Method for manufacturing electronic device
US-2024258152-A1 · Aug 1, 2024 · US
US11036135B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11036135-B2 |
| Application number | US-201716463180-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 21, 2017 |
| Priority date | Nov 25, 2016 |
| Publication date | Jun 15, 2021 |
| Grant date | Jun 15, 2021 |
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Provided are: a curable composition having excellent photolithographic properties and resin elution properties; a cured product of the curable composition; and a curing method of the curable composition. The curable composition is characterized by including: (A) at least one selected from the group consisting of a water-soluble polyfunctional (meth)acrylates and water-soluble polyfunctional (meth)acrylamides; and (B) a photosensitive group-containing water-soluble polymer. The water-soluble polyfunctional (meth)acrylates are preferably compounds represented by Formula (I) below, and the water-soluble polyfunctional (meth)acrylamides are preferably compounds represented by Formula (II) below. In Formulae (I) and (II), R1 represents a hydrogen atom, a methyl group, or a halogen atom; X1 represents an alkylene group having 1 to 6 carbon atoms that is optionally substituted with a hydroxy group; A represents an n-valent organic group; R11 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; m represents a number of 1 to 30; n represents a number of 2 to 12; and t represents a number of 2 to 12.
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The invention claimed is: 1. A curable composition comprising: (A) at least one selected from the group consisting of water-soluble polyfunctional (meth)acrylamides, wherein the water-soluble polyfunctional (meth)acrylamides are represented by the following Formula (II); and (B) a photosensitive group-containing water-soluble polymer, wherein the water-soluble polymer comprises a structural unit represented b the following Formula (III) or (IV); wherein in Formula (II): R 1 represents a hydrogen atom, a methyl group, or a halogen atom; R 11 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; A represents an n-valent organic group; and t represents a number of 2 to 12; wherein in Formulae (III) and (IV): Y represents a divalent organic group; and Q is a vinyl group, an allyl group, a styryl group, a cinnamyl group, a cinnamoyl group, a cinnamylidene group, a cinnamylidenecetyl group, a chalcone group, a coumarin group, an isocoumarin group, a 2,5-dimethoxystilbene group, a maleimide group, an α-phenylmaleimide group, a 2-pyrone group, an azide group, a thymine group, a quinone group, a maleimide group, a uracil group, a pyrimidine group, a stilbazolium group, a styrylpyridinium group a styrylquinolium group, an epoxy group, an oxetane group, a vinyl ether group, an allyl ether group, an acetylacetone structure, or a β-diketone structure. 2. The curable composition according to claim 1 , wherein the (B) photosensitive group-containing water-soluble polymer is a water-soluble polymer comprising a structural unit represented by the following Formula (V): where An q− represents a q-valent anion; q represents 1 or 2; and p represents a coefficient that maintains a neutral charge. 3. The curable composition according to claim 2 , further comprising a radical initiator. 4. The curable composition according to claim 1 , wherein the (B) photosensitive group-containing water-soluble polymer is a polyvinyl alcohol derivative obtained by introducing a (meth)acrylate or (meth)acrylamide structure to a polyvinyl alcohol. 5. The curable composition according to claim 4 , further comprising a radical initiator. 6. The curable composition according to claim 1 , further comprising a radical initiator. 7. The curable composition of claim 1 , wherein a mass ratio of component (A) to component (B) ((A)/(B)) is from 5:95 to 50:50. 8. The curable composition of claim 1 , wherein a mass ratio of component (A) to component (B) ((A)/(B)) is from 5:95 to 30:70. 9. A cured product obtained by curing the curable composition according to claim 1 . 10. A curing method comprising curing the curable composition according to claim 1 with an active energy ray.
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