Encapsulating low-k dielectric blocks along with dies in an encapsulant to form antennas

Patent metadata

Field	Value
Publication number	US-11050153-B2
Application number	US-201916390427-A
Country	US
Kind code	B2
Filing date	Apr 22, 2019
Priority date	Nov 30, 2012
Publication date	Jun 29, 2021
Grant date	Jun 29, 2021

Abstract

A method includes placing a device die and a pre-formed dielectric block over a first carrier, encapsulating the device die and the pre-formed dielectric block in an encapsulating material, grinding a top side of the encapsulating material to expose the top side of the pre-formed dielectric block, removing the carrier from the encapsulating material, the pre-formed dielectric block, and the device die to reveal a bottom side of the pre-formed dielectric block, and forming a ground panel, a feeding line, and a patch on the encapsulating material. The ground panel, the feeding line, the patch, and the pre-formed dielectric block form a patch antenna.

First claim

What is claimed is:

1. A method comprising:
placing a device die and a pre-formed dielectric block over a first carrier;
encapsulating the device die and the pre-formed dielectric block in an encapsulating material;
grinding a top side of the encapsulating material to expose the top side of the pre-formed dielectric block;
detaching the first carrier from the encapsulating material, the pre-formed dielectric block, and the device die to reveal a bottom side of the pre-formed dielectric block; and
forming a ground panel, a feeding line, and a patch on the encapsulating material, wherein the ground panel, the feeding line, the patch, and the pre-formed dielectric block form a patch antenna.

2. The method of claim 1 , wherein the feeding line and the ground panel are in formed directly in contact with the pre-formed dielectric block.

3. The method of claim 1 , wherein the feeding line and the ground panel are formed in common processes, and the common processes comprise a common deposition process.

4. The method of claim 1 , wherein the forming the ground panel comprises:
revealing a metal connector of the device die, wherein the ground panel is formed on the encapsulating material and electrically coupling to the metal connector.

5. The method of claim 1 further comprising:
after the forming the ground panel and the forming the feeding line, performing the detaching the first carrier from the encapsulating material;
before the forming the patch, attaching a second carrier, wherein the first carrier and the second carrier are attached to opposite sides of the encapsulating material and the device die; and
after the forming the patch, detaching the second carrier from the encapsulating material.

6. The method of claim 1 , wherein the forming the ground panel, the feeding line, and the patch comprises plating processes.

7. The method of claim 1 , wherein the placing the pre-formed dielectric block comprises placing a dielectric blocking having a dielectric constant lower than a dielectric constant of the encapsulating material.

8. The method of claim 1 further comprising, at a time the patch antenna is formed, simultaneously forming an additional patch antenna, wherein the additional patch antenna comprises portions on opposite sides of the encapsulating material, and wherein the additional patch antenna is connected to the device die, and comprises an additional ground panel, an additional feeding line, and an additional patch.

9. A method comprising:
placing a device die and a pre-formed dielectric block over a first carrier;
encapsulating the device die and the pre-formed dielectric block in an encapsulating material, wherein the encapsulating material has a first dielectric constant higher than a second dielectric constant of the pre-formed dielectric block;
grinding a top side of the encapsulating material to expose the top side of the pre-formed dielectric block;
detaching the first carrier from the encapsulating material, the pre-formed dielectric block, and the device die to reveal a bottom side of the pre-formed dielectric block; and
forming a ground panel, a feeding line, and a patch on the encapsulating material, wherein the ground panel, the feeding line, the patch, and the pre-formed dielectric block form a patch antenna.

10. The method of claim 9 , wherein the feeding line and the ground panel are in formed directly in contact with the pre-formed dielectric block.

11. The method of claim 9 , wherein the feeding line and the ground panel are formed in common processes, and the common processes comprise a common deposition process.

12. The method of claim 9 , wherein the forming the ground panel comprises:
revealing a metal connector of the device die, wherein the ground panel is formed on the encapsulating material and electrically coupling to the metal connector.

13. The method of claim 9 further comprising:
after the forming the ground panel and the forming the feeding line, performing the detaching the first carrier from the encapsulating material;
before the forming the patch, attaching a second carrier, wherein the first carrier and the second carrier are attached to opposite sides of the encapsulating material and the device die; and
after the forming the patch, detaching the second carrier from the encapsulating material.

14. The method of claim 9 , wherein the forming the ground panel, the feeding line, and the patch comprises plating processes.

15. The method of claim 9 further comprising, at a time the patch antenna is formed, simultaneously forming an additional patch antenna, wherein the additional patch antenna comprises portions on opposite sides of the encapsulating material, and wherein the additional patch antenna is connected to the device die, and comprises an additional ground panel, an additional feeding line, and an additional patch.

16. A method comprising:
placing a device die and a pre-formed dielectric block over a first carrier;
encapsulating the device die and the pre-formed dielectric block in an encapsulating material;
grinding a top side of the encapsulating material to expose the top side of the pre-formed dielectric block;
detaching the first carrier from the encapsulating material, the pre-formed dielectric block, and the device die to reveal a bottom side of the pre-formed dielectric block;
forming a ground panel, a feeding line, and a patch on the encapsulating material, wherein the ground panel, the feeding line, the patch, and the pre-formed dielectric block form a patch antenna; and
forming an additional patch antenna, wherein the additional patch antenna comprises portions on opposite sides of the encapsulating material, and wherein the additional patch antenna is connected to the device die, and comprises an additional ground panel, an additional feeding line, and an additional patch.

17. The method of claim 16 , wherein the feeding line and the ground panel are in formed directly in contact with the pre-formed dielectric block.

18. The method of claim 16 , wherein the feeding line and the ground panel are formed in common processes, and the common processes comprise a common deposition process.

19. The method of claim 16 , wherein the forming the ground panel comprises:
revealing a metal connector of the device die, wherein the ground panel is formed on the encapsulating material and electrically coupling to the metal connector.

20. The method of claim 16 , wherein the forming the ground panel, the feeding line, and the patch comprises plating processes.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Liu Monsen
• Chih Lai Wei
• Tsai Chung-Hao
• Hsieh Jeng-Shien
• Yeh En-Hsiang
• Wang Chuei-Tang

Classifications

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W74/019

  using temporary auxiliary substrates (H10W74/017 takes precedence) · CPC title

• H10W72/241

  Dispositions, e.g. layouts · CPC title

• H10W70/093

  Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps · CPC title

• H10W44/248

  for antennas · CPC title