Composition for surface treatment, method for producing the same, surface treatment method using composition for surface treatment, and method for producing semiconductor substrate

Patent metadata

Field	Value
Publication number	US-11028340-B2
Application number	US-201816491349-A
Country	US
Kind code	B2
Filing date	Feb 19, 2018
Priority date	Mar 6, 2017
Publication date	Jun 8, 2021
Grant date	Jun 8, 2021

Abstract

An objective of the present invention is to provide a means for sufficiently removing residues remaining on a surface of a polished object to be polished.A composition for surface treatment containing a polymer compound having at least one ionic functional group selected from the group consisting of a sulfonic acid (salt) group, a phosphoric acid (salt) group, a phosphoric acid (salt) group, and an amino group, and water, in which pH is less than 7, and the polymer compound has a pKa of 3 or less and an ionic functional group density of more than 10%.

First claim

The invention claimed is:

1. A composition for surface treatment comprising:
a polymer compound having at least one ionic functional group selected from the group consisting of a sulfonic acid (salt) group, a phosphoric acid (salt) group, and a phosphonic acid (salt) group; and
water, wherein;
when the ionic functional group is the sulfonic acid salt group, the sulfonic acid salt group is at least one selected from the group consisting of a sulfonic acid alkali metal salt and a sulfonic acid salt of a group bold 2 element;
when the ionic functional group is the phosphoric acid salt group, the phosphoric acid salt group is a phosphoric acid metal salt; and
when the ionic functional group is the phosphonic acid salt group, the phosphonic acid salt group is at least one selected from the group consisting of a phosphonic acid alkali metal salt and a phosphonic acid salt of a group 2 element,
a pH of the composition is less than 7, and
the polymer compound has a pKa of 3 or less and an ionic functional group density of more than 10%, wherein the ionic functional group density is represented by the following formula (1):
Ionic functional group density (%)=100×(Number of constituent unit derived from monomer having ionic functional group/Number of constituent unit derived from all monomers constituting polymer compound)  Formula (1).

2. The composition for surface treatment according to claim 1 , wherein the polymer compound comprises a copolymer comprising a constituent unit having a sulfonic acid (salt) group and another constituent unit.

3. The composition for surface treatment according to claim 2 , wherein the other constituent unit comprises a constituent unit derived from an ethylenically unsaturated monomer.

4. The composition for surface treatment according to claim 1 , wherein the polymer compound comprises a homopolymer consisting of only a constituent unit having at least one acid functional group selected from the group consisting of a sulfonic acid (salt) group, a phosphoric acid (salt) group, and a phosphonic acid (salt) group.

5. The composition for surface treatment according to claim 1 , wherein the polymer compound comprises a polymer compound having a sulfonic acid (salt) group.

6. The composition for surface treatment according to claim 5 , wherein a polymer compound having the sulfonic acid (salt) group is at least one selected from the group consisting of a sulfonic acid (salt) group-containing polyvinyl alcohol, a sulfonic acid (salt) group-containing polystyrene, a sulfonic acid (salt) group-containing polyvinyl acetate, a sulfonic acid (salt) group-containing polyester, a copolymer of a (meth)acrylic group-containing monomer-a sulfonic acid (salt) group-containing monomer, a sulfonic acid (salt) group-containing polyisoprene, a sulfonic acid (salt)-containing allyl polymer, and salts thereof.

7. The composition for surface treatment according to claim 1 , wherein the content of the polymer compound is 50% by mass or more based on the total mass of the polymer contained in the composition for surface treatment.

8. The composition for surface treatment according to claim 1 , further comprising a wetting agent.

9. The composition for surface treatment according to claim 8 , wherein the wetting agent is at least one selected from the group consisting of a copolymer comprising a constituent unit having at least one ionic functional group selected from the group consisting of a sulfonic acid (salt) group and an amino group, and another constituent unit, and having an ionic functional group density represented by the formula (1) of 10% or less, a copolymer comprising a constituent unit having at least one ionic functional group selected from the group consisting of a sulfonic acid (salt) group and an amino group, and another constituent unit, and having a pKa of more than 3, a copolymer comprising a constituent unit having a carboxylic acid (salt) group and another constituent unit, polyvinyl alcohol, and polyvinyl pyrrolidone.

10. The composition for surface treatment according to claim 1 , wherein a pH value is 1 or more and less than 3.

11. The composition for surface treatment according to claim 1 , which does not substantially comprise abrasive grains.

12. The composition for surface treatment according to claim 1 , which is used to reduce residues on a surface of a polished object to be polished.

13. The composition for surface treatment according to claim 12 , wherein the polished object to be polished comprises at least one selected from the group consisting of silicon nitride, silicon oxide and polysilicon.

14. The composition for surface treatment according to claim 12 , wherein the residue is an organic residue.

15. A surface treatment method, comprising surface treating a polished object to be polished using the composition for surface treatment as defined in claim 1 to reduce organic residues on the surface of the polished object to be polished.

16. The surface treatment method according to claim 15 , wherein the surface treatment is performed by a rinse polishing treatment or a cleaning treatment.

17. A method for producing the composition for surface treatment as defined in claim 1 , comprising mixing the polymer compound and the water.

18. A method for producing a semiconductor substrate, wherein the polished object to be polished is a polished semiconductor substrate, comprising reducing organic residues on a surface of the polished semiconductor substrate, by the surface treatment method as defined in claim 15 .

19. A composition for surface treatment comprising:
a polymer compound having at least one ionic functional group selected from the group consisting of a sulfonic acid (salt) group, a phosphoric acid (salt) group, a phosphonic acid (salt) group, and an amino group;
a wetting agent; and
water, wherein:
a pH of the composition is less than 7, and
the polymer compound has a pKa of 3 or less and an ionic functional group density of more than 10%,
wherein the ionic functional group density is represented by the following formula (1):
Ionic functional group density (%)=100×(Number of constituent unit derived from monomer having ionic functional group/Number of constituent unit derived from all monomers constituting polymer compound)  Formula (1); and

wherein the wetting agent is a copolymer comprising a constituent unit having at least one ionic functional group selected from the group consisting of a sulfonic acid (salt) group and an amino group, and another constituent unit, and having an ionic functional group density represented by the formula (1) of 10% or less.

20. The composition for surface treatment according to claim 19 , wherein the polymer compound has the ionic functional group density of 20% or more and 100% or less.

21. The composition for surface treatment according to claim 19 , wherein the wetting agent has the ionic functional group density of 6% or less.

Assignees

• Fujimi Inc

Inventors

• Ishida Yasuto
• Yoshino Tsutomu
• Onishi Shogo
• Yoshizaki Yukinobu

Classifications

• H10P52/402

  of semiconductor materials · CPC title

• H10P70/20

  Cleaning during device manufacture · CPC title

• H10P70/277

  the processing being a planarisation of conductive layers · CPC title

• H10P70/237

  the processing being a planarisation of insulating layers · CPC title

• C11D1/008 Primary

  Polymeric surface-active agents · CPC title