Apparatus and methods for sealing powder holes in additively manufactured parts

US11020800B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11020800-B2
Application numberUS-201815968708-A
CountryUS
Kind codeB2
Filing dateMay 1, 2018
Priority dateMay 1, 2018
Publication dateJun 1, 2021
Grant dateJun 1, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Apparatus and methods for sealing powder holes in additively manufactured parts are presented herein. Powder holes are co-printed to facilitate post processing sealing. Embodiments include co-printed caps, friction welded caps, rivets, silicone plugs, co-printed tangs, multiple micro holes, layup, and spin forming. By using one or more of the above techniques, powder holes can be sealed on additively manufactured parts.

First claim

Opening claim text (preview).

What is claimed is: 1. An apparatus comprising: an exterior structure comprising an inner surface and an external surface; an internal lattice structure coupled to the inner surface and configured to mechanically support the exterior structure; an aperture within the exterior structure, the aperture exposing a portion of the internal lattice structure; and an overlay structure comprising at least one composite material, configured to cover the aperture, wherein the at least one composite material comprises Kevlar. 2. The apparatus of claim 1 , wherein the internal lattice structure is honeycomb. 3. The apparatus of claim 1 , wherein the internal lattice structure is additively manufactured and the aperture is configured for powder removal. 4. The apparatus of claim 1 , wherein the exterior structure is a vehicle panel. 5. The apparatus of claim 1 , wherein the overlay structure is attached to the external surface with an adhesive. 6. The apparatus of claim 1 , wherein the at least one composite material further comprises carbon fiber. 7. An apparatus comprising: an exterior structure comprising an inner surface and an external surface; an internal lattice structure coupled to the inner surface and configured to mechanically support the exterior structure; an aperture within the exterior structure, the aperture exposing a portion of the internal lattice structure; and an overlay structure comprising at least one composite material, the overlay structure configured to cover the aperture, wherein the at least one composite material comprises a prepreg. 8. The apparatus of claim 7 , wherein the internal lattice structure is honeycomb. 9. The apparatus of claim 7 , wherein the internal lattice structure is additively manufactured. 10. The apparatus of claim 7 , wherein the aperture is configured for powder removal. 11. The apparatus of claim 7 , wherein the overlay structure further comprises a lip overlapping the aperture. 12. The apparatus of claim 7 , wherein the at least one composite material further comprises carbon fiber. 13. The apparatus of claim 7 , wherein the exterior structure is a vehicle panel.

Assignees

Inventors

Classifications

  • Cleaning or washing · CPC title

  • Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] · CPC title

  • Post-treatment, e.g. curing, coating or polishing · CPC title

  • B22F3/24Primary

    After-treatment of workpieces or articles {(B22F3/1146 takes precedence)} · CPC title

  • B33Y80/00Primary

    Products made by additive manufacturing · CPC title

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What does patent US11020800B2 cover?
Apparatus and methods for sealing powder holes in additively manufactured parts are presented herein. Powder holes are co-printed to facilitate post processing sealing. Embodiments include co-printed caps, friction welded caps, rivets, silicone plugs, co-printed tangs, multiple micro holes, layup, and spin forming. By using one or more of the above techniques, powder holes can be sealed on addi…
Who is the assignee on this patent?
Divergent Tech Inc
What technology area does this patent fall under?
Primary CPC classification B22F3/24. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jun 01 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).