular. 26. An apparatus for three-dimensional additive manufacturing comprising: an ultrashort pulse laser, wherein the ultrashort pulse laser generates an electromagnetic radiation, wherein the electromagnetic radiation comprises a wavelength, a pulse repetition rate, a pulse width, a pulse energy, and an average power; a focusing mechanism comprising a focus range, and wherein the focusing mechanism is configured to focus the electromagnetic radiation into a focal region; beam shaping optics positioned between the ultrashort pulse laser and the focusing mechanism, wherein the beam shaping optics is configured to modify the electromagnetic radiation from a Gaussian to a flat top and wherein the flat top is square or circular; a powder delivery system, wherein the powder delivery system comprises: a powder vessel; a roller; and a receptacle; wherein the powder delivery system is configured to deposit one or more powders into the receptacle at the focal region of the electromagnetic radiation; wherein the powder vessel is configured to hold the one or more powders; and wherein the roller is configured to spread the one or more powders in the receptacle into a fabrication powder bed; and a computer coupled to the ultrashort pulse laser, wherein the computer is configured to adjust the pulse repetition

Assignees

Inventors

Classifications

  • using layers of powder being selectively joined, e.g. by selective laser sintering or melting · CPC title

  • Build-up welding · CPC title

  • pulsed; frequency modulated · CPC title

  • of composite layers {(B22F7/002 takes precedence)} · CPC title

  • for controlling or regulating additive manufacturing processes · CPC title

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What does patent US9643361B2 cover?
Methods and systems for three-dimensional additive manufacturing of samples are disclosed, including generating electromagnetic radiation from an ultrashort pulse laser, wherein the electromagnetic radiation comprises a wavelength, a pulse repetition rate, a pulse width, a pulse energy, and an average power; focusing the electromagnetic radiation into a focal region; using a powder delivery sys…
Who is the assignee on this patent?
Liu Jian
What technology area does this patent fall under?
Primary CPC classification B23K26/0624. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 09 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).