Cleaning agent composition for substrate for semiconductor device

Patent metadata

Field	Value
Publication number	US-11028343-B2
Application number	US-201716474918-A
Country	US
Kind code	B2
Filing date	Dec 22, 2017
Priority date	Dec 28, 2016
Publication date	Jun 8, 2021
Grant date	Jun 8, 2021

Abstract

In one aspect, provided is a cleaning agent composition for a substrate for a semiconductor device, the cleaning agent composition having excellent cleaning properties against ceria and being capable of reducing a temporal change in the solubility of ceria.In one aspect, the present disclosure relates to a cleaning agent composition for a substrate for a semiconductor device, the cleaning agent composition containing a component A, a component B, a component C, and a component D,the component A being sulfuric acid;the component B being ascorbic acid;the component C being at least one of thiourea and dithiothreitol andthe component D being water.

First claim

The invention claimed is:

1. A cleaning agent composition for a substrate for a semiconductor device, the cleaning agent composition containing a component A, a component B, a component C, and a component D,
the component A being sulfuric acid;
the component B being ascorbic acid;
the component C being at least one of thiourea and dithiothreitol; and
the component D being water.

2. The cleaning agent composition according to claim 1 ,
wherein a mass ratio BIC of a content of the component B to a content of the component C is 0.05 to 10 inclusive.

3. The cleaning agent composition according to claim 1 or 2 ,
wherein a total content of the component B and the component C at the time of cleaning is 0.001 mass % to 1 mass % inclusive.

4. The cleaning agent composition according to claim 1 ,
wherein a content of the component A at the time of cleaning is 0.005 mass % to 0.5 mass % inclusive.

5. The cleaning agent composition according to claim 1 , further containing
a dispersing agent (a component E).

6. A method for cleaning a substrate for a semiconductor device, the method comprising
a cleaning step of cleaning a substrate to be cleaned, using the cleaning agent composition according to claim 1 ,
wherein the substrate to be cleaned is a substrate that has processed polishing using a polishing liquid composition containing ceria.

7. A method for manufacturing a substrate for a semiconductor device, the method comprising
a cleaning step of cleaning a substrate to be cleaned, using the cleaning agent composition according to claim 1 ,
wherein the substrate to be cleaned is a substrate that has processed polishing using a polishing liquid composition containing ceria.

8. A method for manufacturing a substrate for a semiconductor device, the method comprising:
step 1 of polishing a substrate using a polishing liquid composition containing ceria; and
step 2 of cleaning a substrate that has been polished in the step 1, using the cleaning agent composition according to claim 1 .

Assignees

• Kao Corp

Inventors

• KAYAKUBO Daisuke
• Naganuma Jun

Classifications

• H10P70/00

  Cleaning of wafers, substrates or parts of devices · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• H10P70/237

  the processing being a planarisation of insulating layers · CPC title

• C11D3/042 Primary

  Acids · CPC title

• C11D17/08 Primary

  Liquid soap, {e.g. for dispensers}; capsuled · CPC title