Multilayer electronic component
US-10446321-B2 · Oct 15, 2019 · US
US11049653B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11049653-B2 |
| Application number | US-201916584209-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 26, 2019 |
| Priority date | Sep 26, 2018 |
| Publication date | Jun 29, 2021 |
| Grant date | Jun 29, 2021 |
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A multi-layer ceramic electronic component includes a multi-layer unit and a side margin. The multi-layer unit includes ceramic layers laminated in a first direction, internal electrodes disposed between the ceramic layers, a main surface that faces in the first direction, and a side surface that faces in a second direction orthogonal to the first direction, the internal electrodes being exposed from the side surface. The side margin includes a side-surface-covering portion that is disposed on the side surface, and an end portion that includes an extended portion extending from the side surface to the main surface and having a first dimension of 0.1 μm or more in the first direction and a second dimension of 0.1 μm or more in the second direction.
Opening claim text (preview).
What is claimed is: 1. A multi-layer ceramic electronic component, comprising a multi-layer unit including ceramic layers laminated in a first direction, internal electrodes disposed between the ceramic layers, a main surface that faces in the first direction, and a side surface that faces in a second direction orthogonal to the first direction, the internal electrodes being exposed from the side surface; and a side margin including a side-surface-covering portion that is disposed on the side surface, and an end portion that includes an extended portion extending from the side surface to the main surface and having a first dimension of 0.1 μm or more in the first direction and a second dimension of 0.1 μm or more in the second direction, wherein the first dimension is 3 μm or less, and wherein the second dimension is 10 μm or less. 2. The multi-layer ceramic electronic component according to claim 1 , wherein the second dimension is 5 μm or more. 3. The multi-layer ceramic electronic component according to claim 1 , wherein the first dimension is 0.5 μm or more, and the second dimension is 1 μm or more. 4. The multi-layer ceramic electronic component according to claim 1 , wherein the side-surface-covering portion has a dimension of 10 μm or more in the second direction, and the side-surface-covering portion has a porosity of 10% or less. 5. The multi-layer ceramic electronic component according to claim 4 , wherein the end portion has a porosity lower than the porosity of the side-surface-covering portion.
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