Insertable stubless interconnect

Patent metadata

Field	Value
Publication number	US-11050172-B2
Application number	US-201916692426-A
Country	US
Kind code	B2
Filing date	Nov 22, 2019
Priority date	Nov 22, 2019
Publication date	Jun 29, 2021
Grant date	Jun 29, 2021

Abstract

A multi-layer circuit board includes a first layer including a first trace, a second layer connected to the first layer and including a second trace, and a stubless interconnect positioned through the first layer and the second layer. The stubless interconnect includes a body that is electrically insulative, and a bridge trace that is electrically conductive and connected to the body, the bridge trace extending from the first trace to the second trace to electrically connect the first trace and the second trace.

First claim

What is claimed is:

1. A multi-layer circuit board comprising:
a first layer including a first trace;
a second layer connected to the first layer and including a second trace;
a stubless interconnect positioned through the first layer and the second layer, the stubless interconnect comprising:
a body that is electrically insulative and includes an interstice; and
a bridge trace that is electrically conductive and connected to the body, the bridge trace extending from the first trace to the second trace to electrically connect the first trace and the second trace; and
a spreader configured to widen the interstice to press the bridge trace against the first trace and the second trace.

2. The multi-layer circuit board of claim 1 , wherein a cross-sectional area of the bridge trace is no more than twice a cross-sectional area of the first trace and/or a cross-sectional area of the second trace.

3. The multi-layer circuit board of claim 1 , wherein the bridge trace extends through the body.

4. The multi-layer circuit board of claim 1 , wherein the bridge trace extends around an exterior of the body.

5. The multi-layer circuit board of claim 1 , further comprising:
an indicator on an end of the body that visually indicates the orientation of the stubless interconnect.

6. The multi-layer circuit board of claim 1 , further comprising:
an electrical testing device connected to the first trace and to the second trace;
wherein the electrical testing device is configured to test the electrical connection between the first trace and the second trace via the bridge trace.

7. A method comprising:
providing a multi-layer circuit board comprising a first layer including a first trace and a second layer connected to the first layer and including a second trace;
cutting an aperture through the first layer and the second layer;
inserting a stubless interconnect into the aperture, the stubless interconnect comprising:
a body that is electrically insulative; and
a bridge trace that is electrically conductive and connected to the body, the bridge trace extending from the first trace to the second trace to electrically connect the first trace and the second trace;

connecting an electrical testing device to the first trace and to the second trace; and
testing an electrical connection of the first trace and the second trace via the bridge trace after inserting the stubless interconnect into the aperture, wherein the testing including measuring an impedance value between the first trace and the second trace during the insertion of the stubless interconnect, and the insertion of the stubless interconnect is halted after the impedance value has gone from a high value to a low value, representing that the electrical connection between the first trace and the second trace via the bridge trace is sufficient.

8. The method of claim 7 , further comprising:
aligning an indicator on the body to electrically connect the bridge trace to the first trace and the second trace.

9. The method of claim 7 , further comprising:
repositioning the stubless interconnect in response to the testing determining that the electrical connection is insufficient.

10. The method of claim 7 , wherein the testing the electrical connection comprises:
measuring a signal quality through the first trace, the bridge trace, and the second trace using a time-domain reflectometer.

11. A stubless interconnect for a multi-layer circuit board comprising:
a body that is electrically insulative and is configured to pass through a first layer and a second layer of the multi-layer circuit board;
a bridge trace that is electrically conductive and connected to the body, wherein when the stubless interconnect is installed in the multi-layer circuit board, the bridge trace extends from the first layer to the second layer to electrically connect to a first trace in the first layer and a second trace in the second layer;
a bridge indicator on an end of the body that visually indicates a rotational orientation of the stubless interconnect; and
a trace indicator on an exterior side of the multi-layer circuit board that visually indicates lateral orientations of traces that are to be connected by the bridge trace;
wherein a cross-sectional area of the bridge trace is no more than thrice a cross-sectional area of the first trace and/or a cross-sectional area of the second trace.

12. The stubless interconnect of claim 11 , wherein the bridge trace extends through the body.

13. The stubless interconnect of claim 11 , wherein the bridge trace extends around an exterior of the body.

14. The stubless interconnect of claim 11 , wherein the body includes an interstice, the stubless interconnect further comprising:
a spreader configured to widen the interstice to press the bridge trace against the first trace and the second trace.

15. The stubless interconnect of claim 11 , wherein the cross-sectional area of the bridge trace is between half and one-and-a-half of the cross-sectional area of the first trace and/or the cross-sectional area of the second trace.

Assignees

• IBM

Inventors

• Cocchini Matteo
• Cracraft Michael
• Dreiss Zachary Thomas

Classifications

• H05K2203/0271

  Mechanical force other than pressure, e.g. shearing or pulling · CPC title

• H05K2201/10893

  Grouped leads, i.e. element comprising multiple leads distributed around but not through a common insulator · CPC title

• H05K2201/10409

  Screws · CPC title

• H05K2201/10265

  Metallic coils or springs, e.g. as part of a connection element · CPC title

• H05K3/4046

  using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire · CPC title