Application method

Patent metadata

Field	Value
Publication number	US-11033929-B2
Application number	US-201715807643-A
Country	US
Kind code	B2
Filing date	Nov 9, 2017
Priority date	Nov 15, 2016
Publication date	Jun 15, 2021
Grant date	Jun 15, 2021

Abstract

For a substrate having a diameter of 300 millimeters and a main surface on which a lot of pattern elements standing upright are formed, a processing using a processing liquid is performed on the main surface. After the processing using the processing liquid, a filler solution is applied onto the main surface. In the application process of the filler solution, pure water is supplied onto the main surface which faces upward while the substrate is in a horizontal state, and a liquid film of the pure water which covers the main surface and has a thickness not larger than 5 micrometers is formed by rotating the substrate. Then, the filler solution containing a water-soluble filler is supplied onto a center portion of the main surface while the substrate is rotated at the number of rotation not smaller than 300 times and not larger than 500 times per minute.

First claim

The invention claimed is:

1. An application method of applying a filler solution onto a main surface of a substrate on which a pattern is formed after performing a processing on said main surface by using a processing liquid, while suppressing occurrence of a spike failure and an outer periphery film thickness failure, comprising:
a) supplying pure water onto a main surface of a substrate, which faces upward while said substrate is in a horizontal state, on which a lot of pattern elements standing upright are formed, and forming a liquid film of pure water, which covers said main surface and has a thickness not larger than 5 micrometers, by rotating said substrate, the thickness of said liquid film of pure water being larger than a height of said pattern elements on said main surface;
b) suppressing occurrence of a spike failure and an outer periphery film thickness failure by supplying a filler solution containing a water-soluble filler onto a center portion of said main surface while rotating said substrate having a diameter of 300 millimeters at the number of rotation not smaller than 300 times and not larger than 500 times per minute, said water-soluble filler containing water-soluble polymer;
c) performing a first spinning-off process where the rotation of said substrate continues after the supply of said filler solution is completed, to remove superfluous filler solution on said main surface;
d) performing a filling process where a liquid film of said filler solution is kept on said main surface in a state of stopping the supply of said filler solution, so that said filler fills clearances between said pattern elements; and
e) performing a second spinning-off process where a thickness of said liquid film of said filler solution is reduced while said liquid film of said filler solution covering said main surface is kept after said filling process is completed, wherein
the number of rotation of said substrate in said filling process is smaller than those in said first spinning-off process and said second spinning-off process,
said filler solution has a viscosity not higher than 3.0 centipoises and not lower than 2.6 centipoises, and
said filler solution is supplied onto said main surface at a flow rate not lower than 2 cubic centimeters and not higher than 3 cubic centimeters per second in said operation b).

2. The application method according to claim 1 , wherein said water-soluble polymer is an acrylic resin.

3. The application method according to claim 1 , wherein
said operation a) comprises a 1 ) keeping a liquid film of pure water entirely covering said main surface, and
after said operation a 1 ), said substrate is rotated at the number of rotation larger than the number of rotation in said operation a 1 ), so that said liquid film of pure water having the thickness not larger than 5 micrometers and not smaller than 2 micrometers is formed.

4. An application method of applying a filler solution onto a main surface of a substrate on which a pattern is formed after performing a processing on said main surface by using a processing liquid, while suppressing occurrence of a spike failure and an outer periphery film thickness failure, comprising:
a) supplying pure water onto a main surface of a substrate, which faces upward while said substrate is in a horizontal state, on which a lot of pattern elements standing upright are formed;
b) forming a liquid film of pure water, which covers said main surface and has a thickness not larger than 5 micrometers, by rotating said substrate while stopping supply of pure water;
c) suppressing occurrence of a spike failure and an outer periphery film thickness failure by supplying a filler solution containing a water-soluble filler onto a center portion of said main surface while rotating said substrate having a diameter of 300 millimeters at the number of rotation not smaller than 300 times and not larger than 500 times per minute, said water-soluble filler containing water-soluble polymer;
d) performing a first spinning-off process where the rotation of said substrate continues after the supply of said filler solution is completed, to remove superfluous filler solution on said main surface;
e) performing a filling process where a liquid film of said filler solution is kept on said main surface in a state of stopping the supply of said filler solution, so that said filler fills clearances between said pattern elements; and
f) performing a second spinning-off process where a thickness of said liquid film of said filler solution is reduced while said liquid film of said filler solution covering said main surface is kept after said filling process is completed, wherein
the number of rotation of said substrate in said filling process is smaller than those in said first spinning-off process and said second spinning-off process,
said filler solution has a viscosity not higher than 3.0 centipoises and not lower than 2.6 centipoises, and
said filler solution is supplied onto said main surface at a flow rate not lower than 2 cubic centimeters and not higher than 3 cubic centimeters per second in said operation c).

5. The application method according to claim 4 , wherein
in said operation b), the thickness of said liquid film of pure water is reduced while said liquid film of pure water entirely covering said main surface is kept.

6. The application method according to claim 4 , wherein
in said operation c), pure water is supplied onto a lower surface of said substrate.

7. The application method according to claim 4 , wherein said water-soluble polymer is an acrylic resin.

8. The application method according to claim 4 , wherein
said operation a) comprises a 1 ) keeping a liquid film of pure water entirely covering said main surface, and
in said operation b), said substrate is rotated at the number of rotation larger than the number of rotation in said operation a 1 ), so that said liquid film of pure water having the thickness not larger than 5 micrometers and not smaller than 2 micrometers is formed.

Assignees

• Screen Holdings Co Ltd

Inventors

• Fujiwara Naozumi

Classifications

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0404

  for general liquid treatment, e.g. etching followed by cleaning · CPC title

• H10P70/20

  Cleaning during device manufacture · CPC title

• B08B3/08

  the liquid having chemical or dissolving effect · CPC title

• B05D1/005 Primary

  Spin coating · CPC title