Silicone-free thermal gel

Patent metadata

Field	Value
Publication number	US-11041103-B2
Application number	US-201816105456-A
Country	US
Kind code	B2
Filing date	Aug 20, 2018
Priority date	Sep 8, 2017
Publication date	Jun 22, 2021
Grant date	Jun 22, 2021

Abstract

The present disclosure provides a silicone free gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes a polyether polyol, a cross-linker, a coupling agent, an antioxidant, a catalyst, and at least one thermally conductive filler.

First claim

The invention claimed is:

1. A thermal gel, comprising:
a matrix including at least one polyether polyol present in an amount between 1 wt. % and 10 wt. % based on the total weight of the thermal gel, the polyether polyol including hydroxyl groups;
a catalyst present in an amount between 0.3 wt. % and 0.6 wt. % based on the total weight of the thermal gel;
a crosslinker including a plurality of amine groups reactive with the hydroxyl groups of the polyether polyol, the crosslinker present in an amount between 0.01 wt. % and 10 wt. % based on the total weight of the thermal gel;
a coupling agent present in an amount between 0.1 wt. % and 5 wt. % based on the total weight of the thermal gel; and
at least one thermally conductive filler present in an amount between 85 wt. % and 98 wt. % based on the total weight of the thermal gel.

2. The thermal gel of claim 1 , further including:
an antioxidant present in an amount between 0.2 wt. % and 0.4 wt. % based on the total weight of the thermal gel.

3. The thermal gel of claim 1 , wherein the thermal gel includes silicone based components in an amount less than 1 wt. % based on the total weight of the thermal gel.

4. The thermal gel of claim 1 , wherein the thermal gel has a cure temperature of below 150° C.

5. The thermal gel of claim 1 , wherein the polyol is a polyether polyol, the polyether polyol is a bi-ol polymer with a molecular weight between 200 and 10000 Daltons.

6. The thermal gel of claim 5 , wherein the at least one polyether polyol is present in an amount between 5 wt. % and 10 wt. % based on the total weight of the thermal gel.

7. The thermal gel of claim 1 , wherein the crosslinker is an alkylated melamine formaldehyde resin.

8. The thermal gel of claim 2 , wherein the catalyst includes amine neutralized benzene sulfonic acid, amine neutralized dinonylnaphthalene disulfonic acid or amine neutralized dinonylnaphthalenesulfonic acid or other type of thermal acid generator.

9. The thermal gel of claim 2 , wherein the antioxidant includes at least one antioxidant selected from the group consisting of a phenol-type antioxidant, an amine-type antioxidant, or a sterically hindered, sulfur containing phenolic antioxidant.

10. The thermal gel of claim 1 , wherein:
the at least one thermally conductive filler includes a first thermally conductive filler and a second thermally conductive filler;
the first thermally conductive filler is present in an amount between 35 wt. % and 50 wt. % based on the total weight of the thermal gel;
the second thermally conductive filler is present in an amount between 15 wt. % and 25 wt. % based on the total weight of the thermal gel; and
the third thermally conductive filler is present in an amount between 15 wt. % and 25 wt. % based on the total weight of the thermal gel.

Assignees

• Honeywell Int Inc

Inventors

• Zhang Liqiang
• Duan Huifeng
• Pan Rongwei
• Zhang Qi
• Liu Ya Qun
• Kang Haigang

Classifications

• C08L71/02 Primary

  Polyalkylene oxides · CPC title

• C08J3/075

  Macromolecular gels · CPC title

• C08G65/2678

  Sulfur or compounds thereof · CPC title

• C08G65/2609

  containing aliphatic hydroxyl groups · CPC title

• C08L2205/03

  containing three or more polymers in a blend · CPC title