Transistor acoustic sensor element and method for manufacturing the same, acoustic sensor and portable device

Patent metadata

Field	Value
Publication number	US-11043644-B2
Application number	US-201815949112-A
Country	US
Kind code	B2
Filing date	Apr 10, 2018
Priority date	Aug 23, 2017
Publication date	Jun 22, 2021
Grant date	Jun 22, 2021

Abstract

The present disclosure provides a transistor acoustic sensor element and a method for manufacturing the same, an acoustic sensor and a portable device. The transistor acoustic sensor element comprises a gate, a gate insulating layer, a first electrode, an active layer and a second electrode arranged on a base substrate, wherein the active layer has a nanowire three-dimensional mesh structure and thus can vibrate under the action of sound signals, so that the output current of the transistor acoustic sensor element changes correspondingly. Since the active layer having the nanowire three-dimensional mesh structure can sensitively sense weak vibration of acoustic waves, the sensitivity to sound signals of the transistor acoustic sensor element is improved.

First claim

The invention claimed is:

1. A transistor acoustic sensor element, comprising a gate, a gate insulating layer, a first electrode, an active layer and a second electrode arranged on a base substrate, wherein the active layer has a nanowire three-dimensional mesh structure which can vibrate under the action of sound signals so that the output current of the transistor acoustic sensor element changes correspondingly,
wherein the active layer is arranged between the first electrode and the second electrode, and the transistor acoustic sensor element is a vertical structure transistor.

2. The transistor acoustic sensor element according to claim 1 , wherein the active layer is made of a polymer organic semiconductor material.

3. The transistor acoustic sensor element according to claim 2 , wherein the material of the active layer is selected from P3HT, PDQT, PDVT-10, PPhTQ, P(DPP4T-co-BDT), P3OT, BAS-PPE, TA-PPE, PQT-12 or PBIBDF-BT.

4. The transistor acoustic sensor element according to claim 1 , wherein the active layer substantially has a thickness of about 50-500 nm.

5. The transistor acoustic sensor element according to claim 1 , wherein the active layer comprises a single sub-film or a plurality of sub-films.

6. The transistor acoustic sensor element according to claim 1 , wherein the gate insulating layer is made of alumina.

7. The transistor acoustic sensor element according to claim 1 , wherein the gate, the first electrode and the second electrode are all made of graphene.

8. The transistor acoustic sensor element according to claim 1 , wherein the base substrate is made of polydimethylsiloxane.

9. An acoustic sensor, comprising a plurality of transistor acoustic sensor elements of claim 1 which are arranged in an array.

10. An acoustic sensor, comprising a plurality of transistor acoustic sensor elements of claim 2 which are arranged in an array.

11. An acoustic sensor, comprising a plurality of transistor acoustic sensor elements of claim 3 which are arranged in an array.

12. An acoustic sensor, comprising a plurality of transistor acoustic sensor elements of claim 4 which are arranged in an array.

13. An acoustic sensor, comprising a plurality of transistor acoustic sensor elements of claim 5 which are arranged in an array.

14. An acoustic sensor, comprising a plurality of transistor acoustic sensor elements of claim 6 which are arranged in an array.

15. An acoustic sensor, comprising a plurality of transistor acoustic sensor elements of claim 7 which are arranged in an array.

16. A portable device, comprising the acoustic sensor of claim 9 .

17. A method for manufacturing a transistor acoustic sensor element, comprising forming a gate, a gate insulating layer, a first electrode, an active layer and a second electrode successively on a base substrate, wherein the active layer is formed on a substrate by adopting a solution spin-coating method and then transferred from the substrate onto the base substrate by adopting a film transfer method, and the active layer has a nanowire three-dimensional mesh structure,
wherein the active layer is arranged between the first electrode and the second electrode, and the transistor acoustic sensor element is a vertical structure transistor.

18. The method for manufacturing the transistor acoustic sensor element according to claim 17 , wherein the methods for forming the gate, the first electrode and the second electrode are the same, and comprise:
forming a graphene film on a copper foil; and
transferring the graphene film onto the base substrate.

19. The method for manufacturing the transistor acoustic sensor element according to claim 18 , wherein transferring the graphene film onto the base substrate comprises:
forming a polymer support layer on the side of the graphene film opposite to the copper foil and solidifying the polymer support layer;
removing the copper foil to leave the graphene film supported by the polymer support layer;
transferring the graphene film supported by the polymer support layer onto the base substrate;
when the gate and the first electrode are formed, after transferring the graphene film onto the base substrate, the method further comprises:
removing the polymer support layer to leave the gate and the first electrode on the substrate;
when the second electrode is formed, after transferring the graphene film onto the base substrate, the polymer support layer does not need to be removed.

Assignees

• Boe Technology Group Co Ltd
• Hefei Xinsheng Optoelectronics Technology Co Ltd

Inventors

• Wang Qinghe
• Hu Jinliang
• Peng Rui
• Wang Dongfang
• Yuan Guangcai

Classifications

• H10K10/484

  characterised by the channel regions · CPC title

• H04R23/006 Primary

  using solid state devices (solid state devices per se H10) · CPC title

• H04R31/00

  Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor {(manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182)} · CPC title

• H04R31/003

  for diaphragms or their outer suspension · CPC title

• H04R2201/003

  Mems transducers or their use · CPC title