Electronic device

Patent metadata

Field	Value
Publication number	US-11026348-B2
Application number	US-201916590279-A
Country	US
Kind code	B2
Filing date	Oct 1, 2019
Priority date	Oct 2, 2018
Publication date	Jun 1, 2021
Grant date	Jun 1, 2021

Abstract

Provided is an electronic device including a metal plate that is exposed on at least one of a plurality of side surfaces of the electronic device so as to absorb heat from a heat generating component that generates heat inside the electronic device and guide the heat to an outside of the electronic device. In addition, an outer surface of the metal plate exposed to the outside is formed further inside the electronic device than a first member and a second member.

First claim

What is claimed is:

1. An electronic device comprising:
a heat dissipation member having a thermal conductivity higher than a thermal conductivity of a first member, the first member comprising a front surface of the electronic device and a second member comprising a back surface of the electronic device and located inside the electronic device,
wherein the heat dissipation member is exposed on at least one of a plurality of side surfaces of the electronic device to absorb heat from a heat generating component that generates heat inside the electronic device and guide the heat outside the electronic device, and
wherein in a sectional view traversing the heat dissipation member, the first member, and the second member, the heat dissipation member is between the first member and the second member, and each exposed surface of the heat dissipation member is formed further inside the electronic device than the first member and the second member.

2. The electronic device according to claim 1 , wherein the exposed surface of the heat dissipation member is formed in a concave shape that is recessed toward the inside of the electronic device.

3. The electronic device according to claim 1 , wherein the heat dissipation member is a metal plate.

4. The electronic device according to claim 3 , wherein the metal plate is integrally molded.

5. The electronic device according to claim 1 , wherein a graphite sheet is affixed to the heat dissipation member.

6. The electronic device according to claim 1 , wherein the exposed surface of the heat dissipation member is disposed on a longitudinal side surface of the electronic device.

Assignees

• Sharp Kk

Inventors

• Tanabe Hiroki
• Kuwajima Hidenori

Classifications

• H05K9/0049

  being metallic containers · CPC title

• H04B1/036

  Cooling arrangements · CPC title

• G06F1/1626 Primary

  with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs] · CPC title

• G06F1/1656

  Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203) · CPC title

• H05K7/20436 Primary

  Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing · CPC title