Modular microwave source with local Lorentz force

US11037764B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11037764-B2
Application numberUS-201715588597-A
CountryUS
Kind codeB2
Filing dateMay 6, 2017
Priority dateMay 6, 2017
Publication dateJun 15, 2021
Grant dateJun 15, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Embodiments include methods and apparatuses that include a plasma processing tool that includes a plurality of magnets. In one embodiment, a plasma processing tool may comprise a processing chamber and a plurality of modular microwave sources coupled to the processing chamber. In an embodiment, the plurality of modular microwave sources includes an array of applicators positioned over a dielectric plate that forms a portion of an outer wall of the processing chamber, and an array of microwave amplification modules. In an embodiment, each microwave amplification module is coupled to one or more of the applicators in the array of applicators. In an embodiment, the plasma processing tool may include a plurality of magnets. In an embodiment, the magnets are positioned around one or more of the applicators.

First claim

Opening claim text (preview).

What is claimed is: 1. A plasma processing tool, comprising: a processing chamber confining a processing volume; and a plurality of modular microwave sources coupled to the processing chamber, wherein the plurality of modular microwave sources comprise: an array of applicators positioned over a dielectric that forms a portion of an outer wall of the processing chamber; and an array of microwave amplification modules, wherein each microwave amplification module is coupled to one or more of the applicators in the array of applicators; and a plurality of magnets, wherein the magnets are positioned around one or more of the applicators, and wherein the plurality of magnets are electrically coupled to each other in series, and wherein the plurality of magnets are entirely outside of the processing volume. 2. The plasma processing tool of claim 1 , wherein the plurality of magnets are electromagnets. 3. The plasma processing tool of claim 2 , wherein each electromagnet is formed around one the applicators. 4. The plasma processing tool of claim 3 , wherein each electromagnet is formed around more than one applicator. 5. The plasma processing tool of claim 1 , wherein one or more of the plurality of magnets is integrated within a housing of at least one of the applicators. 6. The plasma processing tool of claim 1 , wherein one or more of the plurality of magnets is embedded within the dielectric plate. 7. The plasma processing tool of claim 1 , wherein a magnetic field strength of the magnets is greater than 10 G. 8. The plasma processing tool of claim 1 , wherein a magnetic field strength of the magnets is chosen so that a plasma generated by the processing tool experiences electron cyclotron resonance (ECR). 9. The plasma processing tool of claim 1 , further comprising a plurality of plasma sensors positioned among the applicators. 10. The plasma processing tool of claim 9 , wherein feedback control data for each microwave amplification module is provided by one or more of the plurality of plasma sensors. 11. A modular microwave applicator, comprising: a dielectric resonant cavity; an applicator housing formed around an outer sidewall of the dielectric resonant cavity; a monopole extending down an axial center of the dielectric resonator and into a channel formed in the center of the dielectric resonant cavity; and a magnet embedded within the applicator housing, wherein the magnet is connected in series with one or more additional magnets. 12. The modular microwave applicator of claim 11 , wherein the magnet is an electromagnet. 13. The modular microwave applicator of claim 12 , wherein the electromagnet forms one or more rings around the dielectric resonant cavity. 14. A plasma processing tool, comprising: a processing chamber; and a plurality of modular microwave sources coupled to the processing chamber, wherein the plurality of modular microwave sources comprise: an array of applicators positioned over a dielectric that forms a portion of an outer wall of the processing chamber, wherein each applicator comprises: a dielectric resonant cavity; an applicator housing formed around an outer sidewall of the dielectric resonant cavity; a monopole extending down an axial center of the dielectric resonator and into a channel formed in the center of the dielectric resonant cavity; and a magnet embedded within the applicator housing, wherein the magnet is a permanent magnet or an electromagnet, and wherein the magnet is connected in series with one or more additional magnets; and an array of microwave amplification modules, wherein each microwave amplification module is coupled to one or more of the applicators in the array of applicators.

Assignees

Inventors

Classifications

  • Generating means · CPC title

  • Microwave generated discharge (H01J37/32357, H01J37/32366, H01J37/32394, H01J37/32403 take precedence) · CPC title

  • Particular magnets or magnet arrangements for controlling the discharge · CPC title

  • Means for controlling power transmitted to the plasma · CPC title

  • using applied electromagnetic fields, e.g. high frequency or microwave energy (H05H1/26 takes precedence) · CPC title

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What does patent US11037764B2 cover?
Embodiments include methods and apparatuses that include a plasma processing tool that includes a plurality of magnets. In one embodiment, a plasma processing tool may comprise a processing chamber and a plurality of modular microwave sources coupled to the processing chamber. In an embodiment, the plurality of modular microwave sources includes an array of applicators positioned over a dielect…
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification H01J37/32201. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 15 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).